Mijing SAM Series
Availability: In Stock
₹976
Mijing SAM Series Specifications
Product Overview
- Model: Mijing SAM Series
- Type: Professional Jig/Fixture for Mobile Device Repair
- Purpose: Designed for securing and holding Samsung mobile phone motherboards and components during soldering, reballing, and repair processes, ensuring precision and stability.
Key Features
- Universal Compatibility: Compatible with a wide range of Samsung smartphones, particularly suited for handling delicate motherboards and IC components.
- Adjustable Clamp Design: The adjustable clamps securely hold various sizes of motherboards, ensuring stability during rework and repair tasks.
- Non-Slip Base: Equipped with a non-slip rubber base that ensures stability on the workbench, preventing the jig from moving during intricate repair tasks.
- High Heat Resistance: Made from heat-resistant materials, allowing safe use with hot air guns, soldering irons, and pre-heaters without deforming or losing grip.
- Ergonomic and Compact: Lightweight and compact design makes it easy to handle and store, while providing the flexibility to maneuver for precise repairs.
Specifications
- Material: High-quality aluminum alloy with heat-resistant properties
- Dimensions: Varies by model within the SAM series, generally around 15 cm x 10 cm x 5 cm (5.91 in x 3.94 in x 1.97 in)
- Weight: Approximately 250 grams (0.55 lbs)
- Color: Silver or Black (depending on the model)
- Adjustability: Compatible with different sizes and shapes of Samsung device motherboards
Included Accessories
- Clamping Tools: Adjustable clamps to securely hold motherboards during repairs.
- Non-Slip Pads: Included for additional stability on work surfaces.
Usage
- Ideal for professional technicians and repair shops specializing in Samsung smartphone repairs. The Mijing SAM Series jig provides secure positioning of motherboards and other delicate components during soldering, reballing, and micro-soldering tasks.
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Mijing SNAPDRAGON
Availability: In Stock
₹610
Mijing SNAPDRAGON Specifications
Product Overview
- Model: Mijing SNAPDRAGON
- Type: Professional CPU Baseband Processor Fixture
- Purpose: Specifically designed for holding and securing Qualcomm Snapdragon CPU basebands and IC chips during the reballing, soldering, and repair processes in mobile device repairs.
Key Features
- Precision Alignment: Ensures accurate positioning of Snapdragon CPUs and basebands, allowing for precise reballing and micro-soldering tasks.
- High Heat Resistance: Constructed from durable, heat-resistant materials, making it suitable for use with hot air guns, preheaters, and soldering irons without deformation.
- Anti-Slip Base: Equipped with a non-slip base to keep the fixture steady during delicate repair processes, preventing any movement that could damage the components.
- Universal Compatibility: Compatible with a wide range of Snapdragon processor models, commonly found in modern smartphones and tablets.
- Ergonomic Design: Lightweight and compact for easy handling, making it suitable for both professional technicians and DIY repair enthusiasts.
Specifications
- Material: High-grade aluminum alloy with heat resistance
- Dimensions: 10 cm x 7 cm x 2 cm (3.94 in x 2.76 in x 0.79 in)
- Weight: Approximately 150 grams (0.33 lbs)
- Color: Metallic Silver or Black (varies by model)
- Adjustability: Accommodates various sizes and types of Snapdragon basebands and processors.
Included Accessories
- Positioning Pins: Adjustable pins to secure chips of different sizes during repair.
- Thermal Insulation Pad: Included to protect the surrounding area from heat damage.
Usage
- Ideal for mobile repair professionals working with Snapdragon-powered smartphones and tablets. The Mijing SNAPDRAGON fixture ensures stability and precision during the critical reballing and soldering processes of CPU basebands and IC chips.
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AMAOE Stencil AU4
Availability: In Stock
₹159
AMAOE Stencil AU4 Specifications
Product Overview
- Model: AMAOE AU4
- Type: High-Precision Reballing Stencil
- Purpose: The AMAOE Stencil AU4 is a professional-grade BGA reballing stencil, designed for precision soldering and chip reballing tasks. It is ideal for use in repairing and reworking small, delicate components, particularly in mobile phones, tablets, and other electronic devices.
