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AMAOE Stencil EMMCl (U-UFS1)
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₹159
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹7.95 (5.00%)
Key Features
- Wide Compatibility: Supports EMMC and UFS1 chip reballing, making it versatile for various device repairs.
- Precision Design: Accurately laser-cut apertures ensure precise solder ball placement and alignment during rework.
- Durable Material: Made from high-quality stainless steel for long-lasting performance and resistance to deformation.
- Specialized Design: Tailored for precise soldering of EMMC and UFS memory chips.
- Durable Material: Constructed from high-quality stainless steel for long-lasting use.
- Precision Cutouts: Features meticulously crafted openings for optimal soldering accuracy.
- User-Friendly: Simplifies the soldering process, suitable for technicians of all experience levels.
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The AMAOE Stencil EMMCl (U-UFS1) is a precision-engineered soldering stencil tailored for the intricate demands of UFS (Universal Flash Storage) memory repair. This high-quality stencil is an essential tool for technicians and repair professionals seeking to achieve impeccable solder joint quality and reliability in their electronic repair work.
Key Features:
High-Precision Laser-Cut Design
Crafted using advanced laser-cutting technology, the EMMCl (U-UFS1) stencil features meticulously designed apertures that ensure perfect alignment with UFS memory components. This precision minimizes the risk of misalignment during the soldering process, resulting in superior connections.Durable Stainless Steel Construction
Made from high-quality stainless steel, this stencil is built to withstand the rigors of frequent use. Its robust design ensures durability, allowing it to maintain its shape and functionality over time, making it a reliable addition to any technician's toolkit.Optimized for Solder Paste Application
The EMMCl (U-UFS1) stencil is specifically designed to enhance solder paste application efficiency. The precise aperture sizes facilitate even distribution of solder paste, ensuring consistent and reliable solder connections for UFS memory repairs.User-Friendly and Lightweight
Designed with user convenience in mind, the stencil is lightweight and easy to handle, making it suitable for detailed soldering tasks. Its compact design allows for easy transportation, perfect for technicians working in various locations.Versatile Compatibility
This stencil is compatible with a wide range of UFS memory components, making it an ideal choice for various electronic repair applications. It is suitable for use with different types of solder pastes, ensuring versatility in repair scenarios.Enhanced Repair Quality
With the EMMCl (U-UFS1) stencil, technicians can achieve high-quality repairs with increased efficiency. The reliable design and precision features enable consistent soldering results, essential for maintaining the integrity of UFS memory components.
Elevate your repair capabilities with the AMAOE Stencil EMMCl (U-UFS1). This advanced soldering tool combines precision, durability, and user-friendly features to ensure that you achieve exceptional results in all your UFS memory repair projects. Trust in the EMMCl (U-UFS1) for reliable, professional-grade soldering every time!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | EMMC1 (U-UFS1) |
| Seller SKU: | Nikita-885 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil EMMCl (U-UFS1) Specifications
Product Overview:
- Model: AMAOE Stencil EMMCl (U-UFS1)
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips, focusing on EMMC and UFS (Universal Flash Storage) components used in various electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage for enhanced durability.
- Thickness: 0.15 mm, providing a balance of rigidity and flexibility suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand the high temperatures encountered during the reballing process without warping or degrading, ensuring reliable performance.
- Compatibility: Optimized for EMMC and UFS components, making it an ideal choice for technicians focusing on mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in the reballing of EMMC and UFS chips in mobile devices and other electronics.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC and UFS storage solutions.
The AMAOE Stencil EMMCl (U-UFS1) is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC and UFS components.
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