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AMAOE Stencil U-SMG5
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₹159
Availability:
In Stock
Condition:
New
Key Features
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- Precision stencil designed for efficient IC chip reballing tasks.
- Compatible with a variety of surface-mounted IC chip models.
- Durable material ensures long-lasting performance in repairs.
- Facilitates accurate alignment for professional-grade soldering.
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Introducing the AMAOE Stencil U-SMG5, a premier stencil designed for professionals, hobbyists, and artists who demand exceptional accuracy and versatility in their work. This high-quality stencil is ideal for a variety of applications, from electronics assembly to intricate artistic creations, ensuring remarkable results with every use.
Key Features:
Durable Quality Material
The U-SMG5 stencil is constructed from robust, high-grade materials that guarantee long-lasting performance. Its resilient design withstands repeated use, making it a reliable choice for both intricate and everyday projects.Precision-Cut Design
Featuring finely crafted cutouts, the U-SMG5 stencil enables clean and accurate applications. This precision makes it perfect for creating detailed patterns and designs, allowing you to achieve professional-grade results effortlessly.Versatile Applications
Whether you’re engaged in electronics repairs, PCB designs, or artistic endeavors, the AMAOE Stencil U-SMG5 is your versatile companion. Its adaptability makes it suitable for a wide range of tasks, accommodating various techniques and styles.User-Friendly Interface
Designed for ease of use, the U-SMG5 stencil allows for straightforward alignment and application. Simply position the stencil on your desired surface, and you’re ready to create stunning designs with minimal hassle.Compact and Portable
With its lightweight and compact design, the AMAOE Stencil U-SMG5 is easy to transport. Perfect for both studio work and on-the-go projects, this stencil ensures you can take your creativity wherever inspiration strikes.Compatibility with Various Mediums
The U-SMG5 stencil works effectively with a range of mediums, including paints, inks, and adhesives, providing you with the flexibility to explore different finishes and effects in your projects.
Enhance your creative and technical projects with the AMAOE Stencil U-SMG5. Combining precision, durability, and versatility, this stencil is an essential tool for achieving outstanding results in all your crafting and technical endeavors!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-SMG5 |
| Seller SKU: | Nikita-802 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-SMG5 Specifications
Product Overview
- Model: AMAOE U-SMG5
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG5 is designed specifically for BGA (Ball Grid Array) reballing applications. This stencil is a crucial tool for electronics repair professionals, enabling precise alignment and placement of solder balls on various chips, ensuring top-quality repairs on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and heat resistance
- Thickness: 0.12MM, providing precision in solder ball placement and reballing processes
- Dimensions: Compact and practical design for ease of handling in tight spaces typical of electronic devices
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility for a wide array of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Includes guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG5 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and various electronic applications.
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