Key Features
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- 24 Hours return window policy
- Precision stencil designed for efficient reballing of Qualcomm Snapdragon U-series IC chips.
- Compatible with a variety of QSU chip models for versatile applications.
- Made from high-quality, durable materials to ensure long-lasting performance.
- Facilitates accurate soldering alignment, enhancing the efficiency of repairs.
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The AMAOE Stencil U-QSU4 is expertly crafted for professionals in the electronics repair and PCB assembly industries, delivering exceptional accuracy and reliability. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
The U-QSU4 stencil is made from premium stainless steel, designed to withstand the demands of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a critical component in any professional setting.Precision Laser-Cut Openings
Featuring finely laser-cut openings, the U-QSU4 allows for accurate application of solder paste, adhesives, and flux. This meticulous design guarantees optimal alignment and high-quality results in PCB assembly and microelectronics repair.Versatile Applications
Ideal for a wide range of tasks, including smartphone repairs, PCB rework, and detailed electronic work, the U-QSU4 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across various technical fields.Ergonomic and User-Friendly Design
The U-QSU4 stencil is designed with user comfort in mind, featuring an ergonomic shape that simplifies handling and precise alignment. Its intuitive layout allows technicians of all skill levels to perform complex tasks with ease and minimal errors.Lightweight and Portable
The U-QSU4 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who need a reliable tool that can be used in various locations, ensuring that precision work is always within reach.Compatible with a Range of Materials
This stencil is compatible with various materials, including solder paste, flux, and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for a variety of applications in electronics repair.
Enhance your repair capabilities with the AMAOE Stencil U-QSU4. Combining durability, precision, and user-friendly design, this stencil is the perfect solution for professionals seeking outstanding results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSU4 |
| Seller SKU: | Nikita-824 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSU4 Specifications
Product Overview
- Model: AMAOE U-QSU4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU4 is expertly designed for BGA (Ball Grid Array) reballing applications, serving as an essential tool for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU4 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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