Key Features
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- 24 Hours return window policy
- Precision stencil designed for reballing OV-series IC chips.
- Ensures accurate soldering alignment for efficient repair processes.
- Crafted from high-quality, durable materials for long-lasting use.
- Compatible with a variety of OV chip models for versatile applications.
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The AMAOE Stencil OV3 is expertly crafted for professionals in the electronics repair and PCB assembly industries, specifically designed for use with OV (OmniVision) series components. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
The OV3 stencil is constructed from premium stainless steel, ensuring it withstands the rigors of daily use while maintaining its structural integrity. This robust design provides long-lasting durability, making it a vital component in any professional workspace.Precision Laser-Cut Openings
Featuring finely laser-cut openings, the OV3 stencil facilitates the accurate application of solder paste, ensuring optimal alignment for OV series components. This meticulous design guarantees high-quality results in microelectronics repair and assembly.Versatile Applications
Ideal for a wide range of tasks, including smartphone camera repairs, PCB rework, and intricate electronic work involving OV components, the OV3 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across various technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the OV3 stencil features an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to perform complex tasks with ease and accuracy.Lightweight and Portable
The OV3 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring precision work is always within reach.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for diverse applications in electronics repair.
Enhance your repair capabilities with the AMAOE Stencil OV3. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in OV series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | OV3 |
| Seller SKU: | Nikita-828 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil OV3 Specifications
Product Overview
- Model: AMAOE OV3 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV3 is specifically designed for precise reballing of BGA (Ball Grid Array) chips, commonly used in mobile devices, tablets, and other electronics. This stencil provides exceptional accuracy for solder ball placement, critical for high-quality repair and rework of chipsets.
- Material: Premium stainless steel, ensuring durability and corrosion resistance for long-term professional use.
- Thickness: 0.12MM, providing accuracy and control in the reballing process.
- Dimensions: Compact and easy to handle, fits seamlessly into electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ensuring reliability during soldering tasks.
- Compatibility: Designed for specific BGA chips, compatible with a wide range of mobile devices and other electronics.
Included Accessories
- Alignment Frame (Optional): Some packages may include an alignment frame to facilitate the precise positioning of solder balls.
- User Guide: Detailed instructions for optimal use, ensuring effective and safe reballing with the stencil.
Usage
- Best Suited For: Electronics repair professionals who specialize in BGA chip reballing, particularly for mobile devices and tablets. This stencil ensures precision and efficiency in reballing, essential for reliable chipset repairs.
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