Mobile Doctor Tool HuB
AMAOE Stencil Mi7
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Reusable: Designed for multiple uses, this stencil provides excellent value for money by maintaining its integrity through various repair sessions.
- Improved Repair Efficiency: Reduces the time and effort needed for repairs, helping technicians work more efficiently and effectively.
- Excellent Heat Resistance: Withstands high temperatures during the reflow soldering process, making it perfect for use in demanding electronics repair tasks.
- High-precision stencil for reballing Mi7-series IC chips.
- Provides accurate alignment for flawless soldering results.
- Durable design for extended use and reliability.
- Compatible with various Mi7 chip models, enhancing versatility.
Frequently Bought Together
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The AMAOE Stencil Mi7 is a high-performance stencil meticulously designed for professionals engaged in electronics repair and PCB assembly. Tailored specifically for Mi series components, this essential tool enhances accuracy and efficiency in complex microelectronic tasks, making it a critical asset for technicians and engineers alike.
Key Features:
Premium Stainless Steel Construction
The Mi7 stencil is constructed from high-quality stainless steel, ensuring exceptional durability and resistance to wear. This robust design guarantees reliable performance and longevity, making it ideal for frequent use in demanding professional environments.Precision Laser-Cut Openings
Equipped with precisely laser-cut openings, the Mi7 stencil allows for accurate solder paste application, ensuring perfect alignment for Mi series components. This precision is vital for achieving top-notch results in microelectronics repair and assembly.Versatile Applications
The Mi7 stencil is suitable for a wide range of tasks, including component installations, PCB rework, and electronic assembly. Its versatility makes it an indispensable tool for professionals across various technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the Mi7 stencil features an ergonomic shape that facilitates easy handling and precise alignment. Its intuitive layout empowers technicians of all skill levels to perform complex tasks efficiently and accurately.Lightweight and Portable
The Mi7 stencil is lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who need a reliable tool that can be used in different locations, ensuring that precision work is always accessible.Compatible with Various Materials
The Mi7 stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for diverse repair and assembly processes. This flexibility ensures it meets the needs of various applications in electronics repair.
Enhance your repair capabilities with the AMAOE Stencil Mi7. Merging durability, precision, and a user-friendly design, this stencil is the perfect solution for professionals aiming for exceptional results in Mi series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Mi7 |
| Seller SKU: | Nikita-853 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil Mi7 Specifications
Product Overview
- Model: AMAOE Stencil Mi7
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the precise reballing of BGA (Ball Grid Array) chips, specifically tailored for Mi7 devices and compatible electronics.
- Material: High-grade stainless steel for exceptional durability and thermal resistance.
- Thickness: 0.12MM, ideal for precision applications.
- Dimensions: Compact and lightweight, making it easy to handle and integrate into various repair setups.
- Heat Resistance: Engineered to withstand high temperatures commonly encountered during the reballing process.
- Compatibility: Specifically designed for BGA reballing of chips used in Mi7 devices and other similar electronic components.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to aid in precise solder ball placement and alignment.
- User Manual: Comes with an instructional guide for setup and operation, ensuring ease of use for both beginners and experienced technicians.
Usage
- Target Audience: Ideal for professional repair technicians and hobbyists engaged in electronics repair, focusing on chip-level work.
- Application Focus: Best suited for reballing BGA chips in Mi7 devices, ensuring high precision and reliability.
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