- Material: High-quality stainless steel
- Thickness: 0.12 mm (offers precise hole depth for consistent solder ball sizes)
- Dimensions: Compact size for ease of use in small workspaces
- Heat Resistance: Can withstand temperatures up to 500°C, ensuring stability and durability during soldering operations.
- Compatibility: Designed for use with a wide range of mobile phone and tablet chipsets, including modern smartphones and tablets.
Included Accessories
- Support Base: Some models may include a support base for easier alignment of the stencil with the chip.
- User Manual: Instructions on proper handling, maintenance, and usage of the stencil for optimal results.
Usage
- Ideal for: Electronics repair professionals who require precision tools for BGA reballing, chip replacement, and micro-soldering tasks. The AMAOE AU4 Stencil is perfect for handling sensitive components in smartphones and tablets, ensuring accuracy and efficiency in the repair process.
This specification covers the main features and details of the AMAOE AU4 Stencil. You can modify or expand this description as needed!
- New
AMAOE Stencil AU3
Availability: In Stock
₹159
AMAOE Stencil AU3 Specifications
Product Overview
- Model: AMAOE AU3
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU3 is designed for precision chip reballing and soldering applications, particularly for mobile phones, tablets, and other compact electronic devices. It ensures accurate placement of solder balls for reworking BGA chips, making it a vital tool for professional electronics repair and rework tasks.
- Material: High-grade stainless steel for durability and heat resistance
- Thickness: 0.12 mm for accurate solder ball depth and size
- Dimensions: Compact and portable design, suitable for small electronics workspaces
- Heat Resistance: Withstands temperatures up to 500°C, providing stability during high-heat reballing processes
- Compatibility: Compatible with a variety of mobile phone and tablet chipsets, making it a versatile tool for multiple device repairs
Included Accessories
- Support Base (optional): Some packages may include a support base to help with chip alignment during the reballing process.
- User Instructions: Comes with guidelines for safe use, cleaning, and proper handling.
Usage
- Ideal for: Electronics repair technicians and professionals working on reballing and soldering BGA chips in mobile phones, tablets, and other compact devices. The AMAOE AU3 stencil offers precision, reliability, and durability for a wide range of rework and repair needs.
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AMAOE Stencil IPHDD 4 IN 1 0.15MM
AMAOE Stencil IPHDD 4 in 1 0.15MM Specifications
Availability: In Stock
₹159
AMAOE Stencil IPHDD 4 in 1 0.15MM Specifications
Product Overview
- Model: AMAOE IPHDD 4 in 1
- Type: High-Precision BGA Reballing Stencil (0.15MM)
- Purpose: The AMAOE IPHDD 4 in 1 Stencil is a specialized tool designed for reballing and repairing multiple components in mobile devices. With four different stencils combined into one, it is ideal for reworking chips on iPhones and other mobile devices. Its precise construction ensures accurate solder ball placement during chip repair and replacement.
Key Features
- 4-in-1 Design: Combines four individual stencils in one unit, offering versatile options for different chips and components, making it an all-in-one solution for mobile device repairs.
- Material Quality: Constructed from high-quality stainless steel, offering excellent durability, heat resistance, and resistance to corrosion.
- Precision-Cut Holes: The 0.15MM thickness ensures fine, precision-cut holes for accurate placement of solder balls, ensuring optimal alignment and efficiency during reballing.
- Compatibility: Specially designed for iPhone HDD (Hard Disk Drive) chip reballing, but also compatible with other mobile device chips.
- Heat Resistance: Can withstand high temperatures during the soldering and reballing process without warping or bending.
Specifications
- Material: Premium stainless steel
- Thickness: 0.15MM for enhanced precision in solder ball depth and placement
- Design: 4-in-1 stencil, allowing for multi-use across different chips and components
- Dimensions: Compact and easy-to-handle size for working on small electronic devices
- Heat Resistance: Up to 500°C, maintaining structural integrity during high-heat applications
- Compatibility: Ideal for use with iPhone chips and other mobile devices requiring high-precision reballing
Included Accessories
- Support Frame (optional): Some packages may include a support frame or base to assist in aligning the stencil with the chip during reballing.
- Instructions Manual: Provides detailed guidelines for use and care of the stencil.
Usage
- Ideal for: Mobile device repair technicians specializing in iPhone repairs and BGA chip reballing. The AMAOE IPHDD 4 in 1 Stencil is designed to make multi-tasking easier with its versatile and precise design, ensuring accurate results for professionals.
