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AMAOE Stencil Mi8
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Reusable and Cost-Effective: The stencil can be used multiple times without degradation, providing an economical solution for repair shops and technicians.
- Efficient Repair Process: Helps technicians achieve high-quality repairs quickly by preventing solder bridging and ensuring consistent application of solder paste.
- Ideal for BGA and PCB Repair: Designed for BGA (Ball Grid Array) and PCB (Printed Circuit Board) rework, it allows precise soldering of components, reducing the chance of defects.
- Precision stencil for reballing Mi8-series IC chips.
- Guarantees exact alignment for accurate soldering.
- Compatible with various Mi8 chip models for versatile use.
- Sturdy construction for long-lasting performance.
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The AMAOE Stencil Mi8 is a cutting-edge stencil meticulously crafted for professionals in electronics repair and PCB assembly. Specifically designed for Mi series components, this essential tool enhances both accuracy and efficiency in intricate microelectronic tasks, making it an indispensable asset for technicians and engineers alike.
Key Features:
High-Quality Stainless Steel Construction
Constructed from premium stainless steel, the Mi8 stencil provides exceptional durability and resistance to wear. This robust design ensures long-lasting performance, making it suitable for regular use in demanding environments.Precision Laser-Cut Openings
The Mi8 stencil features meticulously laser-cut openings that facilitate accurate application of solder paste, ensuring perfect alignment for Mi series components. This precision is crucial for achieving high-quality results in microelectronics repair and assembly.Versatile Applications
Suitable for a wide range of tasks, the Mi8 stencil excels in component installations, PCB rework, and electronic assembly. Its adaptability makes it an essential tool for professionals in various technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the Mi8 stencil incorporates an ergonomic shape that promotes easy handling and precise alignment. Its intuitive design enables technicians of all skill levels to execute complex tasks efficiently.Lightweight and Portable
The Mi8 stencil is both lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who require a reliable tool that can be utilized in different locations, ensuring precision work is always at hand.Compatible with Various Materials
The Mi8 stencil is compatible with a wide array of materials, including solder paste and adhesives, enhancing its usability for diverse repair and assembly processes. This flexibility ensures it meets the needs of various applications in electronics repair.
Elevate your repair capabilities with the AMAOE Stencil Mi8. Combining durability, precision, and user-friendly design, this stencil is the ultimate solution for professionals seeking exceptional results in Mi series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Mi8 |
| Seller SKU: | Nikita-854 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil Mi8 Specifications
Product Overview
- Model: AMAOE Stencil Mi8
- Type: Precision BGA Reballing Stencil
- Purpose: Designed specifically for the reballing of BGA (Ball Grid Array) chips in Mi8 devices and compatible electronics.
- Material: High-grade stainless steel, chosen for its durability and thermal resistance.
- Thickness: 0.12MM, ideal for precision work.
- Dimensions: Lightweight and compact, easy to handle and integrate into various repair setups.
- Heat Resistance: Engineered to handle the high temperatures typical of reflow soldering.
- Compatibility: Specifically designed for BGA reballing of chips in Mi8 devices and other similar electronics.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to assist in precise solder ball placement and alignment.
- User Manual: Comes with an instructional guide to facilitate setup and operation, catering to both beginners and experienced technicians.
Usage
- Target Audience: Perfect for professional repair technicians and electronics enthusiasts focusing on chip-level repairs.
- Application Focus: Best suited for the reballing of BGA chips in Mi8 devices, ensuring high accuracy and reliability.
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