AMAOE Stencil 1+9PRO
Availability: In Stock
₹159
AMAOE Stencil 1+9PRO Specifications
Product Overview:
- Model: AMAOE Stencil 1+9PRO
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in a wide range of electronic devices, catering to both professional and advanced repair technicians.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, resistant to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a balance between rigidity and flexibility suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Suitable for a variety of BGA components, making it an excellent choice for technicians who work across multiple brands and models.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians and electronic repair shops requiring versatile tools for various repairs.
- Applications: Best suited for reballing processors and critical BGA components across different electronic devices, ensuring high-quality and accurate repairs.
The AMAOE Stencil 1+9PRO is designed to provide technicians with a reliable and efficient tool for BGA reballing, suitable for a wide range of electronic device repairs.
- New
AMAOE Stencil IPH12-A14
Availability: In Stock
₹159
AMAOE Stencil IPH12-A14 Specifications
Product Overview:
- Model: AMAOE Stencil IPH12-A14
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 12 series.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage for long-lasting durability.
- Thickness: 0.15 mm, providing a suitable balance of rigidity and flexibility, ideal for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the soldering process without warping or degrading, ensuring reliable performance.
- Compatibility: Tailored for various BGA components used in iPhone models, making it an excellent choice for technicians focusing on Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Apple device repairs, particularly those working on iPhone 12 series models.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH12-A14 is specifically designed to provide technicians with a reliable tool for BGA reballing, tailored for the iPhone 12 series.
- New
AMAOE Stencil IPH13-A15
Availability: In Stock
₹159
AMAOE Stencil IPH13-A15 Specifications
Product Overview:
- Model: AMAOE Stencil IPH13-A15
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 13 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for enhanced durability.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance during reballing.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focused on repairs for the iPhone 13 series and other Apple devices.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH13-A15 is specifically designed to provide technicians with a reliable and efficient tool for BGA reballing tailored to the iPhone 13 series.
- New
AMAOE Stencil IPH14-A16
Availability: In Stock
₹159
AMAOE Stencil IPH14-A16 Specifications
Product Overview:
- Model: AMAOE Stencil IPH14-A16
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 14 series.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for long-lasting durability.
- Thickness: 0.15 mm, which offers a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the soldering process without warping or degrading, ensuring reliable performance throughout reballing.
- Compatibility: Tailored for various BGA components used in iPhone models, making it an excellent choice for technicians focused on Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Apple device repairs, particularly those working on iPhone 14 series models.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH14-A16 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 14 series.
- New
AMAOE Stencil IPH15-A17
Availability: In Stock
₹159
AMAOE Stencil IPH15-A17 Specifications
Product Overview:
- Model: AMAOE Stencil IPH15-A17
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 15 series.
- Weight: Approximately 0.5 kg (verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, which offers excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance during reballing.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focused on repairs for the iPhone 15 series and other Apple devices.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH15-A17 is specifically designed to provide technicians with a reliable and efficient tool for BGA reballing tailored to the iPhone 15 series.
- New
AMAOE Stencil IPH6-A9
Availability: In Stock
₹159
AMAOE Stencil IPH6-A9 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A9
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 9 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage, ensuring durability and longevity.
- Thickness: 0.15 mm, providing a balanced combination of rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring consistent performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an ideal choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 9.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A9 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 9 series.
- New
AMAOE Stencil IPH6-A8
Availability: In Stock
₹159
AMAOE Stencil IPH6-A8 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A8
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 8 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, which provides excellent resistance to corrosion and thermal damage, ensuring long-lasting durability.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design compatible with standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Tailored for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 8.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A8 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 8 series.
- New
AMAOE Stencil IPH6-A10
Availability: In Stock
₹159
AMAOE Stencil IPH6-A10 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A10
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 10 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, offering a good balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures associated with soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A comprehensive guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 10.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A10 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 10 series.