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AMAOE Stencil AU1
Availability: In Stock
₹159
AMAOE Stencil AU1 Specifications
Product Overview
- Model: AMAOE AU1
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU1 is designed for professional reballing and soldering of BGA chips, making it ideal for use in mobile phone, tablet, and other electronic device repairs. It ensures accurate placement of solder balls on chips for precise rework and repairs.
- Material: High-grade stainless steel
- Thickness: 0.12MM, providing precision in the depth and size of solder balls
- Dimensions: Compact design for ease of use in small workspaces and with delicate components
- Heat Resistance: Up to 500°C, ensuring durability during high-heat applications
- Compatibility: Designed for reballing various BGA chips used in mobile phones, tablets, and other compact electronics
Included Accessories
- Optional Support Frame: Some packages may include a base to assist in properly aligning the stencil with the chip.
- User Guide: Instructions for proper handling, care, and use of the stencil for best results in reballing tasks.
Usage
- Ideal for: Electronics repair professionals working with BGA chip reballing and soldering. The AMAOE AU1 stencil ensures precise and reliable results when repairing smartphones, tablets, and other small electronic devices.
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AMAOE Stencil AU2
Availability: In Stock
₹159
AMAOE Stencil AU2 Specifications
Product Overview
- Model: AMAOE AU2
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU2 is a professional-grade reballing tool designed for precise rework of BGA (Ball Grid Array) chips commonly found in smartphones, tablets, and other compact electronics. This stencil ensures accurate placement of solder balls, making it essential for efficient repair and reballing tasks.
- Material: High-quality stainless steel for heat and corrosion resistance
- Thickness: 0.12MM, providing precision in reballing depth and solder ball placement
- Dimensions: Compact and easy to use, designed for small electronics like smartphones and tablets
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering and reballing processes
- Compatibility: Supports various BGA chips used in mobile devices, ensuring versatility in repair applications
Included Accessories
- Optional Support Frame: Some packages may come with a support base to assist with chip alignment and handling during reballing.
- User Manual: A guide to proper handling, cleaning, and using the stencil for optimal results.
Usage
- Ideal for: Professional mobile device repair technicians and electronics specialists who work with BGA reballing. The AMAOE AU2 stencil ensures precise and efficient chip reballing, making it essential for high-quality repairs.
- New
AMAOE Stencil U-SMG1
Availability: In Stock
₹159
AMAOE Stencil U-SMG1 Specifications
Product Overview
- Model: AMAOE U-SMG1
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG1 is designed specifically for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil facilitates precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability
- Thickness: 0.12MM, designed for precision in reballing and solder ball placement
- Dimensions: Compact size, suitable for use in tight spaces typically found in electronic devices
- Heat Resistance: Up to 500°C, allowing for high-temperature soldering applications
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronic repairs
Included Accessories
- Support Frame (Optional): Some packages may include a support frame to assist with aligning the stencil accurately during use.
- Instruction Manual: Provides guidelines for proper usage, maintenance, and care of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG1 stencil is essential for achieving accurate and reliable results in mobile device repairs and other electronic applications.
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AMAOE Stencil U-SMG2
Availability: In Stock
₹159
AMAOE Stencil U-SMG2 Specifications
Product Overview
- Model: AMAOE U-SMG2
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG2 is engineered for precision in BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil aids in the accurate alignment and placement of solder balls on various chips, ensuring high-quality repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and longevity
- Thickness: 0.12MM, providing precision in solder ball placement and depth
- Dimensions: Compact design for ease of use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks
- Compatibility: Accommodates various BGA chip sizes, making it suitable for a diverse range of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to facilitate accurate alignment during reballing.
- User Manual: Includes instructions for proper handling, care, and usage to ensure optimal results with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-SMG2 stencil is crucial for achieving accurate and reliable solder ball placement, ensuring high-quality repairs in mobile device and electronic component servicing.
- New
AMAOE Stencil U-SMG3
Availability: In Stock
₹159
AMAOE Stencil U-SMG3 Specifications
Product Overview
- Model: AMAOE U-SMG3
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG3 is specifically designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil allows for precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and heat resistance
- Thickness: 0.12MM, providing precision in solder ball placement and reballing processes
- Dimensions: Compact design for ease of handling and use in tight spaces typical of electronic devices
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronics repair applications
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during reballing.
