Key Features
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- High-precision stencil designed for reballing Qualcomm Snapdragon IC chips.
- Compatible with a variety of QSD chip models for versatile applications.
- Constructed from durable materials to ensure long-lasting performance.
- \Facilitates accurate soldering alignment for efficient, professional repairs.
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The AMAOE Stencil U-QSD3 is a high-performance tool designed for professionals in the electronics repair industry who require extreme accuracy and reliability in their work. From micro-soldering to PCB assembly, this stencil offers the precision and versatility needed to tackle even the most complex repair tasks.
Key Features:
High-Grade Stainless Steel Construction
Built from premium stainless steel, the U-QSD3 stencil is crafted to endure heavy use while maintaining its structural integrity. Its robust build ensures resistance to wear and deformation, making it a long-lasting tool for any technician’s toolkit.Laser-Cut Precision
The U-QSD3 features ultra-precise laser-cut openings, providing flawless alignment for solder paste application and other materials. This level of precision is critical for intricate electronic components, ensuring optimal accuracy in every repair or assembly task.Versatile for Multiple Applications
Whether you're working on PCB assembly, smartphone repairs, or other fine electronic repairs, the U-QSD3 stencil is highly adaptable to a wide variety of tasks. Its versatility makes it suitable for professionals in fields such as telecommunications, electronics manufacturing, and repair services.Ergonomic and Easy to Use
Designed with the user in mind, the U-QSD3 stencil is intuitive and easy to handle, ensuring efficient operation with minimal errors. The ergonomic design allows for smooth application, making it a great choice for both seasoned professionals and beginners alike.Compact and Portable Design
The lightweight and compact nature of the U-QSD3 stencil makes it easy to transport and store, ensuring that you can take it wherever your work takes you. Whether in the workshop or on-site, it provides flexibility and convenience for any setting.Compatible with Various Materials
The U-QSD3 is designed to be compatible with multiple materials, including solder paste, adhesives, and flux, making it a flexible tool for a range of electronic repair and assembly processes. This adaptability ensures it meets the needs of various technical applications.
Enhance your precision repair work with the AMAOE Stencil U-QSD3. Built for durability, accuracy, and ease of use, it’s the perfect solution for professionals seeking high-quality results in all their microelectronic and PCB-related projects.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD3 |
| Seller SKU: | Nikita-812 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD3 Specifications
Product Overview
- Model: AMAOE U-QSD3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD3 is engineered for BGA (Ball Grid Array) reballing applications. This tool is essential for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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