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AMAOE Stencil DM-13/13Mini
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- High Precision Design: Offers accurate alignment for soldering and reballing of IC chips, ensuring professional-grade results.
- Durable Material: Made from high-quality stainless steel, resistant to warping and wear for extended usage.
- Wide Compatibility: Supports a variety of IC chip sizes and configurations, making it versatile for different devices.
- Compact Design: Tailored for precise soldering on DM-13 and DM-13Mini models.
- Durable Construction: Crafted from high-quality stainless steel for enhanced longevity.
- Precision Cutouts: Features meticulously designed openings for accurate soldering.
- User-Friendly: Simplifies the soldering process, making it accessible for technicians of all skill levels.
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The AMAOE Stencil DM-13/13Mini is a high-performance soldering stencil meticulously crafted for mobile device repair specialists. Combining superior design with advanced manufacturing techniques, this stencil provides the precision and reliability needed for successful electronic repairs.
Key Features:
High-Quality Stainless Steel Construction
Made from premium stainless steel, the DM-13/13Mini stencil is engineered for durability and long-term use. Its robust design ensures it can withstand repeated applications while maintaining its structural integrity.Precision Laser-Cut Apertures
Featuring precision laser-cut apertures, this stencil guarantees exact alignment with electronic components. This level of accuracy minimizes the potential for misalignment, ensuring superior solder joint quality and reliability.Dual Size Versatility
The DM-13/13Mini includes two size options, making it adaptable for various repair scenarios. Whether you are working on larger components or smaller, intricate parts, this stencil meets the diverse needs of technicians.User-Friendly and Ergonomic Design
With its lightweight and ergonomic structure, the DM-13/13Mini allows for easy handling and maneuverability during detailed soldering tasks. Its compact design enhances portability, making it convenient to transport to different work locations.Optimized for Solder Paste Application
This stencil is designed to improve solder paste application efficiency, enabling technicians to create consistent and reliable solder connections. The precise apertures ensure even distribution of paste, enhancing repair quality.Compatible with Various Solder Pastes
The DM-13/13Mini is compatible with a wide range of solder pastes, allowing users to select the most appropriate type for specific repairs, whether for micro-soldering or larger component placements.
Elevate your mobile device repair capabilities with the AMAOE Stencil DM-13/13Mini. This innovative soldering tool merges precision, durability, and usability, ensuring that you achieve professional results in all your electronic repair projects. Rely on the DM-13/13Mini for consistent, high-quality soldering every time!
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | DM-13/13Mini |
| Seller SKU: | Nikita-884 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil DM-13/13Mini Specifications
Product Overview:
- Model: AMAOE Stencil DM-13/13Mini
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in a variety of electronic devices, particularly suited for the DM-13 series and its mini variant.
- Weight: Approximately 0.5 kg (please verify for specific product details).
Material and Design:
- Material: Made from premium-grade stainless steel, offering excellent resistance to corrosion and thermal damage, ensuring durability for extended use.
- Thickness: 0.15 mm, providing an ideal balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design tailored to fit standard reballing equipment, enhancing usability during repair processes.
Performance Characteristics:
- Heat Resistance: Engineered to withstand high temperatures encountered during soldering without warping or degrading, ensuring reliable performance throughout the reballing process.
- Compatibility: Optimized for a range of BGA components used in electronic devices, making it an excellent choice for technicians specializing in electronic device repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to assist in proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to help technicians effectively utilize the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians focusing on reballing BGA components in various electronic devices.
- Applications: Best suited for reballing processors and critical BGA components, ensuring high-quality and accurate repairs across a range of electronic devices.
The AMAOE Stencil DM-13/13Mini is specifically designed to provide technicians with a reliable tool for BGA reballing in various electronic applications.
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