Mobile Doctor Tool HuB
AMAOE Stencil SAM11
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 10 | ₹145 | |
| 15 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Anti-Slip Design: Engineered to stay securely in place during use, minimizing errors and rework.
- Efficient Reballing: Provides clear and precise stencil patterns for quick and accurate IC reballing.
- Multi-IC Compatibility: Supports various chip configurations for versatile repair applications.
- Precision Cut: Designed for accurate alignment in repairs.
- Durable Material: Made from high-quality stainless steel for longevity.
- Compatible Design: Supports a wide range of devices for versatility.
- Easy to Use: Simplifies the soldering process for efficient repairs.
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The AMAOE Stencil SAM11 is a specialized tool crafted for technicians and professionals focused on Samsung device repairs. This stencil provides impeccable precision and durability, ensuring smooth and accurate solder paste application for various Samsung components.
Key Features:
High-Quality Stainless Steel Construction
The SAM11 is made from premium-grade stainless steel, ensuring strength and durability. Its corrosion-resistant properties ensure a long lifespan, even under frequent use, making it a reliable choice for professional repair environments.Laser-Cut Accuracy
Equipped with laser-cut apertures, the SAM11 stencil guarantees precise solder paste placement, even on the smallest components. The precision of these cutouts ensures an error-free repair process, essential for modern Samsung devices with intricate layouts.Designed for Samsung Devices
Specifically tailored for Samsung models, the SAM11 stencil fits a variety of Samsung smartphones and tablets. Its design allows for efficient handling of delicate components such as chips, processors, and logic boards, making it perfect for high-accuracy repairs.Ergonomically Designed
With an easy-to-align design, the SAM11 stencil simplifies the repair process for both seasoned professionals and beginners. Its user-friendly setup and perfect fit ensure quick, accurate solder paste applications, minimizing repair time and effort.Portable and Compact
The SAM11 stencil is lightweight and portable, allowing technicians to easily carry it between different repair sites or within workshops. Its compact size also ensures hassle-free storage and transportation, without compromising its precision capabilities.Multi-Application Compatibility
Designed to work with various types of solder paste and adhesives, the SAM11 stencil is versatile enough to handle multiple repair needs. From micro soldering to component replacements on Samsung logic boards, it’s an essential tool for versatile repair applications.
Upgrade your repair efficiency with the AMAOE Stencil SAM11, engineered for precision, durability, and user-friendly operation. This high-quality stencil ensures professional results, making it a vital addition to any toolkit for Samsung device repairs.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | SAM11 |
| Seller SKU: | Nikita-863 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil SAM11 Specifications
Product Overview:
- Model: AMAOE Stencil SAM11
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips, particularly those used in Samsung devices.
- Weight: Typically around 0.5 kg (verify for specific product details).
Material and Design:
- Material: Premium-grade stainless steel, resistant to corrosion and thermal damage, ensuring durability for extended usage.
- Thickness: 0.15 mm, providing an optimal balance between rigidity and flexibility for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment, enhancing usability in repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures during soldering without warping or degrading, ensuring reliable performance.
- Target Devices: Optimized for a variety of Samsung processors and BGA chips found in Samsung smartphones and tablets, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to aid in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide provided to assist technicians in utilizing the stencil effectively for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil SAM11 is designed to meet the needs of technicians performing BGA reballing, particularly for Samsung devices, providing precision and reliability in their repair processes
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