AMAOE Stencil U-SMG3 - Precision Stencil for IC Chip Reballing

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AMAOE Stencil U-SMG3
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₹180
Availability:
In Stock
Condition:
New
Min Quantity Wholesale Prices  
20 ₹140
15 ₹145
10 ₹150
5 ₹160

Shipping:
Quantity:
1000 in stock
Total:
Will be calculated after you select all properties

Affiliate Commission : ₹9.00 (5.00%)


Key Features

  • Reusable and Cost-Effective: Built to withstand repeated use, reducing long-term costs for PCB assembly and repair.
  • Easy Handling and Alignment: Features a user-friendly design for simple alignment and handling, enhancing the efficiency and accuracy of the rework process.
  • Heat-Resistant Design: Engineered to endure high soldering and reflow temperatures without losing its integrity or precision.
  • High-precision stencil designed for efficient IC chip reballing.
  • Compatible with a wide range of surface-mounted IC chip models.
  • Durable construction for long-lasting performance in repairs.
  • Facilitates accurate soldering for professional-grade results.

Introducing the AMAOE Stencil U-SMG3, a premium stencil designed to meet the needs of professionals, artists, and DIY enthusiasts. This high-quality stencil provides exceptional accuracy and versatility, making it the perfect tool for a variety of applications, from intricate electronics work to creative art projects.

Key Features:

  • Superior Quality Material
    The U-SMG3 stencil is made from durable, high-grade materials that ensure long-lasting performance and reliability. Its robust construction allows for repeated use while maintaining precision, making it an essential tool for any workspace.

  • Precision Cut Design
    With expertly crafted cutouts, the U-SMG3 stencil enables clean and precise applications. This level of detail is perfect for creating intricate patterns and designs, allowing you to achieve professional results with ease.

  • Versatile Applications
    Whether you’re involved in electronics assembly, PCB design, or artistic endeavors, the AMAOE Stencil U-SMG3 is your ideal companion. Its versatility makes it suitable for a wide range of tasks, accommodating various techniques and styles.

  • User-Friendly Experience
    Designed for simplicity, the U-SMG3 stencil allows for effortless alignment and application. Just position the stencil on your desired surface, and you’re ready to create beautiful designs without any hassle.

  • Lightweight and Portable
    The compact design of the AMAOE Stencil U-SMG3 makes it easy to transport, ensuring you can take your creativity on the go. Perfect for both studio work and remote projects, this stencil is conveniently portable.

  • Compatible with Multiple Mediums
    This stencil works effectively with a variety of mediums, including paints, inks, and adhesives, providing you with the flexibility to explore different finishes and effects in your projects.

Transform your creative and technical projects with the AMAOE Stencil U-SMG3. Combining precision, durability, and versatility, this stencil is an essential tool for achieving outstanding results in all your crafting and technical endeavors!


Technical Details

Brand: AMAOE
Model number: U-SM3
Seller SKU: Nikita-800
Condition: New
Origin: India
Availability: In Stock
Minimum order quantity: 1
Shipping weight: 500.00 g
Date first listed on DP MART : Oct 12, 2024

AMAOE Stencil U-SMG3 Specifications

Product Overview

  • Model: AMAOE U-SMG3
  • Type: High-Precision BGA Reballing Stencil
  • Purpose: The AMAOE Stencil U-SMG3 is specifically designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil allows for precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
  • Material: High-quality stainless steel for enhanced durability and heat resistance
  • Thickness: 0.12MM, providing precision in solder ball placement and reballing processes
  • Dimensions: Compact design for ease of handling and use in tight spaces typical of electronic devices
  • Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks
  • Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronics repair applications

Included Accessories

  • Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during reballing.
  • Instruction Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil for optimal performance.

Usage

  • Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.

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