AMAOE Stencil QU3 - Precision Reballing Stencil for QU3-Series IC Chips

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AMAOE Stencil QU3
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₹180
Availability:
In Stock
Condition:
New
Min Quantity Wholesale Prices  
20 ₹140
15 ₹145
10 ₹150
5 ₹160

Shipping:
Quantity:
1000 in stock
Total:
Will be calculated after you select all properties

Affiliate Commission : ₹9.00 (5.00%)


Key Features

  • Wide Compatibility: Ideal for use with various QU3 chips, making it suitable for a range of devices, ensuring flexibility for technicians.
  • Enhanced Performance: Ensures optimal soldering results by delivering the right amount of paste for precise chip placement, reducing the chances of errors.
  • Easy to Clean: The smooth surface of the stencil allows for easy cleaning, preventing paste build-up and ensuring a high-quality repair with every use.
  • Precision stencil designed specifically for reballing QU3-series IC chips.
  • Ensures accurate alignment for reliable soldering and repair work.
  • Crafted from high-quality, durable materials for extended use.
  • Compatible with multiple QU3 chip models for versatile repair options.

The AMAOE Stencil QU3 is an advanced and essential tool specifically designed for professionals in the electronics repair and PCB assembly industries. Tailored for use with QU series components, this high-performance stencil is crucial for achieving accurate applications in intricate microelectronic tasks, making it an invaluable asset for technicians and engineers.

Key Features:

  • High-Quality Stainless Steel Construction
    The QU3 stencil is crafted from premium stainless steel, ensuring exceptional durability and resistance to wear. This robust design allows the stencil to endure the rigors of daily use in professional environments, guaranteeing reliable and long-lasting performance.

  • Precision Laser-Cut Openings
    Equipped with meticulously laser-cut openings, the QU3 stencil enables the precise application of solder paste, ensuring optimal alignment for QU series components. This level of precision is vital for achieving high-quality results in microelectronics repair and assembly.

  • Versatile Applications
    Ideal for a variety of tasks, including component installations, PCB rework, and electronic assembly, the QU3 stencil is highly versatile. Its adaptability makes it an essential tool for professionals working across multiple technical fields.

  • Ergonomic and User-Friendly Design
    Designed with user comfort in mind, the QU3 stencil features an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and accuracy.

  • Lightweight and Portable
    The QU3 stencil is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring that precision work is always accessible.

  • Compatible with Various Materials
    This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.

Elevate your repair capabilities with the AMAOE Stencil QU3. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in QU series applications and microelectronics assembly.


Technical Details

Brand: AMAOE
Model number: QU3
Seller SKU: Nikita-840
Condition: New
Origin: India
Availability: In Stock
Minimum order quantity: 1
Shipping weight: 500.00 g
Date first listed on DP MART : Oct 12, 2024

AMAOE Stencil QU3 Specifications

Product Overview

  • Model: AMAOE Stencil QU3
  • Type: Precision BGA Reballing Stencil
  • Purpose: The AMAOE Stencil QU3 is engineered for reballing BGA (Ball Grid Array) components, ensuring precise solder ball placement necessary for high-quality electronic repairs.
  • Material: High-grade stainless steel, ensuring durability and precision.
  • Thickness: 0.15MM, allowing for precise solder ball application.
  • Dimensions: Compact design for ease of use in various repair scenarios.
  • Heat Resistance: Capable of withstanding temperatures up to 500°C, suitable for demanding soldering conditions.
  • Compatibility: Designed for a broad range of BGA components, catering to the diverse needs of electronic repair technicians.

Included Accessories

  • Optional Alignment Frame: May come with an optional alignment frame for enhanced accuracy in solder ball placement.
  • User Manual: Includes a user manual with instructions for proper usage and maintenance to ensure longevity and optimal performance.

Usage

  • Target Audience: Perfect for electronics repair professionals specializing in BGA reballing. The AMAOE Stencil QU3 is an essential tool for achieving efficient and high-quality repairs.

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