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AMAOE Stencil SAMSUNG E853SP
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- High-Precision Design: Engineered specifically for Samsung E853SP chip placement, ensuring accurate alignment during soldering.
- Durable Stainless Steel Material: Made from high-quality stainless steel for long-lasting use and resistance to warping under heat.
- Compatibility: Designed to fit seamlessly with Samsung E853SP components, streamlining repair processes.
- Fine-Mesh Apertures: Features precise openings for smooth solder paste application and optimal chip reballing.
- Heat-Resistant Properties: Withstands high-temperature soldering processes without deformation or damage.
- User-Friendly Layout: Easy to use with well-marked guides for efficient and accurate placement.
- Professional Grade: Ideal for technicians and repair professionals handling intricate motherboard repairs.
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Enhance your repair toolkit with the AMAOE Stencil SAMSUNG E8535P, an essential tool for professionals and hobbyists involved in electronics repair. This high-quality stencil is specifically designed to facilitate precise soldering and reworking of the SAMSUNG E8535P, ensuring optimal results in every application.
Key Features:
High-Quality Material
Constructed from durable stainless steel, the AMAOE stencil offers exceptional longevity and resistance to wear. Its robust design ensures that it can withstand repeated use, making it a reliable addition to your repair toolkit.Precision Engineering
The stencil is meticulously crafted to deliver accurate openings that match the specifications of the SAMSUNG E8535P. This precision ensures perfect alignment during soldering, minimizing the risk of errors and enhancing the overall quality of repairs.User-Friendly Design
Lightweight and easy to handle, the AMAOE stencil allows for quick and effortless application. Its intuitive design enables users to achieve professional-grade results, whether they are seasoned technicians or DIY enthusiasts.Versatile Applications
Ideal for various repair tasks, the AMAOE stencil is suitable for soldering BGA components and performing rework on circuit boards. It’s an indispensable tool for anyone working with SAMSUNG devices, ensuring compatibility with a range of models.Enhanced Workflow
By providing precise openings for solder paste application, this stencil streamlines the repair process, allowing for faster and more efficient work. Spend less time on repairs and more time on what you love with this essential tool.Compact and Portable
Its compact design makes the AMAOE stencil easy to store and transport, allowing you to take it wherever your work demands. Keep it handy in your repair kit for quick access during projects.
Elevate your electronics repair experience with the AMAOE Stencil SAMSUNG E8535P. Achieve accuracy, efficiency, and quality in every repair, ensuring your devices function at their best.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Samsung E853SP |
| Seller SKU: | Nikita-898 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil Samsung E853SP Specifications
Product Overview:
- Model: AMAOE Stencil E853SP
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in various Samsung devices, particularly for the E853SP model.
Key Features:
- Premium Stainless Steel Construction: Made from high-quality stainless steel, ensuring durability and resistance to corrosion and thermal damage.
- Laser-Cut Precision: Features laser-cut openings for accurate alignment, ensuring consistent and precise solder ball placement during the reballing process.
- Standard Thickness: Designed with a thickness of 0.15MM, which balances flexibility and robustness for optimal solder ball application.
- High Heat Resistance: Engineered to withstand high temperatures associated with the reballing process, ensuring reliability and longevity.
- Compatibility: Tailored for Samsung E853SP BGA components, making it an excellent choice for technicians focusing on repairs for Samsung devices.
Specifications:
- Material: Premium-grade stainless steel resistant to corrosion and thermal damage for extended usage.
- Thickness: 0.15MM, providing a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment and enhance usability in repair processes.
- Heat Resistance: Capable of withstanding elevated temperatures encountered during soldering without warping or degrading.
- Target Devices: Optimized for Samsung E853SP processors and various BGA chips, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil E853SP is designed to provide technicians with the tools needed for efficient and effective reballing of BGA chips, particularly in Samsung devices.
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