AMAOE Stencil U-QSD8
Availability: In Stock
₹159
AMAOE Stencil U-QSD8 Specifications
Product Overview
- Model: AMAOE U-QSD8
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD8 is specifically designed for BGA (Ball Grid Array) reballing applications. This high-quality stencil is essential for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, providing precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD8 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD9
Availability: In Stock
₹159
AMAOE Stencil U-QSD9 Specifications
Product Overview
- Model: AMAOE U-QSD9
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD9 is engineered for BGA (Ball Grid Array) reballing applications. This high-performance stencil is essential for electronics repair technicians, enabling precise alignment and accurate placement of solder balls on various chips, thus ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD9 stencil is vital for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD10
Availability: In Stock
₹159
AMAOE Stencil U-QSD10 Specifications
Product Overview
- Model: AMAOE U-QSD10
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD10 is designed for BGA (Ball Grid Array) reballing applications. This stencil is essential for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, thereby facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for enhanced durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD10 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSD11
Availability: In Stock
₹159
AMAOE Stencil U-QSD11 Specifications
Product Overview
- Model: AMAOE U-QSD11
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD11 is specifically designed for BGA (Ball Grid Array) reballing applications. This stencil is crucial for electronics repair technicians, enabling precise alignment and accurate placement of solder balls on various chips, ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: Premium stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact and lightweight design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Designed to work with various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD11 stencil is vital for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU1
Availability: In Stock
₹159
AMAOE Stencil U-QSU1 Specifications
Product Overview
- Model: AMAOE U-QSU1
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU1 is designed for BGA (Ball Grid Array) reballing applications, providing a critical tool for electronics repair technicians. It enables precise alignment and accurate placement of solder balls on various chips, ensuring reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Designed to withstand temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for a wide range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU1 stencil is essential for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU2
Availability: In Stock
₹159
AMAOE Stencil U-QSU2 Specifications
Product Overview
- Model: AMAOE U-QSU2
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU2 is engineered for BGA (Ball Grid Array) reballing applications, providing essential support for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, guaranteeing reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- Instruction Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU2 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU3
Availability: In Stock
₹159
AMAOE Stencil U-QSU3 Specifications
Product Overview
- Model: AMAOE U-QSU3
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU3 is specifically designed for BGA (Ball Grid Array) reballing applications. It is an essential tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on various chips, thus enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, allowing for precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU3 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil U-QSU4
Availability: In Stock
₹159
AMAOE Stencil U-QSU4 Specifications
Product Overview
- Model: AMAOE U-QSU4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSU4 is expertly designed for BGA (Ball Grid Array) reballing applications, serving as an essential tool for electronics repair technicians. This stencil ensures precise alignment and accurate placement of solder balls on various chips, enabling reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in tight electronic spaces.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ideal for high-temperature soldering applications.
- Compatibility: Suitable for various BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSU4 stencil is crucial for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
- New
AMAOE Stencil Mi9
Availability: In Stock
₹159
AMAOE Stencil Mi9 Specifications
Product Overview
- Model: AMAOE Mi9 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil Mi9 is specifically designed for reballing BGA chips used in the Xiaomi Mi9 series. It is an essential tool for electronics repair professionals, ensuring precise alignment and accurate placement of solder balls on chips for high-quality repair and rework tasks.
- Material: High-grade stainless steel for enhanced durability and rust resistance.
- Thickness: 0.12MM, providing precision in solder ball placement.
- Dimensions: Compact and easy to handle, designed for use in delicate electronics repair environments.
- Heat Resistance: Supports soldering operations with heat tolerance up to 500°C.
- Compatibility: Specifically tailored for Xiaomi Mi9 series BGA chips.
Included Accessories
- Optional Frame: An optional alignment frame may be included to assist in precise positioning during the reballing process.
- User Manual: Detailed instructions for usage and maintenance to ensure the best performance.
Usage
- Designed for: Electronics repair professionals focusing on Xiaomi Mi9 BGA chip reballing. The AMAOE Mi9 stencil is an essential tool for achieving accurate solder ball placement during the repair of Xiaomi Mi9 devices, ensuring efficient and high-quality repairs.
- New
AMAOE Stencil NAND1
Availability: In Stock
₹159
AMAOE Stencil NAND1 Specifications
Product Overview
- Model: AMAOE NAND1 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil NAND1 is designed for the reballing of NAND chips, crucial in repair and rework tasks for smartphones, tablets, and other devices. It ensures precise alignment and solder ball placement for high-quality repairs, especially for NAND memory chips commonly used in mobile devices.
- Material: High-grade stainless steel for maximum strength and corrosion resistance.
- Thickness: 0.12MM, offering precision in handling solder balls and reballing chips.
- Dimensions: Compact, ideal for use in electronics repair workstations, ensuring easy handling during reballing.
- Heat Resistance: Withstands temperatures up to 500°C, ideal for high-temperature soldering tasks.
- Compatibility: Suitable for various NAND memory chips used in mobile devices, including smartphones and tablets.
Included Accessories
- Optional Alignment Frame: Some packages may include an alignment frame to assist with precise solder ball placement.
- User Guide: Detailed instructions to ensure proper use and maintenance of the stencil for optimal results.
Usage
- Best For: Electronics repair professionals specializing in NAND chip reballing and repairs. This stencil is an essential tool for achieving accurate solder ball placement in NAND chips, ensuring high-quality and reliable repairs in mobile devices.
