iqo012 (iqoo proo) MIDDLE LAYER
Availability: In Stock
₹159
iQOO 012 (iQOO Pro) Middle Layer Specifications
Product Overview:
- Model: iQOO 012 (iQOO Pro)
- Type: Internal Middle Layer Assembly
- Application: Serves as a structural support layer within the iQOO Pro, providing stability and protection for internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed for durability and rigidity while maintaining a lightweight profile.
Design:
- Dimensions: Custom-designed to fit the iQOO Pro, ensuring precise alignment and compatibility with other internal components.
- Weight: Lightweight construction to facilitate easy installation and maintain the overall weight of the device.
Features:
- Thermal Management: May include features for effective thermal management, helping to dissipate heat generated during device operation, thus enhancing performance and reliability.
- Protection: Provides a protective barrier for sensitive internal components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the iQOO 012 (iQOO Pro), ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips for secure attachment during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in iQOO device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in iQOO Pro devices, ensuring structural integrity and protection for internal components.
The middle layer is an essential part of the iQOO Pro, providing crucial support and safeguarding the internal architecture of the device.
- New
11 ultra note MIDDLE LAYER
Availability: In Stock
₹159
Samsung Galaxy Note 11 Ultra (Model) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy Note 11 Ultra
- Type: Internal Middle Layer Assembly
- Application: Functions as a structural support layer within the Galaxy Note 11 Ultra, providing stability and protection for internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed for durability and rigidity while keeping the weight light.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy Note 11 Ultra, ensuring precise alignment with other internal components.
- Weight: Lightweight design to facilitate easy installation and maintain the overall weight of the device.
Features:
- Thermal Management: May include features to enhance thermal management, helping to dissipate heat generated during device operation, thereby improving performance and reliability.
- Protection: Provides a protective barrier for sensitive internal components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy Note 11 Ultra, ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer in place during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy Note 11 Ultra devices, ensuring structural integrity and protection for internal components.
The middle layer is a critical component of the Samsung Galaxy Note 11 Ultra, providing essential support and safeguarding the internal architecture of the device.
- New
AMAOE Stencil SAMSUNG E853SP
Availability: In Stock
₹159
AMAOE Stencil Samsung E853SP Specifications
Product Overview:
- Model: AMAOE Stencil E853SP
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in various Samsung devices, particularly for the E853SP model.
Key Features:
- Premium Stainless Steel Construction: Made from high-quality stainless steel, ensuring durability and resistance to corrosion and thermal damage.
- Laser-Cut Precision: Features laser-cut openings for accurate alignment, ensuring consistent and precise solder ball placement during the reballing process.
- Standard Thickness: Designed with a thickness of 0.15MM, which balances flexibility and robustness for optimal solder ball application.
- High Heat Resistance: Engineered to withstand high temperatures associated with the reballing process, ensuring reliability and longevity.
- Compatibility: Tailored for Samsung E853SP BGA components, making it an excellent choice for technicians focusing on repairs for Samsung devices.
Specifications:
- Material: Premium-grade stainless steel resistant to corrosion and thermal damage for extended usage.
- Thickness: 0.15MM, providing a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment and enhance usability in repair processes.
- Heat Resistance: Capable of withstanding elevated temperatures encountered during soldering without warping or degrading.
- Target Devices: Optimized for Samsung E853SP processors and various BGA chips, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil E853SP is designed to provide technicians with the tools needed for efficient and effective reballing of BGA chips, particularly in Samsung devices.
- New
AMAOE Stencil SAMSUNG E883SP
Availability: In Stock
₹159
AMAOE Stencil Samsung E8835SP Specifications
Product Overview:
- Model: AMAOE Stencil E8835SP
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in various Samsung devices, particularly for the E8835SP model.
Key Features:
- Premium Stainless Steel Construction: Crafted from high-quality stainless steel, ensuring durability and resistance to corrosion and thermal damage.
- Laser-Cut Precision: Features laser-cut openings for accurate alignment, which ensures consistent and precise solder ball placement during the reballing process.
- Standard Thickness: Designed with a thickness of 0.15MM, striking a balance between flexibility and robustness for optimal solder ball application.
- High Heat Resistance: Engineered to withstand the elevated temperatures associated with the reballing process, ensuring reliability and longevity.
- Compatibility: Tailored for Samsung E8835SP BGA components, making it an excellent choice for technicians focusing on repairs for Samsung devices.
Specifications:
- Material: Premium-grade stainless steel that is resistant to corrosion and thermal damage for extended usage.
- Thickness: 0.15MM, which provides a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment, enhancing usability in repair processes.
- Heat Resistance: Capable of withstanding elevated temperatures encountered during soldering without warping or degrading.
- Target Devices: Optimized for Samsung E8835SP processors and various BGA chips, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil E8835SP is designed to provide technicians with the tools needed for efficient and effective reballing of BGA chips, particularly in Samsung devices.
- New
