Mobile Doctor Tool HuB
AMAOE Stencil U-QSD10
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Optimal Thickness for Accuracy: Designed with the ideal thickness for micro soldering tasks, this stencil ensures consistent paste distribution, improving the accuracy and efficiency of repairs and assembly.
- Versatile Compatibility: Compatible with a wide range of devices and components, including small and intricate parts, the stencil is perfect for various micro-soldering, reballing, and repair applications.
- Easy Paste Removal: The smooth surface of the stencil makes it easier to remove excess solder paste without build-up, preventing clogging and ensuring a clean and efficient working process.
- Precision stencil engineered for efficient reballing of Qualcomm Snapdragon IC chips.
- Compatible with a variety of QSD chip models for versatile usage.
- Made from high-quality, durable materials for extended lifespan.
- Facilitates accurate soldering alignment for professional repair quality.
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The AMAOE Stencil U-QSD10 is expertly designed for professionals in the electronics repair and PCB assembly industries, providing unmatched accuracy and reliability. This high-quality stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an indispensable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the U-QSD10 stencil is built to withstand the rigors of daily use while maintaining its structural integrity. Its robust construction ensures longevity, making it a crucial tool for professional environments.Precision Laser-Cut Openings
The U-QSD10 features finely laser-cut openings that allow for the accurate application of solder paste, adhesives, and flux. This level of precision is essential for achieving optimal alignment and quality in PCB assembly and microelectronics repair.Versatile for Various Applications
Ideal for a wide range of tasks, including smartphone repairs, PCB rework, and other detailed electronic work, the U-QSD10 stencil is highly versatile. Its adaptability makes it a valuable tool for professionals across diverse technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the U-QSD10 stencil features an ergonomic shape that simplifies handling and precise alignment. Its intuitive design allows technicians of all skill levels to perform complex tasks with ease and minimal errors.Lightweight and Portable
The U-QSD10 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who need a reliable tool that can be used in various locations, ensuring that precision work is always within reach.Compatible with a Range of Materials
This stencil is compatible with various materials, including solder paste, flux, and adhesives, making it suitable for a wide array of repair and assembly processes. This flexibility enhances its usability for multiple applications in electronics repair.
Elevate your precision in repair tasks with the AMAOE Stencil U-QSD10. Combining durability, accuracy, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD10 |
| Seller SKU: | Nikita-819 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD10 Specifications
Product Overview
- Model: AMAOE U-QSD10
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD10 is designed for BGA (Ball Grid Array) reballing applications. This stencil is essential for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, thereby facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD10 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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