AMAOE Stencil DM-13/13Mini
Availability: In Stock
₹180
AMAOE Stencil DM-13/13Mini Specifications
Product Overview:
- Model: AMAOE Stencil DM-13/13Mini
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in a variety of electronic devices, particularly suited for the DM-13 series and its mini variant.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing an ideal balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-13/13Mini is specifically designed to provide technicians with a reliable tool for BGA reballing in various electronic applications.
- New
AMAOE Stencil IPH6-A11
Availability: In Stock
₹180
AMAOE Stencil IPH6-A11 Specifications
Product Overview:
- Model: AMAOE Stencil IPH6-A11
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in iPhone models, particularly focusing on the iPhone 6 to iPhone 11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, which offers excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing a balanced combination of rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design that fits standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for various BGA components used in iPhone models, making it an excellent choice for technicians specializing in Apple device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on repairs for iPhone models ranging from iPhone 6 to iPhone 11.
- Applications: Best suited for reballing processors and critical BGA components in iPhones, ensuring high-quality and accurate repairs.
The AMAOE Stencil IPH6-A11 is specifically designed to provide technicians with a reliable tool for BGA reballing tailored for the iPhone 6 to 11 series.
- New
AMAOE Stencil DM-11/11P/11PM
Availability: In Stock
₹180
AMAOE Stencil DM-11/11P/11PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-11/11P/11PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, with a focus on those compatible with the DM-11 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring long-lasting durability.
- Thickness: 0.15 mm, offering a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronics, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-11/11P/11PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
- New
AMAOE Stencil DM-12/12P/12PM
Availability: In Stock
₹180
AMAOE Stencil DM-12/12P/12PM Specifications
Product Overview:
- Model: AMAOE Stencil DM-12/12P/12PM
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing BGA chips used in various electronic devices, specifically tailored for the DM-12 series.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage, ensuring durability and long-lasting use.
- Thickness: 0.15 mm, striking a balance between rigidity and flexibility, making it suitable for multiple reballing cycles.
- Dimensions: Compact design intended to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-12/12P/12PM is specifically designed to provide technicians with a reliable tool for BGA reballing across various electronic applications.
- New
AMAOE Stencil EMMCl (U-UFS1)
Availability: In Stock
₹159
AMAOE Stencil EMMCl (U-UFS1) Specifications
Product Overview:
- Model: AMAOE Stencil EMMCl (U-UFS1)
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips, focusing on EMMC and UFS (Universal Flash Storage) components used in various electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage for enhanced durability.
- Thickness: 0.15 mm, providing a balance of rigidity and flexibility suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand the high temperatures encountered during the reballing process without warping or degrading, ensuring reliable performance.
- Compatibility: Optimized for EMMC and UFS components, making it an ideal choice for technicians focusing on mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in the reballing of EMMC and UFS chips in mobile devices and other electronics.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC and UFS storage solutions.
The AMAOE Stencil EMMCl (U-UFS1) is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC and UFS components.
- New
AMAOE Stencil EMMC2
Availability: In Stock
₹180
AMAOE Stencil EMMC2 Specifications
Product Overview:
- Model: AMAOE Stencil EMMC2
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing EMMC (Embedded MultiMediaCard) chips used in various electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for long-lasting durability.
- Thickness: 0.15 mm, offering a balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability in repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the reballing process without warping or degrading, ensuring reliable performance.
- Compatibility: Optimized for EMMC components, making it an excellent choice for technicians specializing in mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing EMMC chips in various electronic devices.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC storage solutions.
The AMAOE Stencil EMMC2 is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC components.
- New
AMAOE Stencil EMMC3
Availability: In Stock
₹180
AMAOE Stencil EMMC3 Specifications
Product Overview:
- Model: AMAOE Stencil EMMC3
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing EMMC (Embedded MultiMediaCard) chips used in a variety of electronic devices.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Constructed from premium-grade stainless steel, providing excellent resistance to corrosion and thermal damage for extended durability.
- Thickness: 0.15 mm, which strikes a balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during various repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during the reballing process without warping or degrading, ensuring reliable and consistent performance.
- Compatibility: Optimized for EMMC components, making it an ideal choice for technicians focusing on mobile device repairs and upgrades.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in reballing EMMC chips in various electronic devices.
- Applications: Best suited for reballing critical components in smartphones, tablets, and other devices that utilize EMMC storage solutions.
The AMAOE Stencil EMMC3 is designed to provide technicians with a reliable tool for precise BGA reballing, ensuring high-quality repairs for EMMC components.
- New
S21 (G991U) MIDDLE LAYER
Availability: In Stock
₹180
Samsung Galaxy S21 (Model G991U) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy S21 (G991U) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: This component serves as a structural support layer within the Samsung Galaxy S21, contributing to the overall stability and protection of internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed to provide durability and rigidity while keeping the device lightweight.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy S21, ensuring proper alignment and functionality with other internal components.
- Weight: Lightweight construction to facilitate ease of installation and maintain the overall device weight within acceptable limits.
