Key Features
- Get an Extra 5% Discount on UPI Prepaid Payments
- Wholesaler Earn Money more with Cammission Category Grade-J
- 24 Hours return window policy
- Precision-designed stencil for SU3-series IC chip reballing.
- Ensures exact alignment for accurate soldering.
- Made with high-quality, durable materials.
- Suitable for a variety of SU3 chip models.
Frequently Bought Together
The AMAOE Stencil SU3 is a professional-grade tool crafted for precision soldering applications in electronics repair. Whether you’re working on fine-pitch components or complex circuit boards, the SU3 stencil ensures accurate solder paste placement, enhancing repair quality and efficiency.
Key Features:
Durable Stainless Steel Construction
The SU3 stencil is manufactured from high-grade stainless steel, offering exceptional durability, corrosion resistance, and heat tolerance. This strong construction ensures longevity and consistent performance, even after repeated use in demanding environments.Precision Laser-Cut Design
The stencil's laser-cut openings ensure precise alignment and application of solder paste on even the smallest components. This accuracy minimizes the risk of soldering errors, making it an essential tool for technicians working with intricate electronics like smartphones, tablets, and other devices.Wide Compatibility
Designed to handle various components, the SU3 stencil is compatible with a range of solder pastes, adhesives, and electronic parts, including microchips and integrated circuits. Its versatility makes it suitable for both large and small-scale electronic repair projects.Ergonomic and User-Friendly
The SU3 stencil is easy to handle and operate, with an ergonomic design that simplifies alignment and application. Its user-friendly design caters to both experienced technicians and beginners, ensuring smooth and precise use in any repair setting.Compact and Portable
Lightweight and easy to transport, the SU3 stencil is ideal for technicians who require flexibility in their work environment. Its compact size allows for convenient on-site repairs as well as use in dedicated repair shops, without sacrificing accuracy.Perfect for High-Density PCBs
Specifically engineered for high-density printed circuit boards (PCBs), the SU3 stencil ensures accurate solder paste deposition in areas with tightly packed components, helping to reduce errors and improve overall repair outcomes.
Achieve optimal precision in your electronics repairs with the AMAOE Stencil SU3. Designed for professional use, its high-quality construction and precision make it the ideal tool for tackling intricate soldering tasks with confidence and accuracy.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | SU3 |
| Seller SKU: | Nikita-858 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil SU3 Specifications
Product Overview
- Model: AMAOE Stencil SU3
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips in high-performance processors, SoCs, and IC components used in modern electronic devices such as smartphones, tablets, and other gadgets.
- Material: Premium stainless steel, ensuring maximum durability and resistance to heat and corrosion.
- Thickness: 0.12MM, offering perfect balance for maintaining flexibility and structural integrity.
- Dimensions: Compact size, compatible with standard reballing stations, providing ease of use in different work environments.
- Heat Resistance: Can withstand high heat during reballing operations, maintaining consistent quality.
- Compatibility: Specifically designed for popular BGA chips used in smartphones, tablets, and other electronic devices, making it a great tool for professionals in the repair industry.
Included Components
- Stencil Holder (Optional): An optional alignment holder may be included for easier and more accurate positioning of the stencil.
- Instruction Manual: Includes a user-friendly manual to help technicians quickly get started with the reballing process.
Usage
- Target Audience: Professional electronics repair technicians and engineers focusing on smartphone, tablet, and consumer electronics repair.
- Applications: Ideal for reballing BGA chips, SoCs, and other key components in mobile devices and consumer electronics, ensuring high-quality and reliable repairs.
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