Key Features
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- 24 Hours return window policy
- High-precision stencil tailored for efficient IC chip reballing.
- Compatible with various MediaTek IC chip models for versatile use.
- Made from durable materials for long-lasting performance.
- Ensures accurate alignment for professional soldering tasks.
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Introducing the AMAOE Stencil U-MTK1, a top-of-the-line stencil designed for professionals, hobbyists, and artists seeking outstanding accuracy and flexibility in their projects. This premium stencil is ideal for a variety of applications, from electronics assembly to intricate crafting, ensuring you achieve exceptional results every time.
Key Features:
High-Quality Material
The U-MTK1 stencil is made from durable, high-grade materials that guarantee long-lasting performance and reliability. Its robust design withstands repeated use without losing precision, making it an essential tool for any creative workspace.Precision-Cut Design
Featuring meticulously crafted cutouts, the U-MTK1 stencil allows for clean and accurate applications. This precision is perfect for detailed patterns and designs, enabling you to create professional-quality results effortlessly.Versatile Applications
Whether you're working on PCB designs, electronics repairs, or artistic projects, the AMAOE Stencil U-MTK1 is your go-to solution. Its versatility makes it suitable for a broad range of tasks, accommodating various techniques and styles.User-Friendly Experience
Designed with user comfort in mind, the U-MTK1 stencil allows for straightforward alignment and application. Simply position the stencil on your desired surface, and you’re ready to create stunning designs with minimal effort.Lightweight and Portable
The compact and lightweight design of the AMAOE Stencil U-MTK1 makes it easy to transport, ensuring you can take your creativity on the go. Perfect for both studio work and remote projects, this stencil is conveniently portable.Compatibility with Multiple Mediums
The U-MTK1 stencil works effectively with a variety of mediums, including paints, inks, and adhesives, providing you with the flexibility to explore different finishes and effects in your projects.
Unlock new possibilities in your crafting and technical projects with the AMAOE Stencil U-MTK1. Combining precision, durability, and versatility, this stencil is an essential tool for achieving exceptional results in all your creative and technical endeavors!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-MTK1 |
| Seller SKU: | Nikita-803 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-MTK1 Specifications
Product Overview
- Model: AMAOE U-MTK1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK1 is specifically designed for BGA (Ball Grid Array) reballing tasks, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, guaranteeing high-quality repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for superior durability and thermal stability
- Thickness: 0.15MM, ensuring precision in solder ball placement and reballing processes
- Dimensions: Compact design facilitates easy handling and use in confined electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Accommodates various BGA chip sizes, ensuring usability across a range of electronic repair tasks
Included Accessories
- Optional Alignment Frame: Some packages may come with a support frame to assist in achieving accurate alignment during reballing.
- User Manual: Includes instructions for proper handling, care, and usage to ensure optimal performance with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-MTK1 stencil is vital for achieving precise and reliable solder ball placement, guaranteeing high-quality repairs in mobile device servicing and other electronics applications.
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