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SNPB Solder Ball 0.35
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₹244
Availability:
In Stock
Condition:
New
Key Features
- Get an Extra 5% Discount on UPI Prepaid Payments
- Wholesaler Earn Money more with Commission Category Grade-J
- 24 Hours return window policy
- Suitable for both fine-pitch and larger component soldering.
- High-quality flux for optimal flow and strong adhesion.
- High purity ensures consistent performance and durability.
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SnPb Solder Ball 0.35
The SnPb Solder Ball 0.35 is a premium-quality solder ball designed for precision electronic applications. These solder balls are essential for creating reliable and durable connections in Ball Grid Array (BGA) and Chip Scale Package (CSP) components.
Key Features:
Eutectic Composition: Comprising a eutectic alloy of 63% tin (Sn) and 37% lead (Pb), these solder balls offer excellent wettability and solderability, ensuring strong and consistent connections.
Precision Size: With a diameter of 0.35 mm, these solder balls are ideal for fine-pitch applications, providing precise and accurate placement on electronic components.
High Purity: Manufactured using high-purity raw materials, the SnPb Solder Ball 0.35 minimizes impurities, reducing the risk of defects and ensuring high-quality solder joints.
Versatile Application: Suitable for a wide range of electronic devices, including mobile phones, computer motherboards, and other high-density electronic assemblies. These solder balls are perfect for reballing and repairing BGA and CSP components.
Reliable Performance: The eutectic alloy composition ensures a low melting point of 183°C, providing reliable performance in various soldering processes, including reflow soldering and wave soldering.
Durable Connections: The SnPb Solder Ball 0.35 creates durable and robust connections, capable of withstanding thermal and mechanical stresses, ensuring the longevity and reliability of electronic assemblies.
Enhance your electronic repair and assembly projects with the SnPb Solder Ball 0.35, designed to deliver precision, reliability, and high performance in all your soldering applications.
Technical Details
| Brand: | SNPB |
|---|---|
| Model number: | 0.35 |
| Seller SKU: | Nikita-278 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Sep 12, 2024 |
Here are the seller specifications for SNPB Solder Ball 0.35:
Product Name: SNPB Solder Ball 0.35
Brand: SNPB
Model: 0.35 mm
Color: Silver
Material: Sn63/Pb37 (63% Tin, 37% Lead)
Diameter: 0.35 mm
Weight: [Weight in grams]
Compatibility: Suitable for BGA, CSP, and Flip Chip applications
Storage: Store in a cool, dry place away from direct sunlight.
Package Includes:
1 x SNPB Solder Ball 0.35
Highlights:
- Efficient: Enhances solder flow and improves solder joint quality.
- Reliable: Trusted by professionals for consistent performance.
- User-Friendly: Easy to use for both beginners and experienced technicians.
This product is perfect for anyone looking for reliable and high-quality solder balls for their electronic assembly needs.
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delhi, Delhi
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delhi, Delhi
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