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AMAOE Stencil OV4
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Reusability and Cost-Effectiveness: Designed for multiple uses, this stencil offers a cost-effective solution by providing excellent performance over repeated applications.
- Enhanced Soldering Accuracy: The stencil’s fine apertures allow for precise and even solder paste application, reducing the chances of defects such as solder bridging or insufficient soldering.
- Versatile Compatibility: This stencil is compatible with a range of devices, making it suitable for use in various micro-repair and reballing processes across different components.
- Precision stencil crafted for reballing OV-series IC chips.
- Ensures perfect alignment for accurate and efficient soldering.
- Made from high-quality, durable materials for long-lasting use.
- Compatible with various OV chip models for versatile reballing tasks.
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The AMAOE Stencil OV4 is expertly crafted for professionals in the electronics repair and PCB assembly industries, specifically designed for use with OV (OmniVision) series components. This high-performance stencil is essential for achieving precise applications in intricate microelectronic tasks, making it an invaluable tool for technicians and engineers.
Key Features:
High-Quality Stainless Steel Construction
Made from premium stainless steel, the OV4 stencil is built to endure the demands of daily use while maintaining its structural integrity. Its robust design ensures long-lasting durability, making it a vital component in any professional workspace.Precision Laser-Cut Openings
The OV4 features finely laser-cut openings that facilitate the accurate application of solder paste, ensuring optimal alignment for OV series components. This meticulous design guarantees high-quality results in microelectronics repair and assembly.Versatile Applications
Ideal for a variety of tasks, including smartphone camera repairs, PCB rework, and detailed electronic work involving OV components, the OV4 stencil is highly versatile. Its adaptability makes it an essential tool for professionals across various technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the OV4 stencil features an ergonomic shape that enhances handling and precise alignment. Its intuitive layout allows technicians of all skill levels to execute complex tasks with ease and accuracy.Lightweight and Portable
The OV4 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who require a reliable tool that can be used in various locations, ensuring precision work is always accessible.Compatible with Various Materials
This stencil is compatible with a wide range of materials, including solder paste and adhesives, enhancing its usability for multiple repair and assembly processes. This flexibility makes it suitable for various applications in electronics repair.
Elevate your repair capabilities with the AMAOE Stencil OV4. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in OV series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | OV4 |
| Seller SKU: | Nikita-829 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil OV4 Specifications
Product Overview
- Model: AMAOE OV4 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV4 is meticulously designed for reballing BGA (Ball Grid Array) chips used in various electronic devices, especially mobile phones and tablets. This stencil guarantees high accuracy in solder ball placement, which is crucial for ensuring optimal performance and reliability in repaired components.
- Material: High-grade stainless steel, ensuring a long-lasting and corrosion-resistant stencil.
- Thickness: 0.12MM, providing precision and reliability in solder ball placement.
- Dimensions: Compact and user-friendly, easily fitting into standard electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, supporting high-temperature reballing tasks.
- Compatibility: Specifically designed for various BGA chipsets used in mobile devices, ensuring it meets the needs of modern electronics repair.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with the precise positioning of solder balls.
- Instruction Manual: Comes with a detailed user guide to ensure proper usage and maintenance, optimizing the stencil's performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing for mobile devices and tablets. This stencil aids in achieving precision and efficiency, essential for high-quality repairs.
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