Mobile Doctor Tool HuB
AMAOE Stencil U-QSU2
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Cost-Effective and Reusable: The stencil can be reused multiple times, offering great value for money while maintaining its integrity and soldering performance across numerous applications.
- Compatible with U-QSU2 ICs: Specifically tailored for use with U-QSU2 series integrated circuits, making it an ideal tool for reballing and repair of these components.
- Optimized for Solder Paste Application: Designed to deposit solder paste accurately onto the PCB, the U-QSU2 stencil minimizes paste wastage while enhancing the efficiency and precision of soldering.
- Precision stencil engineered for efficient reballing of Qualcomm Snapdragon U-series IC chips.
- Compatible with a wide range of QSU chip models for versatile usage.
- Crafted from high-quality, durable materials to ensure long-lasting performance.
- Provides accurate soldering alignment, enhancing repair quality and efficiency.
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The AMAOE Stencil U-QSU2 is meticulously engineered for professionals in the electronics repair and PCB assembly sectors, offering unmatched accuracy and reliability. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the U-QSU2 stencil is designed to withstand the demands of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a critical component in any professional environment.Precision Laser-Cut Openings
The U-QSU2 features finely laser-cut openings that allow for the accurate application of solder paste, adhesives, and flux. This meticulous design ensures optimal alignment and high-quality results in PCB assembly and microelectronics repair.Versatile Applications
Ideal for a wide range of tasks, including smartphone repairs, PCB rework, and detailed electronic work, the U-QSU2 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across various technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the U-QSU2 stencil features an ergonomic shape that simplifies handling and precise alignment. Its intuitive layout allows technicians of all skill levels to perform complex tasks with ease and minimal errors.Lightweight and Portable
The U-QSU2 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who need a reliable tool that can be used in various locations, ensuring that precision work is always within reach.Compatible with a Range of Materials
This stencil is compatible with various materials, including solder paste, flux, and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.
Enhance your repair capabilities with the AMAOE Stencil U-QSU2. Combining durability, precision, and ease of use, this stencil is the perfect solution for professionals seeking outstanding results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSU2 |
| Seller SKU: | Nikita-822 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSU2 Specifications
Product Overview
- Model: AMAOE U-QSU2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU2 is engineered for BGA (Ball Grid Array) reballing applications, providing essential support for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, guaranteeing reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU2 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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