Key Features
- Get an Extra 5% Discount on UPI Prepaid Payments
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- 24 Hours return window policy
- Precision stencil tailored for efficient reballing of Qualcomm Snapdragon U-series IC chips.
- Compatible with various QSU chip models, ensuring versatile applications.
- Constructed from high-quality, durable materials for long-lasting reliability.
- Provides accurate soldering alignment to enhance repair quality and efficiency.
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The AMAOE Stencil U-QSU3 is expertly designed for professionals in the electronics repair and PCB assembly industries, delivering exceptional accuracy and reliability. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it invaluable for technicians and engineers alike.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the U-QSU3 stencil is built to withstand the rigors of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a critical component in any professional workspace.Precision Laser-Cut Openings
The U-QSU3 features finely laser-cut openings that facilitate the accurate application of solder paste, adhesives, and flux. This meticulous design guarantees optimal alignment and high-quality results in PCB assembly and microelectronics repair.Versatile Applications
Ideal for various tasks, including smartphone repairs, PCB rework, and detailed electronic work, the U-QSU3 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across diverse technical fields.Ergonomic and User-Friendly Design
The U-QSU3 stencil is designed with user comfort in mind, featuring an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and accuracy.Lightweight and Portable
Designed for mobility, the U-QSU3 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring that precision work is always accessible.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste, flux, and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.
Elevate your repair capabilities with the AMAOE Stencil U-QSU3. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSU3 |
| Seller SKU: | Nikita-823 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSU3 Specifications
Product Overview
- Model: AMAOE U-QSU3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU3 is specifically designed for BGA (Ball Grid Array) reballing applications. It is an essential tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on various chips, thus enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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