Mobile Doctor Tool HuB
AMAOE Stencil OV1
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Durable Stainless Steel Construction: Made from high-quality stainless steel, providing long-lasting durability and resistance to wear.
- Excellent Heat Resistance: Capable of withstanding high temperatures during soldering, ensuring consistent performance.
- Efficient Soldering: Helps reduce soldering time by providing precise and uniform paste deposition.
- Precision stencil tailored for reballing OV-series IC chips.
- Ensures accurate alignment for efficient and high-quality soldering.
- Made from durable materials for extended usability and performance.
- Compatible with multiple OV chip models for versatile repair tasks.
Frequently Bought Together
The AMAOE Stencil OV1 is meticulously designed for professionals in the electronics repair and PCB assembly industries, specifically tailored for applications involving OV (OmniVision) series components. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the OV1 stencil is built to withstand the rigors of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a critical component in any professional workspace.Precision Laser-Cut Openings
The OV1 features finely laser-cut openings that facilitate the accurate application of solder paste, ensuring optimal alignment for OV series components. This meticulous design guarantees high-quality results in microelectronics repair and assembly.Versatile Applications
Ideal for a variety of tasks, including smartphone camera repairs, PCB rework, and detailed electronic work involving OV components, the OV1 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across diverse technical fields.Ergonomic and User-Friendly Design
The OV1 stencil is designed with user comfort in mind, featuring an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and accuracy.Lightweight and Portable
Designed for mobility, the OV1 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring that precision work is always accessible.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.
Elevate your repair capabilities with the AMAOE Stencil OV1. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in OV series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | OV1 |
| Seller SKU: | Nikita-827 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil OV1 Specifications
Product Overview
- Model: AMAOE OV1 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV1 is designed for the reballing of specific BGA chips in electronics repair, particularly focusing on chipsets used in mobile devices. It ensures accurate alignment and placement of solder balls, which is essential for achieving high-quality repairs and rework.
- Material: High-grade stainless steel, ensuring strength and resistance to rust and wear.
- Thickness: 0.12MM for optimal precision in solder ball placement.
- Dimensions: Compact and portable, designed to fit perfectly into electronics repair workstations.
- Heat Resistance: Withstands temperatures up to 500°C, supporting intensive reballing operations.
- Compatibility: Suitable for specific BGA chips used in various mobile devices, including smartphones and tablets.
Included Accessories
- Optional Alignment Frame: Some variants may include an alignment frame to assist in precise solder ball placement.
- User Instructions: Comprehensive guide to ensure proper usage and maintenance, optimizing the stencil's performance.
Usage
- Target Users: Professional electronics repair technicians, particularly those specializing in mobile device BGA chip reballing. This stencil is essential for achieving precision in repairs involving chipsets used in smartphones and tablets.
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