Features:
- Thermal Management: Often includes provisions for thermal management to help dissipate heat generated by the device during operation, enhancing overall performance.
- Protection: Acts as a protective layer for sensitive components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy S21 (G991U), ensuring a perfect fit and functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer in place during assembly.
- Instructions: Installation instructions may be provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy S21 devices, ensuring structural integrity and protection for internal components.
The middle layer is a crucial component of the Samsung Galaxy S21, providing essential support and protection for the device's internal architecture.
- New
S10 5g (G9774) MIDDLE LAYER
Availability: In Stock
₹180
Samsung Galaxy S10 5G (Model G977F) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy S10 5G (G977F) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: This component serves as a structural support layer within the device, contributing to the overall stability and protection of internal components.
Material:
- Construction Material: Typically made from high-quality materials such as aluminum or reinforced plastic, designed to provide durability and rigidity while keeping the device lightweight.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy S10 5G, ensuring proper alignment and functionality with other internal components.
- Weight: Lightweight to facilitate ease of installation and maintain the overall device weight within acceptable limits.
Features:
- Thermal Management: Often includes provisions for thermal management to help dissipate heat generated by the device during operation, enhancing overall performance.
- Protection: Acts as a protective layer for sensitive components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy S10 5G (G977F), ensuring a perfect fit and functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer in place during assembly.
- Instructions: Installation instructions may be provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy S10 5G devices, ensuring structural integrity and protection for internal components.
The middle layer is a crucial part of the Samsung Galaxy S10 5G, providing essential support and protection for the device's internal architecture.
- New
S10 (G977b) MIDDLE LAYER
Availability: In Stock
₹180
Samsung Galaxy S10 (Model G977B) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy S10 (G977B) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: This component serves as a structural support layer within the Samsung Galaxy S10, contributing to the overall stability and protection of internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed to provide durability and rigidity while keeping the device lightweight.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy S10, ensuring proper alignment and functionality with other internal components.
- Weight: Lightweight construction to facilitate ease of installation and maintain the overall device weight within acceptable limits.
Features:
- Thermal Management: Often includes provisions for thermal management to help dissipate heat generated by the device during operation, enhancing overall performance.
- Protection: Acts as a protective layer for sensitive components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy S10 (G977B), ensuring a perfect fit and functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer in place during assembly.
- Instructions: Installation instructions may be provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy S10 devices, ensuring structural integrity and protection for internal components.
The middle layer is a crucial component of the Samsung Galaxy S10, providing essential support and protection for the device's internal architecture.
- New
S22 ultra (G908U) MIDDLE LAYER
Availability: In Stock
₹180
Samsung Galaxy S22 Ultra (Model G908U) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy S22 Ultra (G908U) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: Serves as a structural support layer within the Samsung Galaxy S22 Ultra, ensuring the stability and protection of internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic to provide durability and rigidity while maintaining a lightweight design.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy S22 Ultra, ensuring precise alignment and functionality with other internal components.
- Weight: Lightweight design to facilitate ease of installation and contribute to the overall device weight management.
Features:
- Thermal Management: Includes provisions for effective thermal management to help dissipate heat generated during device operation, enhancing overall performance and reliability.
- Protection: Acts as a protective barrier for sensitive components such as the battery, camera modules, and internal circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy S22 Ultra (G908U), ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips for secure attachment during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in integrating the middle layer properly.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy S22 Ultra devices, ensuring structural integrity and protection for internal components.
The middle layer is an essential part of the Samsung Galaxy S22 Ultra, providing crucial support and safeguarding the internal architecture of the device.
- New
S21 ultra (G998U) MIDDLE LAYER
Availability: In Stock
₹180
Samsung Galaxy S21 Ultra (Model G998U) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy S21 Ultra (G998U) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: Serves as a structural support layer within the Samsung Galaxy S21 Ultra, ensuring the stability and protection of internal components.
Material:
- Construction Material: Typically constructed from high-quality aluminum or reinforced plastic, designed for durability and rigidity while maintaining a lightweight profile.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy S21 Ultra, ensuring precise alignment and compatibility with other internal components.
- Weight: Lightweight construction to facilitate ease of installation and help maintain the overall device weight within acceptable limits.
Features:
- Thermal Management: Often includes features for effective thermal management, helping to dissipate heat generated during operation, thus enhancing performance and reliability.
- Protection: Acts as a protective barrier for sensitive internal components, including the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy S21 Ultra (G998U), ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips for secure attachment during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy S21 Ultra devices, ensuring structural integrity and protection for internal components.
The middle layer is an essential component of the Samsung Galaxy S21 Ultra, providing crucial support and safeguarding the internal architecture of the device.
- New
SONYXPERIA 11 (X-11)MIDDLE LAYER
Availability: In Stock
₹180
Sony Xperia 11 (X-11) Middle Layer Specifications
Product Overview:
- Model: Sony Xperia 11 (X-11) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: Serves as a structural support layer within the Sony Xperia 11, ensuring stability and protection for internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed for durability, rigidity, and lightweight properties.
