Mobile Doctor Tool HuB
AMAOE Stencil Mi6
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₹159
Availability:
In Stock
Condition:
New
Key Features
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- 24 Hours return window policy
- Precision stencil for reballing Mi6-series IC chips.
- Ensures accurate alignment for consistent soldering.
- Built with durable, long-lasting materials.
- Compatible with multiple Mi6 chip models for versatile use.
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The AMAOE Stencil Mi6 is an advanced stencil engineered for professionals in electronics repair and PCB assembly. Specifically designed for Mi series components, this essential tool enhances accuracy and efficiency in intricate microelectronic tasks, making it a vital asset for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the Mi6 stencil offers exceptional durability and resistance to wear. This robust construction ensures long-lasting performance, making it suitable for frequent use in demanding professional environments.Precision Laser-Cut Openings
The Mi6 stencil features precisely laser-cut openings that allow for accurate application of solder paste, ensuring perfect alignment for Mi series components. This level of precision is essential for achieving high-quality results in microelectronics repair and assembly.Wide Range of Applications
The Mi6 stencil is versatile enough for various tasks, including component installations, PCB rework, and electronic assembly. Its adaptability makes it an indispensable tool for professionals across multiple technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the Mi6 stencil incorporates an ergonomic shape that facilitates easy handling and alignment. Its intuitive design enables technicians of all skill levels to execute complex tasks efficiently and accurately.Lightweight and Portable
The Mi6 stencil is both lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who require a reliable tool that can be utilized in different locations, ensuring that precision work is always within reach.Compatible with Various Materials
The Mi6 stencil is compatible with a wide array of materials, including solder paste and adhesives, enhancing its usability for diverse repair and assembly processes. This flexibility ensures it meets the needs of various applications in electronics repair.
Elevate your repair capabilities with the AMAOE Stencil Mi6. Combining durability, precision, and user-friendly design, this stencil is the ultimate solution for professionals seeking exceptional results in Mi series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Mi6 |
| Seller SKU: | Nikita-852 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil Mi6 Specifications
Product Overview
- Model: AMAOE Stencil Mi6
- Type: Precision BGA Reballing Stencil
- Purpose: Specially designed for reballing BGA (Ball Grid Array) chips in electronics repair, particularly suited for Mi6 devices and similar components.
- Material: High-quality stainless steel for longevity and resistance to high temperatures.
- Thickness: 0.12MM, providing the right balance between rigidity and flexibility for effective reballing.
- Dimensions: Compact and lightweight for ease of use in repair setups.
- Heat Resistance: Capable of handling high heat required for reballing and soldering processes.
- Compatibility: Perfect for BGA reballing of chips used in Mi6 series devices and similar electronics.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to aid in precise solder ball placement.
- User Guide: Comes with an instruction manual to guide users through the setup and operation of the stencil.
Usage
- Target Audience: Suitable for professional repair technicians and DIY enthusiasts who work on small electronic components, especially those involved in chip-level repairs.
- Application Focus: Best for reballing BGA chips in Mi6 devices, with a high degree of precision and ease of use.
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