Mobile Doctor Tool HuB
AMAOE Stencil U-QSD8
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Improved Soldering Accuracy: The stencil’s design promotes accurate paste deposits, reducing the chances of soldering defects like bridging or insufficient solder.
- Reusable and Easy to Clean: Designed for multiple uses, it can be easily cleaned, making it a cost-effective and efficient tool for repair technicians.
- Enhanced Repair Quality: The stencil ensures a higher-quality soldering process, leading to improved repair results and longevity for the serviced device.
- Precision stencil designed for efficient reballing of Qualcomm Snapdragon IC chips.
- Compatible with a wide range of QSD chip models for versatility.
- Made from durable, high-quality materials for long-lasting performance.
- Ensures accurate soldering alignment for professional-grade repairs.
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The AMAOE Stencil U-QSD8 is expertly engineered for professionals in the electronics repair and PCB assembly industries, providing unmatched accuracy and reliability. This high-quality stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an indispensable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Crafted from premium stainless steel, the U-QSD8 stencil is designed to withstand the demands of everyday use while maintaining its structural integrity. Its durable construction ensures longevity, making it a crucial tool for professional environments.Precision Laser-Cut Openings
The U-QSD8 features finely laser-cut openings that allow for the accurate application of solder paste, adhesives, and flux. This level of precision is essential for achieving optimal alignment and quality in PCB assembly and microelectronics repair.Versatile for Various Applications
Ideal for a wide range of tasks, including smartphone repairs, PCB rework, and other detailed electronic work, the U-QSD8 stencil is highly versatile. Its adaptability makes it a valuable tool for professionals across diverse technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the U-QSD8 stencil features an ergonomic shape that simplifies handling and precise alignment. Its intuitive design allows technicians of all skill levels to perform complex tasks with ease and minimal errors.Lightweight and Portable
The U-QSD8 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who need a reliable tool that can be used in various locations, ensuring that precision work is always within reach.Compatible with a Range of Materials
This stencil is compatible with various materials, including solder paste, flux, and adhesives, making it suitable for a wide array of repair and assembly processes. This flexibility enhances its usability for multiple applications in electronics repair.
Elevate your precision in repair tasks with the AMAOE Stencil U-QSD8. Combining durability, accuracy, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD8 |
| Seller SKU: | Nikita-817 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD8 Specifications
Product Overview
- Model: AMAOE U-QSD8
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD8 is specifically designed for BGA (Ball Grid Array) reballing applications. This high-quality stencil is essential for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, providing precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD8 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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