Key Features
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- 24 Hours return window policy
- Precision stencil designed specifically for reballing Qualcomm Snapdragon IC chips.
- Compatible with a wide range of QSD chip models for versatility.
- Made from high-quality, durable materials for long-lasting use.
- Ensures accurate soldering alignment for efficient and professional repairs.
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The AMAOE Stencil U-QSD4 is designed to meet the high standards of precision required in advanced microelectronics and PCB repair tasks. Built for accuracy, durability, and versatility, this stencil is an essential tool for professionals who demand exacting results in their technical work.
Key Features:
Premium Stainless Steel Construction
Crafted from top-grade stainless steel, the U-QSD4 stencil is both sturdy and durable. It resists wear and maintains its shape through repeated use, ensuring long-term reliability for professionals working in demanding repair environments.Ultra-Precise Laser-Cut Openings
The U-QSD4 stencil features laser-cut openings with exceptional accuracy, allowing for precise application of solder paste, adhesives, and other materials. This level of precision is crucial for handling intricate electronic components and achieving high-quality results in PCB assembly and repair.Multi-Application Versatility
Suitable for a wide variety of repair tasks, including PCB assembly, smartphone repairs, and other fine electronic work, the U-QSD4 stencil is highly versatile. It caters to the needs of professionals across electronics, telecommunications, and manufacturing sectors.Ergonomic Design for Ease of Use
The U-QSD4 stencil is user-friendly, featuring an ergonomic design that makes alignment simple and minimizes errors. Its ease of use ensures that both experienced technicians and beginners can achieve flawless results with minimal effort.Portable and Lightweight for Flexibility
Compact and lightweight, the U-QSD4 stencil is easy to carry and store, making it ideal for technicians who work in different locations. Its portability adds convenience, ensuring that you have a precision tool available wherever your work takes you.Compatible with Multiple Materials
The U-QSD4 is compatible with a wide range of materials, including solder paste, flux, and adhesives. This flexibility allows it to be used for various technical processes, making it an indispensable tool for any electronics repair or assembly task.
Take your precision repair work to the next level with the AMAOE Stencil U-QSD4. Offering the perfect balance of durability, accuracy, and ease of use, this stencil is a reliable choice for professionals working on advanced microelectronics and PCB projects.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD4 |
| Seller SKU: | Nikita-813 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD4 Specifications
Product Overview
- Model: AMAOE U-QSD4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD4 is meticulously designed for BGA (Ball Grid Array) reballing applications. This stencil is essential for electronics repair professionals, enabling precise alignment and accurate placement of solder balls on various chips, which facilitates reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, suitable for various high-temperature soldering tasks.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD4 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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