Key Features
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- 24 Hours return window policy
- High-precision stencil specifically crafted for reballing Qualcomm Snapdragon IC chips.
- Compatible with multiple QSD chip models for versatile applications.
- Constructed from durable materials for extended longevity and reliability.
- Facilitates accurate soldering alignment, ensuring efficient and professional repairs.
Frequently Bought Together
The AMAOE Stencil U-QSD5 is crafted for professionals in the field of electronics repair and PCB assembly, offering outstanding accuracy and durability. Designed for precision work on intricate electronic components, this stencil ensures consistent, high-quality results, making it a top choice for technicians and engineers.
Key Features:
Durable Stainless Steel Construction
Built from high-quality stainless steel, the U-QSD5 stencil is designed to withstand the rigors of daily use while maintaining its integrity. Its robust construction ensures long-lasting durability, making it an essential tool for professional environments.Precision Laser-Cut Openings
The U-QSD5 stencil features meticulously laser-cut openings, allowing for the precise application of solder paste, flux, and adhesives. This ensures clean and accurate alignment, which is critical for successful microelectronic repairs and PCB assembly.Versatile for Multiple Repair Tasks
Suitable for a wide range of applications, including mobile phone repair, PCB rework, and other delicate electronic work, the U-QSD5 stencil offers great versatility. Its adaptability makes it a valuable asset for professionals working across various technical fields.Ergonomic and Easy-to-Use Design
The U-QSD5 stencil is designed with the user in mind, providing an ergonomic shape that simplifies the alignment process. Its ease of use ensures that even complex repairs can be carried out with minimal errors, offering both professionals and beginners a reliable tool.Compact and Lightweight for Portability
With a lightweight and compact design, the U-QSD5 stencil is easy to carry and store, making it ideal for technicians who need a mobile tool for their on-the-go repair tasks. Its portability ensures that precision is always within reach, no matter where the job takes you.Compatible with a Range of Materials
The U-QSD5 stencil is compatible with a variety of materials such as solder paste, adhesives, and flux, allowing it to be used in different repair processes. This flexibility makes it suitable for a wide range of electronics assembly and repair applications.
Achieve professional-level precision in your repair tasks with the AMAOE Stencil U-QSD5. Built for accuracy, durability, and ease of use, this stencil is the perfect solution for technicians and engineers who need reliable tools for advanced microelectronics and PCB work.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD5 |
| Seller SKU: | Nikita-814 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD5 Specifications
Product Overview
- Model: AMAOE U-QSD5
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD5 is expertly designed for BGA (Ball Grid Array) reballing applications. This stencil is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for diverse BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Offers essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD5 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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