Mobile Doctor Tool HuB
AMAOE Stencil OV5
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Universal Compatibility: Works seamlessly with a wide range of OV5 components, offering versatility for different repair and assembly tasks.
- Smooth Surface: Features a smooth finish that promotes even distribution of solder paste, minimizing defects during assembly.
- Superior Heat Resistance: Capable of withstanding high temperatures, perfect for reflow soldering processes.
- Precision stencil designed for reballing OV5-series IC chips.
- Ensures accurate alignment for efficient soldering and repairs.
- Made from durable, high-quality materials for extended use.
- Compatible with multiple OV5 chip models for versatile applications.
Frequently Bought Together
The AMAOE Stencil OV5 is meticulously designed for professionals in the electronics repair and PCB assembly industries, specifically tailored for use with OV (OmniVision) series components. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an indispensable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the OV5 stencil is engineered to withstand the rigors of daily use while retaining its structural integrity. Its robust design ensures long-lasting durability, making it a crucial component in any professional workspace.Precision Laser-Cut Openings
The OV5 features meticulously laser-cut openings that facilitate the accurate application of solder paste, ensuring optimal alignment for OV series components. This precision guarantees high-quality results in microelectronics repair and assembly.Versatile Applications
Ideal for a range of tasks, including smartphone camera repairs, PCB rework, and detailed electronic work involving OV components, the OV5 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across diverse technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the OV5 stencil boasts an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to perform complex tasks with ease and accuracy.Lightweight and Portable
The OV5 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring precision work is always accessible.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.
Enhance your repair capabilities with the AMAOE Stencil OV5. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in OV series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | OV5 |
| Seller SKU: | Nikita-830 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil OV5 Specifications
Product Overview
- Model: AMAOE OV5 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV5 is expertly designed for reballing BGA (Ball Grid Array) chips found in a variety of electronic devices, particularly smartphones and tablets. This stencil ensures precise solder ball placement, crucial for maintaining the performance and reliability of repaired components.
- Material: High-grade stainless steel for durability and long-lasting performance.
- Thickness: 0.12MM, providing the precision needed for effective solder ball placement.
- Dimensions: Compact design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Withstands temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for a variety of BGA chipsets used in mobile electronics, meeting the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to aid in precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, optimizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
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