Mobile Doctor Tool HuB
AMAOE Stencil U-QSD1
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Enhanced Soldering Accuracy: The stencil design supports optimal paste placement, minimizing the chances of common soldering issues like bridging, poor joints, or insufficient paste.
- Reusable and Easy to Clean: With a reusable design, this stencil can be cleaned and maintained with ease, making it both cost-effective and practical for repeated use.
- Superior Repair Quality: By ensuring an even and controlled paste deposit, the stencil helps achieve high-quality soldering results, enhancing the overall repair and rework process.
- Precision stencil designed for reballing Qualcomm Snapdragon IC chips.
- Compatible with a range of QSD chip models for versatile use.
- Crafted from durable materials for reliable, long-lasting performance.
- Ensures accurate alignment for efficient and professional soldering tasks.
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The AMAOE Stencil U-QSD1 is a top-tier tool crafted for precision work in the fields of microelectronics, PCB assembly, and intricate repair tasks. It is designed to meet the demands of professionals who require extreme accuracy and consistency, ensuring flawless results across a range of applications.
Key Features:
High-Quality Stainless Steel Construction
Made from premium-grade stainless steel, the U-QSD1 stencil is built to last. Its durable structure guarantees longevity and resistance to deformation, allowing for continuous, precise usage in high-intensity technical environments.Precision-Cut Openings
With ultra-precise laser-cut openings, the U-QSD1 stencil ensures accurate application of solder paste and other materials. This level of precision is essential for professionals dealing with detailed circuitry, mobile device repairs, and other intricate microelectronic tasks.Versatility Across Applications
The U-QSD1 stencil is suitable for a variety of technical and repair jobs, including PCB assembly, micro-soldering, and electronic troubleshooting. Its versatility makes it an essential tool for technicians working in diverse fields of electronics repair.Ergonomic Design for Ease of Use
The stencil is designed for smooth operation and effortless alignment, making it user-friendly even for less experienced technicians. Its ergonomic features minimize errors, ensuring a seamless, professional-quality finish every time.Compact and Portable for On-the-Go Work
With its lightweight and compact design, the U-QSD1 stencil is easily transportable, perfect for technicians who need a high-precision tool that can be used in both stationary and mobile work settings.Multi-Material Compatibility
The U-QSD1 is compatible with various materials such as solder paste, flux, and adhesives, offering flexibility for a wide array of electronic and PCB-related tasks. This broad compatibility ensures the stencil meets the needs of different repair processes.
Achieve unparalleled precision and reliability with the AMAOE Stencil U-QSD1. Built to deliver accurate and consistent results, this stencil is an indispensable tool for professionals and enthusiasts working on microelectronics, PCB repairs, and other high-precision technical projects.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD1 |
| Seller SKU: | Nikita-810 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD1 Specifications
Product Overview
- Model: AMAOE U-QSD1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD1 is specifically designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, enhancing usability across multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD1 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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