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AMAOE Stencil DM-11/11P/11PM
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Portable and Lightweight: Compact size makes it an essential addition to any professional repair toolkit.
- Efficient Reballing: Offers optimal stencil patterns for efficient and reliable reballing of integrated circuits.
- Anti-Slip Surface: Designed to stay secure during soldering, ensuring precision and reducing repair errors.
- Versatile Design: Designed for precise soldering on DM-11, DM-11P, and DM-11PM models.
- Durable Construction: Made from high-quality stainless steel for long-lasting performance.
- Precision Cutouts: Features meticulously crafted cutouts for accurate soldering.
- User-Friendly: Simplifies the soldering process, making it accessible for technicians of all skill levels.
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The AMAOE Stencil DM-11/11P/11PM is a premium soldering stencil designed specifically for mobile device repairs, particularly for the latest models in the smartphone market. This advanced stencil is an essential tool for technicians and hobbyists, ensuring accurate solder paste application for effective component placement and repairs.
Key Features:
High-Quality Material
Constructed from durable stainless steel, the DM-11/11P/11PM stencil offers excellent longevity and resistance to wear and tear, making it suitable for high-volume repair environments.Precision Laser-Cut Apertures
Each aperture in the stencil is meticulously laser-cut, ensuring precise alignment with device components. This precision minimizes misalignment risks, resulting in enhanced solder joint quality and reliability.Compatibility with Multiple Models
Specifically designed for use with a variety of mobile devices, the DM-11/11P/11PM stencil supports numerous smartphone models, making it versatile for different repair tasks, including motherboard and chip-level repairs.User-Friendly Design
The lightweight and ergonomic design of the stencil facilitates ease of use, allowing technicians to maneuver it effortlessly during intricate soldering tasks. Its compact size enhances portability, making it easy to transport between workspaces.Enhanced Repair Efficiency
By utilizing the DM-11/11P/11PM stencil, technicians can significantly increase repair efficiency. The precise solder paste application helps create reliable solder connections, improving the overall performance and lifespan of repaired devices.Versatile Solder Paste Compatibility
This stencil is compatible with a range of solder pastes, providing technicians the flexibility to select the optimal paste for their specific repair needs, whether for micro-soldering or larger component placements.
Elevate your mobile device repair capabilities with the AMAOE Stencil DM-11/11P/11PM. This precision tool merges durability, versatility, and user-friendly features, ensuring that you achieve professional-quality results in all your repair projects. Trust this essential stencil to deliver accurate and dependable soldering outcomes every time!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | DM-11/11P/11PM |
| Seller SKU: | Nikita-882 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil DM-11/11P/11PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-11/11P/11PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, with a focus on those compatible with the DM-11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring long-lasting durability.
- Thickness: 0.15 mm, offering a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronics, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-11/11P/11PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
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