Mobile Doctor Tool HuB
AMAOE Stencil U-QSD7
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Fine Aperture Design: Features finely-tuned apertures for precise solder paste deposition, ensuring clean and efficient reflow soldering.
- Reusable and Cost-Effective: Designed for multiple uses, helping to reduce costs over time while maintaining high-quality results.
- Ideal for Mobile Repairs: Perfect for technicians working on mobile devices and small electronic components, particularly with U-QSD7 parts.
- Precision stencil engineered for reballing Qualcomm Snapdragon IC chips.
- Compatible with multiple QSD chip models for versatile applications.
- Constructed from high-quality, durable materials for reliable use.
- Facilitates accurate soldering alignment for professional repair efficiency.
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The AMAOE Stencil U-QSD7 is meticulously designed for professionals in the electronics repair and PCB assembly sectors, delivering exceptional accuracy and reliability. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it a vital tool for technicians and engineers.
Key Features:
Premium Stainless Steel Construction
Crafted from high-grade stainless steel, the U-QSD7 stencil is built to endure the rigors of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it an indispensable tool in any professional setting.Laser-Cut Precision Openings
The U-QSD7 features finely laser-cut openings that facilitate the precise application of solder paste, adhesives, and flux. This meticulous design ensures optimal alignment and high-quality results in PCB assembly and microelectronics repair.Versatile for Multiple Applications
Perfect for a variety of tasks, including smartphone repairs, PCB rework, and detailed electronic work, the U-QSD7 stencil is highly versatile. Its adaptability makes it an invaluable tool for professionals across various technical fields.Ergonomic and User-Friendly Design
The U-QSD7 stencil boasts an ergonomic design that enhances user comfort and simplifies handling. Its intuitive layout allows technicians of all skill levels to achieve complex tasks with minimal effort and high precision.Lightweight and Portable
Designed for mobility, the U-QSD7 is lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who require a reliable tool that can be used in diverse locations, ensuring that precision work is always accessible.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste, flux, and adhesives, enhancing its usability for multiple repair and assembly processes. This versatility makes it suitable for various applications in the electronics sector.
Enhance your repair capabilities with the AMAOE Stencil U-QSD7. Combining durability, precision, and ease of use, this stencil is the perfect solution for professionals seeking outstanding results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD7 |
| Seller SKU: | Nikita-816 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD7 Specifications
Product Overview
- Model: AMAOE U-QSD7
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD7 is expertly designed for BGA (Ball Grid Array) reballing applications. This stencil is an indispensable tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on various chips, thus facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Offers essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD7 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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