- Instruction Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil for optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-SMG5
Availability: In Stock
₹159
AMAOE Stencil U-SMG5 Specifications
Product Overview
- Model: AMAOE U-SMG5
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG5 is designed specifically for BGA (Ball Grid Array) reballing applications. This stencil is a crucial tool for electronics repair professionals, enabling precise alignment and placement of solder balls on various chips, ensuring top-quality repairs on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and heat resistance
- Thickness: 0.12MM, providing precision in solder ball placement and reballing processes
- Dimensions: Compact and practical design for ease of handling in tight spaces typical of electronic devices
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility for a wide array of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Includes guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG5 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and various electronic applications.
- New
AMAOE Stencil U-SMG4
Availability: In Stock
₹159
AMAOE Stencil U-SMG4 Specifications
Product Overview
- Model: AMAOE U-SMG4
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG4 is meticulously engineered for BGA (Ball Grid Array) reballing applications. It serves as an essential tool for electronics repair professionals, allowing for precise alignment and placement of solder balls on various chips, ensuring high-quality repairs on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for superior durability and thermal stability
- Thickness: 0.12MM, ensuring precision in solder ball placement and depth
- Dimensions: Compact design for convenient handling and use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Accommodates various BGA chip sizes, ensuring usability across a range of electronic repair tasks
Included Accessories
- Optional Support Frame: Some packages may include a support frame to facilitate accurate alignment during reballing.
- User Manual: Comes with instructions for proper handling, care, and usage to ensure optimal performance with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-SMG4 stencil is vital for achieving precise and reliable solder ball placement, guaranteeing high-quality repairs in mobile device servicing and other electronics applications.
- New
AMAOE Stencil U-MTK1
Availability: In Stock
₹159
AMAOE Stencil U-MTK1 Specifications
Product Overview
- Model: AMAOE U-MTK1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK1 is specifically designed for BGA (Ball Grid Array) reballing tasks, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, guaranteeing high-quality repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for superior durability and thermal stability
- Thickness: 0.15MM, ensuring precision in solder ball placement and reballing processes
- Dimensions: Compact design facilitates easy handling and use in confined electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Accommodates various BGA chip sizes, ensuring usability across a range of electronic repair tasks
Included Accessories
- Optional Alignment Frame: Some packages may come with a support frame to assist in achieving accurate alignment during reballing.
- User Manual: Includes instructions for proper handling, care, and usage to ensure optimal performance with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-MTK1 stencil is vital for achieving precise and reliable solder ball placement, guaranteeing high-quality repairs in mobile device servicing and other electronics applications.
- New
AMAOE Stencil U-MTK2
Availability: In Stock
₹159
AMAOE Stencil U-MTK2 Specifications
Product Overview
- Model: AMAOE U-MTK2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK2 is designed for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures accurate alignment and placement of solder balls on various chips, providing reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for improved durability and thermal stability
- Thickness: 0.15MM, allowing for precision in solder ball placement and reballing processes
- Dimensions: Compact design enables easy handling and use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications
- Compatibility: Designed to work with various BGA chip sizes, enhancing usability across a range of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK2 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK3
Availability: In Stock
₹159
AMAOE Stencil U-MTK3 Specifications
Product Overview
- Model: AMAOE U-MTK3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK3 is expertly designed for BGA (Ball Grid Array) reballing tasks, making it an indispensable tool for electronics repair professionals. This stencil ensures accurate alignment and precise placement of solder balls on various chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for increased durability and thermal stability.
- Thickness: 0.15MM, ensuring precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various BGA chip sizes, enhancing usability across diverse electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist in achieving accurate alignment during the reballing process.
- User Manual: Provides guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-MTK3 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-MTK4
Availability: In Stock
₹159
AMAOE Stencil U-MTK4 Specifications
Product Overview
- Model: AMAOE U-MTK4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-MTK4 is engineered for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for easy handling and usability in tight electronic spaces.
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Compatible with a wide range of BGA chip sizes, enhancing usability across various electronic repair tasks.
Included Accessories
- Optional Alignment Frame: Some packages may come with a support frame to assist with accurate alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals focusing on BGA chip reballing. The AMAOE U-MTK4 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
