AMAOE Stencil NAND1 - Precision Reballing Stencil for NAND IC Chips
Mobile Doctor Tool HuB
AMAOE Stencil NAND1
₹159
Availability:
In Stock
Condition:
New

Shipping:
Quantity:
1000 in stock
Total:
Will be calculated after you select all properties

Key Features

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  • 24 Hours return window policy
  • Precision stencil designed for reballing NAND IC chips.
  • Compatible with various NAND chip models for versatile applications.
  • High-quality, durable materials ensure long-lasting performance.
  • Provides accurate soldering alignment for professional repair results.

The AMAOE Stencil NAND1 is expertly designed for professionals in the electronics repair and PCB assembly industries, specifically tailored for applications involving NAND flash memory. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.

Key Features:

  • High-Quality Stainless Steel Construction
    Crafted from premium stainless steel, the NAND1 stencil is built to withstand the rigors of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a critical component in any professional workspace.

  • Precision Laser-Cut Openings
    The NAND1 features finely laser-cut openings that facilitate the accurate application of solder paste and adhesives. This meticulous design guarantees optimal alignment and high-quality results in NAND flash memory assembly and microelectronics repair.

  • Versatile Applications
    Ideal for a variety of tasks, including NAND flash memory repairs, PCB rework, and detailed electronic work, the NAND1 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across diverse technical fields.

  • Ergonomic and User-Friendly Design
    The NAND1 stencil is designed with user comfort in mind, featuring an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and accuracy.

  • Lightweight and Portable
    Designed for mobility, the NAND1 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring that precision work is always accessible.

  • Compatible with Various Materials
    This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.

Enhance your repair capabilities with the AMAOE Stencil NAND1. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in NAND flash memory and microelectronics assembly.


Technical Details

Brand: AMAOE
Model number: NAND1
Seller SKU: Nikita-826
Condition: New
Origin: India
Availability: In Stock
Minimum order quantity: 1
Shipping weight: 500.00 g
Date first listed on DP MART : Oct 12, 2024

AMAOE Stencil NAND1 Specifications

Product Overview

  • Model: AMAOE NAND1 Stencil
  • Type: Precision BGA Reballing Stencil
  • Purpose: The AMAOE Stencil NAND1 is designed for the reballing of NAND chips, crucial in repair and rework tasks for smartphones, tablets, and other devices. It ensures precise alignment and solder ball placement for high-quality repairs, especially for NAND memory chips commonly used in mobile devices.
  • Material: High-grade stainless steel for maximum strength and corrosion resistance.
  • Thickness: 0.12MM, offering precision in handling solder balls and reballing chips.
  • Dimensions: Compact, ideal for use in electronics repair workstations, ensuring easy handling during reballing.
  • Heat Resistance: Withstands temperatures up to 500°C, ideal for high-temperature soldering tasks.
  • Compatibility: Suitable for various NAND memory chips used in mobile devices, including smartphones and tablets.

Included Accessories

  • Optional Alignment Frame: Some packages may include an alignment frame to assist with precise solder ball placement.
  • User Guide: Detailed instructions to ensure proper use and maintenance of the stencil for optimal results.

Usage

  • Best For: Electronics repair professionals specializing in NAND chip reballing and repairs. This stencil is an essential tool for achieving accurate solder ball placement in NAND chips, ensuring high-quality and reliable repairs in mobile devices.

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