Mobile Doctor Tool HuB
AMAOE S22 SM-S901U BGA Rebailing
Get 0% cash back
₹4,270
Availability:
In Stock
Condition:
New
Key Features
- Get an Extra 5% Discount on UPI Prepaid Payments
- Wholesaler Earn Money more with Cammission Category Grade-J
- 24 Hours return window policy
- Specialized BGA reballing tool for SM-S901U (Galaxy S22) chips.
- Precision alignment ensures accurate ball placement on the BGA.
- High-quality material offers durability and heat resistance.
- Easy-to-use design suitable for professional technicians and beginners.
Frequently Bought Together
Total: ₹5,063
Add all to Cart
The AMAOE S22 SM-S901U BGA Reballing Tool is a cutting-edge solution tailored for professionals in the electronics repair industry. Designed specifically for BGA (Ball Grid Array) components, this tool ensures precision and efficiency in the reballing process, making it an essential asset for repair technicians working on devices like smartphones, tablets, and laptops.
Key Features:
High Precision Engineering: The AMAOE S22 features advanced engineering that allows for precise alignment and placement of solder balls on BGA components. This level of accuracy is critical for ensuring reliable electrical connections and optimal performance of repaired devices.
Wide Compatibility: Designed for the SM-S901U model, this reballing tool is compatible with a variety of BGA sizes, making it suitable for a range of devices. This versatility enables technicians to handle multiple repair jobs with one reliable tool.
User-Friendly Design: The intuitive design of the AMAOE S22 allows for easy operation, making it accessible for both experienced technicians and those new to reballing. Comprehensive instructions ensure that users can achieve optimal results quickly and efficiently.
Durable Construction: Built with high-quality materials, the S22 is designed to withstand the demands of daily use in a busy repair environment. Its robust construction ensures long-lasting performance and reliability.
Enhanced Efficiency: This reballing tool significantly speeds up the reballing process, allowing technicians to complete jobs more quickly. The increased efficiency leads to faster turnaround times and improved customer satisfaction.
Comprehensive Reballing Kit: The AMAOE S22 SM-S901U comes equipped with everything needed for effective reballing, including a variety of solder balls and templates. This all-in-one kit ensures technicians have all the tools necessary to perform successful repairs.
Cost-Effective Solution: By enabling precise reballing of BGA components, the AMAOE S22 helps technicians minimize repair costs associated with component replacements. It enhances the longevity and reliability of repaired devices.
Elevate your repair capabilities with the AMAOE S22 SM-S901U BGA Reballing Tool—a reliable, efficient, and essential solution for achieving professional-quality reballing results in the dynamic world of electronics repair!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | S22 SM-S901U |
| Seller SKU: | Nikita-772 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 9, 2024 |
AMAOE S22 SM-S901U BGA Reballing Kit Specifications
Product Overview
- Model: AMAOE S22 SM-S901U
- Type: BGA Reballing Kit
- Purpose: Designed for professional BGA (Ball Grid Array) reballing and repair for Samsung Galaxy S22 (Model: SM-S901U) chipsets, providing precise reballing for technicians working on microelectronic repairs.
Key Features
- High Precision Reballing: Crafted specifically for reballing the BGA chips of Samsung Galaxy S22 SM-S901U, ensuring accurate alignment and reballing of the ICs.
- Durable Materials: Made from high-quality stainless steel for long-term use and resistance to heat and corrosion during rework procedures.
- Custom Fit Stencils: Includes precise stencils tailored for the Galaxy S22 SM-S901U, ensuring perfect alignment for BGA rework and reballing tasks.
- Uniform Heat Distribution: Optimized design for even heat distribution, preventing damage to delicate components during the soldering process.
- Multiple BGA Sizes: Supports a variety of BGA chip sizes, making it versatile for different chipsets found within the Galaxy S22 series.
Specifications
- Material: High-grade stainless steel reballing stencils
- Compatibility: Samsung Galaxy S22 (SM-S901U) and compatible BGA chips
- Stencil Thickness: 0.12 mm - 0.15 mm
- Weight: Approximately 150 grams (0.33 lbs)
- Dimensions: Standard size for BGA reballing kits; stencils designed to fit perfectly on SM-S901U chipset
Included Accessories
- Reballing Stencils: Set of stencils compatible with SM-S901U chipset.
- Magnetic Jig/Frame: For secure positioning of the PCB and stencil during the reballing process.
- BGA Balls: A set of lead-free or leaded BGA solder balls for the reballing process.
- Tweezers: Precision tweezers for handling BGA balls and components.
Usage
- Perfect for mobile repair professionals and technicians who need a reliable and accurate solution for reballing Samsung Galaxy S22 SM-S901U components. This kit ensures a precise and efficient rework of damaged or misaligned BGA chips.
No reviews
Related Items
913
Active listings9
Items soldMobile Repair Machine & Equipment Shop: Your go-to destination for all mobile repair tools and equipment. We offer high-quality products, expert advice, and competitive prices. From screen replacement kits to advanced diagnostic tools, we have everything you need. Visit us for reliable solutions!
Mobile Doctor Tool Hub
delhi, Delhi
mobiledoctortoolhub1404@yopmail.com
delhi, Delhi
mobiledoctortoolhub1404@yopmail.com
No reviews
