Mobile Doctor Tool HuB
AMAOE Intel Ultra Q3TD BGA Reballing
₹366
Availability:
In Stock
Condition:
New
Key Features
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- 24 Hours return window policy
- Specialized BGA reballing tool designed for Intel processors.
- \Ultra-precise alignment for accurate ball placement during reballing.
- Durable construction ensures longevity and consistent performance.
- User-friendly design allows for easy setup and operation, ideal for technicians.
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The AMAOE Intel Ultra Q3TD BGA Reballing Tool is a professional-grade device designed for precision reballing of BGA (Ball Grid Array) components on Intel motherboards and other electronic devices. This cutting-edge tool streamlines the reballing process, making it an essential asset for technicians and repair shops focused on advanced electronic repairs.
Key Features:
Precision Engineering: The Q3TD tool is crafted for meticulous reballing, ensuring that solder balls are accurately aligned and placed on BGA components. This precision is vital for restoring the functionality of devices and preventing future failures.
Wide Compatibility: Designed specifically for Intel processors and motherboards, the AMAOE Ultra Q3TD is compatible with a range of BGA sizes, making it suitable for various models. This versatility allows technicians to handle multiple repair jobs with a single tool.
User-Friendly Operation: With its intuitive design, the Q3TD makes the reballing process accessible for both experienced technicians and newcomers. Detailed instructions and clear controls ensure that users can achieve optimal results quickly and effectively.
Durable Construction: Built with high-quality materials, the AMAOE Ultra Q3TD is designed to withstand the rigors of daily use in a professional environment. Its robust design ensures long-lasting performance, reducing the need for frequent replacements.
Enhanced Efficiency: This tool significantly speeds up the reballing process, allowing technicians to complete jobs more quickly and efficiently. The improved workflow leads to faster turnaround times and increased customer satisfaction.
Comprehensive Reballing Kit: The Q3TD comes with everything needed for a successful reballing operation, including various sizes of solder balls, templates, and a cleaning brush. This all-in-one kit ensures that technicians are fully equipped for any job.
Cost-Effective Solution: By enabling precise reballing of BGA components, the AMAOE Intel Ultra Q3TD helps technicians reduce repair costs associated with component replacement. It enhances the longevity and reliability of repaired devices.
Upgrade your repair capabilities with the AMAOE Intel Ultra Q3TD BGA Reballing Tool—a reliable, efficient, and essential solution for achieving professional-quality reballing results in the fast-paced world of electronics repair!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Q3TD |
| Seller SKU: | Nikita-768 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 3500.00 g |
| Date first listed on DP MART : | Oct 9, 2024 |
AMAOE Intel Ultra Q3TD BGA Reballing Specifications
Product Overview
- Model: AMAOE Intel Ultra Q3TD
- Type: BGA Reballing Station
- Purpose: Designed for professional technicians to efficiently reball BGA (Ball Grid Array) components, specifically for Intel chipsets and other compatible devices.
Key Features
- Precision Engineering: Features advanced technology for accurate alignment and placement of BGA components, ensuring reliable connections and optimal performance.
- Heat Control System: Equipped with a precise temperature control system that allows for uniform heating during the reballing process, reducing the risk of damage to the component and PCB.
- Multiple Nozzle Options: Comes with interchangeable nozzles suitable for various BGA sizes, providing versatility for different repair tasks.
- User-Friendly Interface: Simple controls and clear displays for easy operation, making it accessible for both novice and experienced technicians.
- Compact Design: Space-saving design ideal for small workspaces without compromising on performance.
Specifications
- Heating Method: Infrared and hot air combination for effective and even heating.
- Temperature Range: Adjustable temperature settings from 100°C to 350°C (212°F to 662°F).
- Power Supply: AC 110V-220V, 50/60Hz
- Weight: Approximately 3.5 kg (7.72 lbs)
- Dimensions: 30 cm x 25 cm x 15 cm (11.81 in x 9.84 in x 5.91 in)
Included Accessories
- Nozzles: A set of various-sized nozzles for different BGA components.
- User Manual: Comprehensive instructions for setup, operation, and maintenance to ensure effective reballing processes.
Usage
- Ideal for repair shops, electronics technicians, and hobbyists involved in BGA rework and repair, ensuring high-quality reballing of Intel and compatible chipsets for enhanced device performance.
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