Mobile Doctor Tool HuB
AMAOE Stencil U-QSU1
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹155 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Reusable: Designed for multiple uses, allowing for extended service life and cost-effective usage in professional environments.
- Improved Efficiency: Reduces rework and soldering time by ensuring consistent, uniform paste application.
- Excellent Heat Resistance: Built to withstand high soldering temperatures, maintaining its shape and functionality during rework processes.
- Precision stencil designed for efficient reballing of Qualcomm Snapdragon U-series IC chips.
- Compatible with multiple QSU chip models for versatile applications.
- Made from high-quality, durable materials to ensure longevity.
- Facilitates accurate soldering alignment for professional-grade repair efficiency.
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The AMAOE Stencil U-QSU1 is expertly designed for professionals in the electronics repair and PCB assembly industries, providing exceptional accuracy and reliability. This high-quality stencil is an essential tool for achieving precise applications in intricate microelectronic tasks, making it invaluable for technicians and engineers.
Key Features:
Premium Stainless Steel Construction
Crafted from high-grade stainless steel, the U-QSU1 stencil is built to withstand rigorous daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a crucial tool in any professional environment.Precision Laser-Cut Openings
The U-QSU1 features finely laser-cut openings that enable the accurate application of solder paste, adhesives, and flux. This meticulous design guarantees optimal alignment and high-quality results in PCB assembly and microelectronics repair.Versatile Applications
Ideal for a variety of tasks, including smartphone repairs, PCB rework, and detailed electronic work, the U-QSU1 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across diverse technical fields.Ergonomic and User-Friendly Design
The U-QSU1 stencil is designed with user comfort in mind, featuring an ergonomic shape that simplifies handling and precise alignment. Its intuitive layout allows technicians of all skill levels to perform complex tasks with ease and minimal errors.Lightweight and Portable
The U-QSU1 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who need a reliable tool that can be used in various locations, ensuring that precision work is always within reach.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste, flux, and adhesives, making it suitable for numerous repair and assembly processes. This flexibility enhances its usability for multiple applications in electronics repair.
Elevate your precision in repair tasks with the AMAOE Stencil U-QSU1. Combining durability, accuracy, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSU1 |
| Seller SKU: | Nikita-821 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSU1 Specifications
Product Overview
- Model: AMAOE U-QSU1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU1 is designed for BGA (Ball Grid Array) reballing applications, providing a critical tool for electronics repair technicians. It enables precise alignment and accurate placement of solder balls on various chips, ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Designed to withstand temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for a wide range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU1 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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