Key Features
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- Precision stencil specifically designed for reballing Qualcomm Snapdragon IC chips.
- Compatible with various QSD chip models for versatile applications.
- Made from durable materials for enhanced longevity and performance.
- Ensures accurate soldering alignment for efficient and professional repairs.
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The AMAOE Stencil U-QSD2 is engineered for those who require exceptional precision and reliability in microelectronic repairs, PCB assembly, and other intricate technical work. Its advanced design ensures consistent, high-quality results, making it an indispensable tool for professionals in the electronics industry and skilled technicians.
Key Features:
Durable Stainless Steel Build
Constructed from premium stainless steel, the U-QSD2 stencil is built to last. Its rugged design offers excellent resistance to wear and deformation, ensuring long-term durability even in demanding technical environments.Precision Laser-Cut Openings
The U-QSD2 stencil is equipped with precisely laser-cut openings, allowing for exact application of solder paste and other materials. This level of accuracy is crucial for tasks involving fine electronic components and detailed circuitry, where precision is paramount.Versatile Application Range
The U-QSD2 is perfect for a wide variety of tasks, including PCB assembly, micro-soldering, and mobile phone repairs. Its versatility ensures it meets the needs of professionals working across different technical fields, from electronics to telecommunications.User-Friendly and Ergonomic Design
Designed for ease of use, the U-QSD2 stencil features an ergonomic layout that simplifies alignment and minimizes errors. Its intuitive design allows both professionals and less experienced users to achieve flawless results without hassle.Portable and Lightweight for Convenience
With a compact and lightweight design, the U-QSD2 is ideal for technicians who require mobility. Its portability makes it easy to transport and use in various work settings, whether in the lab or in the field.Compatible with Various Materials
The U-QSD2 stencil is compatible with a variety of materials, including solder paste, adhesives, and flux, offering flexibility for different repair processes and applications. This makes it a reliable tool for diverse electronic repair and assembly tasks.
Achieve precise and professional results with the AMAOE Stencil U-QSD2. Whether you’re working on delicate PCB components or conducting advanced microelectronic repairs, this stencil delivers the high accuracy and durability you need for success.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD2 |
| Seller SKU: | Nikita-811 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD2 Specifications
Product Overview
- Model: AMAOE U-QSD2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD2 is specifically designed for BGA (Ball Grid Array) reballing applications. It is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, ideal for various high-temperature soldering tasks.
- Compatibility: Suitable for a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD2 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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