Key Features
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- 24 Hours return window policy
- Precision stencil specifically designed for reballing Qualcomm Snapdragon IC chips.
- Compatible with a wide range of QSD chip models for versatility.
- Crafted from high-quality, durable materials for enhanced longevity.
- Ensures accurate soldering alignment, facilitating efficient professional repairs.
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The AMAOE Stencil U-QSD9 is meticulously crafted for professionals in the electronics repair and PCB assembly industries, delivering exceptional accuracy and reliability. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Made from premium stainless steel, the U-QSD9 stencil is designed to endure the rigors of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a key component in any professional setting.Precision Laser-Cut Openings
The U-QSD9 features finely laser-cut openings that facilitate the precise application of solder paste, adhesives, and flux. This meticulous design ensures optimal alignment and high-quality results in PCB assembly and microelectronics repair.Versatile Applications
Perfect for a variety of tasks, including smartphone repairs, PCB rework, and detailed electronic work, the U-QSD9 stencil is highly versatile. Its adaptability makes it an invaluable tool for professionals across various technical fields.Ergonomic and User-Friendly Design
The U-QSD9 stencil boasts an ergonomic design that enhances user comfort and simplifies handling. Its intuitive layout allows technicians of all skill levels to achieve complex tasks with minimal effort and high precision.Lightweight and Portable
Designed for mobility, the U-QSD9 is lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who require a reliable tool that can be used in diverse locations, ensuring that precision work is always accessible.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste, flux, and adhesives, enhancing its usability for multiple repair and assembly processes. This versatility makes it suitable for various applications in the electronics sector.
Enhance your repair capabilities with the AMAOE Stencil U-QSD9. Combining durability, precision, and ease of use, this stencil is the perfect solution for professionals seeking outstanding results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD9 |
| Seller SKU: | Nikita-818 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD9 Specifications
Product Overview
- Model: AMAOE U-QSD9
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD9 is engineered for BGA (Ball Grid Array) reballing applications. This high-performance stencil is essential for electronics repair technicians, enabling precise alignment and accurate placement of solder balls on various chips, thus ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD9 stencil is vital for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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