Mobile Doctor Tool HuB
AMAOE Stencil U-MTK7
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Fine Aperture Design: Features well-crafted apertures for a clean and accurate paste application, promoting better soldering results.
- Improves Repair Speed: Helps speed up the repair process by allowing quick, precise application of solder paste, reducing overall repair time.
- Compact and Easy to Use: Designed for ease of handling in busy repair environments, ideal for both professional technicians and DIY enthusiasts.
- High-precision stencil tailored for reballing MediaTek IC chips.
- Compatible with various MediaTek chip models for versatile applications.
- Made from durable materials, ensuring long-lasting performance.
- Facilitates accurate soldering alignment for professional repair quality.
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The AMAOE Stencil U-MTK7 is expertly engineered for precision microelectronics and PCB repair, offering unparalleled accuracy for professionals and hobbyists. Whether you’re working on intricate repairs or assembling complex circuits, this stencil provides a reliable, high-performance tool that guarantees flawless results every time.
Key Features:
High-Quality Stainless Steel Material
The U-MTK7 stencil is constructed from premium stainless steel, ensuring maximum durability and longevity. Its robust design resists wear, making it suitable for frequent use in challenging technical environments.Ultra-Precise Cutouts
Featuring precision-engineered cutouts, the U-MTK7 stencil enables accurate application of solder paste and other materials, ensuring perfect alignment for microelectronic and PCB repair tasks. It’s ideal for highly detailed and complex projects that demand the highest level of precision.Multi-Application Versatility
Designed for a wide range of technical tasks, the U-MTK7 stencil is perfect for PCB assembly, mobile phone repair, micro-soldering, and other electronics repair applications. Its versatility makes it a valuable tool in the arsenal of both professional technicians and skilled hobbyists.User-Friendly Design
The U-MTK7 stencil offers an ergonomic and easy-to-use design, providing smooth operation and error-free alignment. Whether you are an experienced technician or a beginner, this stencil ensures professional-grade results with minimal effort.Portable and Compact
The lightweight, compact design of the U-MTK7 stencil makes it easy to transport and store. Whether you’re working in the lab or on-site, this stencil’s portability ensures that precision is always within reach, allowing you to tackle projects wherever they arise.Compatible with a Variety of Materials
The U-MTK7 stencil is designed to work with various materials, including solder paste, flux, and adhesives. Its compatibility with multiple mediums makes it an indispensable tool for a wide range of electronic repair and assembly applications.
Elevate your precision work with the AMAOE Stencil U-MTK7. Combining superior durability, accuracy, and ease of use, this stencil ensures that you achieve outstanding results in all your microelectronic and PCB repair projects.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-MTK7 |
| Seller SKU: | Nikita-809 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-MTK7 Specifications
Product Overview
- Model: AMAOE U-MTK7
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK7 is engineered for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair specialists. This stencil ensures accurate alignment and precise placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for increased durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a broad range of BGA chip sizes, enhancing usability across diverse electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with achieving accurate alignment during the reballing process.
- User Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK7 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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