Mobile Doctor Tool HuB
AMAOE Stencil SU1
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₹159
Availability:
In Stock
Condition:
New
Key Features
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- 24 Hours return window policy
- Precision stencil designed for SU1-series IC chip reballing.
- Ensures perfect alignment for precise soldering.
- Built with durable materials for extended use.
- Compatible with various SU1 chip models for versatility.
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The AMAOE Stencil SU1 is a top-tier tool designed to meet the demands of professionals in the electronics repair and assembly industry. Crafted for precise solder paste application on delicate electronic components, the SU1 stencil ensures perfect alignment, making it an essential tool for technicians handling intricate circuit board tasks.
Key Features:
Premium Stainless Steel Material
The SU1 stencil is made from high-grade stainless steel, offering exceptional durability and resistance to wear. Its sturdy construction ensures long-lasting performance, making it ideal for repeated use in high-demand electronics repair.Laser-Cut Precision Openings
With precision laser-cut openings, the SU1 stencil guarantees exact placement of solder paste on small and complex components. This accuracy is vital for ensuring strong solder joints and reliable connections in electronics repairs.Versatile Application
The SU1 stencil is designed to cater to various applications in electronics repair, including rework on motherboards, mobile devices, and other high-density PCBs. Its versatility makes it suitable for use with a wide range of components, from microchips to connectors.Ergonomic and User-Friendly Design
Featuring an ergonomic design, the SU1 stencil is easy to handle and aligns perfectly with components. Its intuitive design makes it suitable for technicians of all skill levels, enabling precise work even in challenging repair scenarios.Compact and Portable
Lightweight and easy to transport, the SU1 stencil is perfect for both in-shop repairs and on-site tasks. Its compact design allows technicians to carry it to various locations without sacrificing precision or reliability.Compatible with Various Materials
The SU1 stencil is compatible with different types of solder pastes and adhesives, ensuring smooth and efficient application in diverse repair and assembly processes. Its flexibility makes it an ideal tool for technicians working on various electronic devices.
Boost your repair efficiency and precision with the AMAOE Stencil SU1. Built for durability and accuracy, this stencil is a must-have for any professional working in electronics repair, ensuring flawless results with every use.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | SU1 |
| Seller SKU: | Nikita-856 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil SU1 Specifications
Product Overview
- Model: AMAOE Stencil SU1
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the reballing of BGA (Ball Grid Array) chips, specifically for certain SoC (System on Chip) and high-performance chips used in smartphones and other electronics.
- Material: Premium stainless steel for long-lasting performance and corrosion resistance.
- Thickness: 0.12MM, perfect for reballing applications requiring precision.
- Dimensions: Compact design for easy handling, suitable for most standard reballing setups.
- Heat Resistance: Engineered to withstand the elevated temperatures involved in the soldering and reflow process.
- Compatibility: Compatible with a variety of System on Chips (SoC) used in modern mobile devices, making it ideal for smartphone repair.
Included Components
- Optional Holder: An alignment holder can be included to assist with proper placement during the reballing process.
- Instruction Manual: Comes with a user guide for easy setup and use, catering to both professionals and those newer to reballing.
Usage
- Target Audience: Repair professionals, technicians, and engineers dealing with smartphone and tablet repairs.
- Applications: Suitable for reballing BGA chips, particularly SoC components in mobile devices, enhancing the efficiency and accuracy of rework.
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