AMAOE Stencil OV6 - Precision Reballing Stencil for OV6-Series IC Chips
Mobile Doctor Tool HuB
AMAOE Stencil OV6
₹159
Availability:
In Stock
Condition:
New

Shipping:
Quantity:
1000 in stock
Total:
Will be calculated after you select all properties

Key Features

  • Get an Extra 5% Discount on UPI Prepaid Payments
  • Wholesaler Earn Money more with Cammission Category Grade-J
  • 24 Hours return window policy
  • Precision stencil crafted specifically for reballing OV6-series IC chips.
  • Guarantees accurate alignment for efficient and reliable soldering.
  • Constructed from high-quality, durable materials for long-lasting performance.
  • Compatible with a variety of OV6 chip models for versatile repair options.

The AMAOE Stencil OV6 is expertly engineered for professionals in the electronics repair and PCB assembly industries, specifically designed for use with OV (OmniVision) series components. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an indispensable tool for technicians and engineers.

Key Features:

  • High-Quality Stainless Steel Construction
    Crafted from premium stainless steel, the OV6 stencil is designed to withstand the rigors of daily use while maintaining its structural integrity. This robust construction ensures long-lasting durability, making it a critical component in any professional workspace.

  • Precision Laser-Cut Openings
    The OV6 features meticulously laser-cut openings that facilitate the accurate application of solder paste, ensuring optimal alignment for OV series components. This precision guarantees high-quality results in microelectronics repair and assembly.

  • Versatile Applications
    Ideal for a wide range of tasks, including smartphone camera repairs, PCB rework, and intricate electronic work involving OV components, the OV6 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across various technical fields.

  • Ergonomic and User-Friendly Design
    Designed with user comfort in mind, the OV6 stencil boasts an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and accuracy.

  • Lightweight and Portable
    The OV6 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring precision work is always accessible.

  • Compatible with Various Materials
    This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.

Upgrade your repair capabilities with the AMAOE Stencil OV6. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in OV series applications and microelectronics assembly.


Technical Details

Brand: AMAOE
Model number: OV6
Seller SKU: Nikita-831
Condition: New
Origin: India
Availability: In Stock
Minimum order quantity: 1
Shipping weight: 500.00 g
Date first listed on DP MART : Oct 12, 2024

AMAOE Stencil OV6 Specifications

Product Overview

  • Model: AMAOE OV6 Stencil
  • Type: Precision BGA Reballing Stencil
  • Purpose: The AMAOE Stencil OV6 is specifically designed for reballing BGA (Ball Grid Array) chips in electronic devices, including smartphones and tablets. It facilitates accurate solder ball placement, ensuring the reliability and performance of repaired components.
  • Material: High-grade stainless steel for enhanced durability and performance.
  • Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
  • Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
  • Heat Resistance: Can endure temperatures up to 500°C, supporting high-temperature reballing operations.
  • Compatibility: Tailored for a variety of BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.

Included Accessories

  • Optional Alignment Frame: Some models may include an alignment frame to assist with precise solder ball placement.
  • User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, maximizing performance.

Usage

  • Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.

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