Key Features
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- 24 Hours return window policy
- Precision stencil for reballing Mi3-series IC chips.
- Ensures accurate alignment for consistent soldering performance.
- Made with durable materials for long-lasting use and reliability.
- Compatible with a wide range of Mi3 chip models for flexible repair needs.
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The AMAOE Stencil Mi3 is a premium stencil meticulously designed for professionals engaged in electronics repair and PCB assembly. Tailored specifically for Mi series components, this essential tool enables precision in complex microelectronic tasks, making it an indispensable asset for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from top-grade stainless steel, the Mi3 stencil offers exceptional durability and resistance to wear. Its robust design is built to withstand the rigors of daily use in professional settings, ensuring long-lasting reliability and performance.Accurate Laser-Cut Openings
The Mi3 stencil features precisely laser-cut openings that facilitate the accurate application of solder paste, ensuring optimal alignment for Mi series components. This precision is crucial for achieving high-quality results in microelectronics repair and assembly.Versatile Applications
Suitable for a broad range of tasks, including component installations, PCB rework, and electronic assembly, the Mi3 stencil is a versatile tool that meets the needs of professionals across different technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the Mi3 stencil features an ergonomic shape that enhances handling and alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and precision.Lightweight and Portable
The Mi3 stencil is lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who require a dependable tool that can be utilized in various locations, ensuring that precision work is always at hand.Compatible with Multiple Materials
The Mi3 stencil is compatible with a wide variety of materials, including solder paste and adhesives, enhancing its usability for diverse repair and assembly processes. Its flexibility makes it suitable for numerous applications in electronics repair.
Enhance your repair capabilities with the AMAOE Stencil Mi3. Combining durability, precision, and user-friendly design, this stencil is the perfect solution for professionals seeking exceptional results in Mi series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Mi3 |
| Seller SKU: | Nikita-849 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil Mi3 Specifications
Product Overview
- Model: AMAOE Stencil Mi3
- Type: Precision BGA Reballing Stencil
- Purpose: Tailored for accurate reballing of BGA (Ball Grid Array) components, offering precise alignment and reliable results in soldering applications.
- Material: High-quality stainless steel for superior durability and precision.
- Thickness: 0.12MM for accurate and reliable solder ball application.
- Dimensions: Compact design, easy to handle, and transport for use in professional repair settings.
- Heat Resistance: Engineered to withstand high temperatures required during soldering operations.
- Compatibility: Suitable for a variety of BGA chips used in electronics, providing flexibility for repair technicians.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for precise positioning during reballing processes.
- Instruction Manual: Comes with an instructional guide to assist users with setup and optimal usage techniques.
Usage
- Target Audience: Designed for professional electronics repair technicians focused on reballing BGA components in smartphones, tablets, and other electronic devices.
- Ideal Applications: Useful in chip-level repairs requiring high precision, such as fixing motherboards and processors in mobile devices.
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