Key Features
- Get an Extra 5% Discount on UPI Prepaid Payments
- Wholesaler Earn Money more with Cammission Category Grade-J
- 24 Hours return window policy
- Multi-functional repair tool kit designed for precision work.
- Includes various tools for disassembly, reballing, and soldering.
- Durable, high-quality materials ensure long-lasting performance.
- Compact and organized design for easy portability and storage.
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The Sunshine G-LON SS9601K is a high-performance adhesive solution specifically designed for mobile device repair and assembly. Ideal for professionals and DIY enthusiasts alike, this advanced adhesive ensures strong, reliable bonds for various materials used in smartphones, tablets, and other electronic devices. With its unique formulation, the G-LON SS9601K delivers superior performance and ease of use, making it a staple in any repair toolkit.
Key Features:
Strong Adhesive Bond: The G-LON SS9601K provides a robust and durable bond that effectively adheres to a variety of materials, including glass, metal, plastic, and ceramic. This strength is essential for ensuring the longevity of repairs and assemblies.
Quick-Drying Formula: Designed for efficiency, this adhesive features a fast-curing formula that significantly reduces downtime during repairs. Technicians can complete their work more quickly, leading to enhanced productivity.
Precision Application: The Sunshine G-LON SS9601K comes with an easy-to-use applicator that allows for precise application. This design minimizes mess and waste while ensuring that the adhesive is applied exactly where needed for optimal results.
Versatile Use: Suitable for a wide range of applications, including screen replacements, battery fixes, and component assemblies, this adhesive is versatile enough to meet various repair needs.
Temperature Resistance: The G-LON SS9601K is formulated to withstand temperature fluctuations, ensuring that the adhesive maintains its integrity even in varying environmental conditions. This feature is vital for devices that may be exposed to heat or cold.
Safe and Non-Toxic: This adhesive is formulated to be safe for use in enclosed spaces, with low levels of harmful chemicals. Technicians can use it confidently, knowing it poses minimal risk during application.
Compact and Portable Packaging: The Sunshine G-LON SS9601K is packaged in a compact container, making it easy to store and transport. This convenience ensures that it can be readily available whenever needed for repairs.
Elevate your repair capabilities with the Sunshine G-LON SS9601K—a reliable, efficient, and versatile adhesive solution that enhances the quality and durability of your mobile device repairs, helping you deliver exceptional service to your customers!
Technical Details
| Brand: | Sunshine |
|---|---|
| Model number: | SS9601K |
| Seller SKU: | Nikita-773 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 2500.00 g |
| Date first listed on DP MART : | Oct 9, 2024 |
Sunshine G-LON SS9601K Specifications
Product Overview
- Model: Sunshine G-LON SS9601K
- Type: BGA Rework Station / Multi-functional Soldering Kit
- Purpose: Designed for professional BGA (Ball Grid Array) rework, chip soldering, and desoldering on mobile phones, tablets, and other electronic devices.
Key Features
- Multi-Functionality: Combines a variety of essential tools for soldering, desoldering, and rework, ideal for electronic repair technicians handling complex mobile repairs.
- Precision Temperature Control: Features an adjustable temperature control system to ensure accurate heating for different soldering tasks, preventing component damage.
- Integrated Vacuum Suction Pen: Includes a built-in suction pen for safe and easy handling of small components, ensuring precision during reballing and repair processes.
- High-Quality Heating Elements: Equipped with advanced heating elements for quick and even heating, reducing the risk of damaging sensitive BGA chips.
- Durable Build: Constructed from high-grade materials to withstand continuous use in professional repair environments.
Specifications
- Power Supply: AC 110V-240V, 50/60Hz
- Temperature Range: Adjustable from 100°C to 450°C (212°F to 842°F)
- Weight: Approximately 2.5 kg (5.5 lbs)
- Dimensions: 20 cm x 15 cm x 10 cm (7.87 in x 5.91 in x 3.94 in)
- Suction Pen Capacity: Integrated vacuum for lifting chips and components securely
Included Accessories
- Heating Nozzles: Various nozzles for focused airflow during soldering/desoldering.
- BGA Stencils: Compatible stencils for various chip sizes.
- Soldering Iron & Tips: High-precision soldering iron with interchangeable tips for various repair needs.
- Vacuum Suction Pen: For handling small, delicate components with care.
- Tweezers: Precision tweezers for handling chips and components.
- BGA Reballing Tools: Set of tools for efficient reballing and BGA chip repair.
Usage
- Ideal for professional mobile repair technicians working on BGA rework, soldering, and desoldering tasks, especially in mobile phones, tablets, and similar devices. The integrated suction pen and temperature control make it a versatile tool for delicate electronic repairs.
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