- New
AMAOE Stencil DM-13/13Mini
Availability: In Stock
₹159
AMAOE Stencil DM-13/13Mini Specifications
Product Overview:
- Model: AMAOE Stencil DM-13/13Mini
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in a variety of electronic devices, particularly suited for the DM-13 series and its mini variant.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing an ideal balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-13/13Mini is specifically designed to provide technicians with a reliable tool for BGA reballing in various electronic applications.
- New
AMAOE Stencil IPH6-A11
Availability: In Stock
₹159
AMAOE Stencil IPH6-A11 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A11
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, which offers excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a balanced combination of rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 11.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A11 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 11 series.
- New
AMAOE Stencil DM-11/11P/11PM
Availability: In Stock
₹159
AMAOE Stencil DM-11/11P/11PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-11/11P/11PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, with a focus on those compatible with the DM-11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring long-lasting durability.
- Thickness: 0.15 mm, offering a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronics, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-11/11P/11PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
- New
AMAOE Stencil DM-12/12P/12PM
Availability: In Stock
₹159
AMAOE Stencil DM-12/12P/12PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-12/12P/12PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, specifically tailored for the DM-12 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring durability and long-lasting use.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design intended to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-12/12P/12PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
- New
AMAOE Stencil EMMCl (U-UFS1)
Availability: In Stock
₹159
AMAOE Stencil EMMCl (U-UFS1) Specifications
Product Overview:
- Model: AMAOE Stencil EMMCl (U-UFS1)
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips, focusing on EMMC and UFS (Universal Flash Storage) components used in various electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage for enhanced durability.
- Thickness: 0.15 mm, providing a balance of rigidity and flexibility suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand the high temperatures encountered during the reballing process without warping or degrading, ensuring reliable performance.
- Compatibility: Optimized for EMMC and UFS components, making it an ideal choice for technicians focusing on mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in the reballing of EMMC and UFS chips in mobile devices and other electronics.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC and UFS storage solutions.
The AMAOE Stencil EMMCl (U-UFS1) is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC and UFS components.
- New
AMAOE Stencil EMMC2
Availability: In Stock
₹159
AMAOE Stencil EMMC2 Specifications
Product Overview:
- Model: AMAOE Stencil EMMC2
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing EMMC (Embedded MultiMediaCard) chips used in various electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for long-lasting durability.
- Thickness: 0.15 mm, offering a balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the reballing process without warping or degrading, ensuring reliable performance.
- Compatibility: Optimized for EMMC components, making it an excellent choice for technicians specializing in mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing EMMC chips in various electronic devices.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC storage solutions.
The AMAOE Stencil EMMC2 is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC components.
- New
AMAOE Stencil EMMC3
Availability: In Stock
₹159
AMAOE Stencil EMMC3 Specifications
Product Overview:
- Model: AMAOE Stencil EMMC3
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing EMMC (Embedded MultiMediaCard) chips used in a variety of electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for extended durability.
- Thickness: 0.15 mm, which strikes a balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the reballing process without warping or degrading, ensuring reliable and consistent performance.
- Compatibility: Optimized for EMMC components, making it an ideal choice for technicians focusing on mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in reballing EMMC chips in various electronic devices.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC storage solutions.
The AMAOE Stencil EMMC3 is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC components.
- New
S21 (G991U) MIDDLE LAYER
Availability: In Stock
₹159
Samsung Galaxy S21 (Model G991U) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy S21 (G991U) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: This component serves as a structural support layer within the Samsung Galaxy S21, contributing to the overall stability and protection of internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed to provide durability and rigidity while keeping the device lightweight.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy S21, ensuring proper alignment and functionality with other internal components.
- Weight: Lightweight construction to facilitate ease of installation and maintain the overall device weight within acceptable limits.
Features:
- Thermal Management: Often includes provisions for thermal management to help dissipate heat generated by the device during operation, enhancing overall performance.
- Protection: Acts as a protective layer for sensitive components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy S21 (G991U), ensuring a perfect fit and functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer in place during assembly.
- Instructions: Installation instructions may be provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy S21 devices, ensuring structural integrity and protection for internal components.
The middle layer is a crucial component of the Samsung Galaxy S21, providing essential support and protection for the device's internal architecture.
- New
