AMAOE Stencil U-SMG1 - Precision Stencil for IC Reballing Tasks

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AMAOE Stencil U-SMG1
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₹180
Availability:
In Stock
Condition:
New
Min Quantity Wholesale Prices  
20 ₹140
15 ₹145
10 ₹150
5 ₹160

Shipping:
Quantity:
1000 in stock
Total:
Will be calculated after you select all properties

Affiliate Commission : ₹9.00 (5.00%)


Key Features

  • Reusable for Multiple Projects: Built for repeated use, making it a cost-effective solution for ongoing PCB repair and assembly.
  • Easy Alignment and Handling: User-friendly design simplifies the alignment process, ensuring efficient and accurate application during rework tasks.
  • Uniform Solder Paste Distribution: Guarantees even solder coverage, reducing the risk of soldering defects such as bridging or uneven connections.
  • High-precision stencil designed for efficient IC reballing.
  • Compatible with a variety of surface-mounted IC chips.
  • Durable construction ensures longevity and reliability in repairs.
  • Facilitates accurate soldering for professional-grade results.

Introducing the AMAOE Stencil U-SMG1, a top-tier stencil designed for professionals and enthusiasts who demand accuracy and versatility in their projects. This high-quality stencil is perfect for a wide range of applications, from electronics assembly to creative art, ensuring exceptional results every time.

Key Features:

  • Premium Quality Material
    The U-SMG1 stencil is crafted from durable, high-grade materials that ensure longevity and reliability. Its robust construction allows it to withstand frequent use without losing its precision, making it an ideal choice for both professionals and hobbyists.

  • Precision Cut Design
    Featuring meticulously designed cutouts, the U-SMG1 stencil enables clean and accurate application. This precision makes it perfect for intricate designs, ensuring your projects achieve a professional finish with every use.

  • Versatile Applications
    Whether you’re working on PCB designs, electronics repairs, or creative crafting, the AMAOE Stencil U-SMG1 is your go-to tool. Its versatility makes it suitable for a variety of tasks, accommodating different techniques and styles.

  • User-Friendly Interface
    Designed for ease of use, the U-SMG1 stencil allows for simple alignment and application. Just place the stencil on your desired surface, and you’re ready to create stunning designs without hassle.

  • Compact and Portable
    With its lightweight and compact design, the AMAOE Stencil U-SMG1 is easy to transport. Take your creativity wherever you go, whether you’re working in a studio or at a remote location.

  • Compatible with Multiple Mediums
    This stencil works seamlessly with a variety of mediums, including paints, inks, and adhesives, providing you with the flexibility to explore different finishes and effects in your work.

Transform your projects with the AMAOE Stencil U-SMG1. Combining exceptional precision, durability, and versatility, this stencil is an essential tool for anyone looking to achieve outstanding results in both technical and creative endeavors!


Technical Details

Brand: AMAOE
Model number: U-SMG1
Seller SKU: Nikita-798
Condition: New
Origin: India
Availability: In Stock
Minimum order quantity: 1
Shipping weight: 500.00 g
Date first listed on DP MART : Oct 12, 2024

AMAOE Stencil U-SMG1 Specifications

Product Overview

  • Model: AMAOE U-SMG1
  • Type: High-Precision BGA Reballing Stencil
  • Purpose: The AMAOE Stencil U-SMG1 is designed specifically for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil facilitates precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
  • Material: High-quality stainless steel for long-lasting durability
  • Thickness: 0.12MM, designed for precision in reballing and solder ball placement
  • Dimensions: Compact size, suitable for use in tight spaces typically found in electronic devices
  • Heat Resistance: Up to 500°C, allowing for high-temperature soldering applications
  • Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronic repairs

Included Accessories

  • Support Frame (Optional): Some packages may include a support frame to assist with aligning the stencil accurately during use.
  • Instruction Manual: Provides guidelines for proper usage, maintenance, and care of the stencil to ensure optimal performance.

Usage

  • Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG1 stencil is essential for achieving accurate and reliable results in mobile device repairs and other electronic applications.

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