Design:
- Dimensions: Custom-designed to fit the Sony Xperia 11, ensuring proper alignment and compatibility with other internal components.
- Weight: Lightweight construction to facilitate ease of installation and maintain the overall device weight.
Features:
- Thermal Management: May include features for thermal management to help dissipate heat generated during device operation, enhancing overall performance and reliability.
- Protection: Provides a protective barrier for sensitive internal components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Sony Xperia 11 (X-11), ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer in place during assembly.
- Instructions: Installation instructions may be provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Sony device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Sony Xperia 11 devices, ensuring structural integrity and protection for internal components.
The middle layer is a crucial component of the Sony Xperia 11, providing essential support and safeguarding the internal architecture of the device.
- New
MATE RS MIDDLE LAYER
Availability: In Stock
₹180
Huawei Mate RS Middle Layer Specifications
Product Overview:
- Model: Huawei Mate RS
- Type: Internal Middle Layer Assembly
- Application: Acts as a structural support layer within the Huawei Mate RS, providing stability and protection for internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed for durability and rigidity while maintaining a lightweight profile.
Design:
- Dimensions: Custom-designed to fit the Huawei Mate RS, ensuring precise alignment and compatibility with other internal components.
- Weight: Lightweight design to facilitate easy installation and to help maintain the overall weight of the device.
Features:
- Thermal Management: May include features for effective thermal management, helping to dissipate heat generated during device operation, thus enhancing performance and reliability.
- Protection: Provides a protective barrier for sensitive internal components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the Huawei Mate RS, ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips for secure attachment during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Huawei device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Huawei Mate RS devices, ensuring structural integrity and protection for internal components.
The middle layer is an essential part of the Huawei Mate RS, providing crucial support and safeguarding the internal architecture of the device.
- New
Z FOLD 3 (F926) MIDDLE LAYER
Availability: In Stock
₹180
Samsung Galaxy Z Fold 3 (Model F926) Middle Layer Specifications
Product Overview:
- Model: Samsung Galaxy Z Fold 3 (F926) Middle Layer
- Type: Internal Middle Layer Assembly
- Application: Serves as a structural support layer within the Samsung Galaxy Z Fold 3, providing stability and protection for internal components, especially considering the unique folding mechanism of the device.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, engineered for durability, rigidity, and lightweight characteristics.
Design:
- Dimensions: Custom-designed to fit the Samsung Galaxy Z Fold 3, ensuring precise alignment with other internal components, including the flexible display.
- Weight: Lightweight construction to facilitate easy installation and maintain the overall device weight.
Features:
- Thermal Management: Often includes provisions for effective thermal management to dissipate heat generated during device operation, enhancing overall performance and reliability.
- Protection: Provides a protective barrier for sensitive components such as the battery, camera modules, and circuit boards, while accommodating the folding design.
Compatibility:
- Model Compatibility: Specifically designed for the Samsung Galaxy Z Fold 3 (F926), ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips to secure the middle layer during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in Samsung device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in Samsung Galaxy Z Fold 3 devices, ensuring structural integrity and protection for internal components.
The middle layer is a crucial component of the Samsung Galaxy Z Fold 3, providing essential support and safeguarding the internal architecture of this innovative folding device.
- New
iqo012 (iqoo proo) MIDDLE LAYER
Availability: In Stock
₹180
iQOO 012 (iQOO Pro) Middle Layer Specifications
Product Overview:
- Model: iQOO 012 (iQOO Pro)
- Type: Internal Middle Layer Assembly
- Application: Serves as a structural support layer within the iQOO Pro, providing stability and protection for internal components.
Material:
- Construction Material: Typically made from high-quality aluminum or reinforced plastic, designed for durability and rigidity while maintaining a lightweight profile.
Design:
- Dimensions: Custom-designed to fit the iQOO Pro, ensuring precise alignment and compatibility with other internal components.
- Weight: Lightweight construction to facilitate easy installation and maintain the overall weight of the device.
Features:
- Thermal Management: May include features for effective thermal management, helping to dissipate heat generated during device operation, thus enhancing performance and reliability.
- Protection: Provides a protective barrier for sensitive internal components such as the battery, camera modules, and circuit boards.
Compatibility:
- Model Compatibility: Specifically designed for the iQOO 012 (iQOO Pro), ensuring a perfect fit and optimal functionality within the device.
Included Components:
- Mounting Brackets: May include mounting brackets or clips for secure attachment during assembly.
- Instructions: Installation instructions are typically provided to assist technicians in properly integrating the middle layer into the device.
Usage:
- Target Audience: Ideal for repair technicians and service centers specializing in iQOO device repairs.
- Applications: Used in the repair or replacement of damaged middle layers in iQOO Pro devices, ensuring structural integrity and protection for internal components.
The middle layer is an essential part of the iQOO Pro, providing crucial support and safeguarding the internal architecture of the device.
- New
Mobile Essentials: Smartphones & Accessories for Seamless Connectivity
Stay connected with our latest smartphones and mobile accessories. From chargers to cases, find everything you need for seamless communication on the go
You Viewed Recently
