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AMAOE Stencil SAMSUNG E883SP
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Precision Design: Specially crafted for Samsung E883SP chipsets, ensuring accurate alignment and reliable results.
- High-Quality Material: Made from durable and heat-resistant steel for long-lasting use and resistance to warping.
- Easy Reballing Process: Streamlines the soldering and reballing process, saving time and effort during chip repairs.
- Universal Compatibility: Compatible with various rework stations, offering flexibility in different repair setups.
- Fine Mesh Apertures: Precisely cut mesh for consistent solder deposition, reducing the risk of errors.
- User-Friendly Design: Lightweight and easy to handle, making it suitable for professionals and beginners alike.
- Versatile Application: Ideal for repairing or reballing Samsung E883SP ICs in smartphones and other devices.
Frequently Bought Together
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Elevate your repair capabilities with the AMAOE Stencil SAMSUNG E8835P, a critical tool designed for electronics technicians and DIY enthusiasts. This high-quality stencil simplifies the process of soldering and reworking components on the SAMSUNG E8835P, ensuring precision and reliability in every application.
Key Features:
Durable Material
Crafted from high-grade stainless steel, the AMAOE stencil is built to last. Its robust construction ensures resistance to wear and tear, making it a reliable choice for repeated use in various repair tasks.Precision Cut Design
Engineered for accuracy, the stencil features precisely cut openings that align perfectly with the specifications of the SAMSUNG E8835P. This attention to detail minimizes the risk of misalignment during soldering, leading to better overall repair quality.User-Friendly Application
The lightweight and easy-to-handle design of the stencil allows for seamless application. Whether you're a seasoned professional or a beginner, you can achieve optimal results with minimal effort.Versatile Functionality
Ideal for a range of repair scenarios, the AMAOE stencil is particularly effective for soldering BGA components and performing circuit board rework. Its versatility makes it an essential tool for anyone working with SAMSUNG devices.Streamlined Workflow
By facilitating precise solder paste application, this stencil helps speed up the repair process, allowing you to focus on getting the job done efficiently and effectively.Portable and Compact
Its compact design means you can easily store the AMAOE stencil in your repair kit and take it wherever needed. Keep it handy for quick access during projects and repairs.
Transform your repair process with the AMAOE Stencil SAMSUNG E8835P. Achieve exceptional accuracy and quality in your electronic repairs, ensuring that your devices perform optimally.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | SAMSUNG E883SP |
| Seller SKU: | Nikita-899 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil Samsung E8835SP Specifications
Product Overview:
- Model: AMAOE Stencil E8835SP
- Type: High-Precision BGA Reballing Stencil
- Application: Specifically designed for reballing BGA chips used in various Samsung devices, particularly for the E8835SP model.
Key Features:
- Premium Stainless Steel Construction: Crafted from high-quality stainless steel, ensuring durability and resistance to corrosion and thermal damage.
- Laser-Cut Precision: Features laser-cut openings for accurate alignment, which ensures consistent and precise solder ball placement during the reballing process.
- Standard Thickness: Designed with a thickness of 0.15MM, striking a balance between flexibility and robustness for optimal solder ball application.
- High Heat Resistance: Engineered to withstand the elevated temperatures associated with the reballing process, ensuring reliability and longevity.
- Compatibility: Tailored for Samsung E8835SP BGA components, making it an excellent choice for technicians focusing on repairs for Samsung devices.
Specifications:
- Material: Premium-grade stainless steel that is resistant to corrosion and thermal damage for extended usage.
- Thickness: 0.15MM, which provides a good balance between rigidity and flexibility, suitable for multiple reballing cycles.
- Dimensions: Compact design to fit standard reballing equipment, enhancing usability in repair processes.
- Heat Resistance: Capable of withstanding elevated temperatures encountered during soldering without warping or degrading.
- Target Devices: Optimized for Samsung E8835SP processors and various BGA chips, ensuring precise fitting for effective repairs.
Included Components:
- Stencil Holder (Optional): An optional holder may be included to facilitate proper alignment of the stencil during the reballing process.
- User Manual: A detailed guide is provided to assist technicians in effectively utilizing the stencil for BGA reballing.
Usage:
- Target Audience: Ideal for professional repair technicians specializing in Samsung device repairs.
- Applications: Best suited for reballing Samsung processors and other critical BGA components, ensuring high-quality and accurate repairs for Samsung smartphones and tablets.
The AMAOE Stencil E8835SP is designed to provide technicians with the tools needed for efficient and effective reballing of BGA chips, particularly in Samsung devices.
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