- New
AMAOE Stencil OV1
Availability: In Stock
₹159
AMAOE Stencil OV1 Specifications
Product Overview
- Model: AMAOE OV1 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV1 is designed for the reballing of specific BGA chips in electronics repair, particularly focusing on chipsets used in mobile devices. It ensures accurate alignment and placement of solder balls, which is essential for achieving high-quality repairs and rework.
- Material: High-grade stainless steel, ensuring strength and resistance to rust and wear.
- Thickness: 0.12MM for optimal precision in solder ball placement.
- Dimensions: Compact and portable, designed to fit perfectly into electronics repair workstations.
- Heat Resistance: Withstands temperatures up to 500°C, supporting intensive reballing operations.
- Compatibility: Suitable for specific BGA chips used in various mobile devices, including smartphones and tablets.
Included Accessories
- Optional Alignment Frame: Some variants may include an alignment frame to assist in precise solder ball placement.
- User Instructions: Comprehensive guide to ensure proper usage and maintenance, optimizing the stencil's performance.
Usage
- Target Users: Professional electronics repair technicians, particularly those specializing in mobile device BGA chip reballing. This stencil is essential for achieving precision in repairs involving chipsets used in smartphones and tablets.
- New
AMAOE Stencil OV3
Availability: In Stock
₹159
AMAOE Stencil OV3 Specifications
Product Overview
- Model: AMAOE OV3 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV3 is specifically designed for precise reballing of BGA (Ball Grid Array) chips, commonly used in mobile devices, tablets, and other electronics. This stencil provides exceptional accuracy for solder ball placement, critical for high-quality repair and rework of chipsets.
- Material: Premium stainless steel, ensuring durability and corrosion resistance for long-term professional use.
- Thickness: 0.12MM, providing accuracy and control in the reballing process.
- Dimensions: Compact and easy to handle, fits seamlessly into electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, ensuring reliability during soldering tasks.
- Compatibility: Designed for specific BGA chips, compatible with a wide range of mobile devices and other electronics.
Included Accessories
- Alignment Frame (Optional): Some packages may include an alignment frame to facilitate the precise positioning of solder balls.
- User Guide: Detailed instructions for optimal use, ensuring effective and safe reballing with the stencil.
Usage
- Best Suited For: Electronics repair professionals who specialize in BGA chip reballing, particularly for mobile devices and tablets. This stencil ensures precision and efficiency in reballing, essential for reliable chipset repairs.
- New
AMAOE Stencil OV4
Availability: In Stock
₹159
AMAOE Stencil OV4 Specifications
Product Overview
- Model: AMAOE OV4 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV4 is meticulously designed for reballing BGA (Ball Grid Array) chips used in various electronic devices, especially mobile phones and tablets. This stencil guarantees high accuracy in solder ball placement, which is crucial for ensuring optimal performance and reliability in repaired components.
- Material: High-grade stainless steel, ensuring a long-lasting and corrosion-resistant stencil.
- Thickness: 0.12MM, providing precision and reliability in solder ball placement.
- Dimensions: Compact and user-friendly, easily fitting into standard electronic repair workstations.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, supporting high-temperature reballing tasks.
- Compatibility: Specifically designed for various BGA chipsets used in mobile devices, ensuring it meets the needs of modern electronics repair.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with the precise positioning of solder balls.
- Instruction Manual: Comes with a detailed user guide to ensure proper usage and maintenance, optimizing the stencil's performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians who specialize in BGA reballing for mobile devices and tablets. This stencil aids in achieving precision and efficiency, essential for high-quality repairs.
- New
AMAOE Stencil OV5
Availability: In Stock
₹159
AMAOE Stencil OV5 Specifications
Product Overview
- Model: AMAOE OV5 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV5 is expertly designed for reballing BGA (Ball Grid Array) chips found in a variety of electronic devices, particularly smartphones and tablets. This stencil ensures precise solder ball placement, crucial for maintaining the performance and reliability of repaired components.
- Material: High-grade stainless steel for durability and long-lasting performance.
- Thickness: 0.12MM, providing the precision needed for effective solder ball placement.
- Dimensions: Compact design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Withstands temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for a variety of BGA chipsets used in mobile electronics, meeting the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to aid in precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, optimizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil OV6
Availability: In Stock
₹159
AMAOE Stencil OV6 Specifications
Product Overview
- Model: AMAOE OV6 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV6 is specifically designed for reballing BGA (Ball Grid Array) chips in electronic devices, including smartphones and tablets. It facilitates accurate solder ball placement, ensuring the reliability and performance of repaired components.
- Material: High-grade stainless steel for enhanced durability and performance.
- Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
- Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Can endure temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for a variety of BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, maximizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
- New
AMAOE Stencil OV7
Availability: In Stock
₹159
AMAOE Stencil OV7 Specifications
Product Overview
- Model: AMAOE OV7 Stencil
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil OV7 is specifically designed for reballing BGA (Ball Grid Array) chips in electronic devices, ensuring accurate and efficient solder ball placement for reliable repairs.
- Material: High-grade stainless steel for enhanced durability and performance.
- Thickness: 0.12MM, providing the precision necessary for effective solder ball placement.
- Dimensions: Compact and efficient design for easy handling and integration into electronic repair workstations.
- Heat Resistance: Can endure temperatures up to 500°C, supporting high-temperature reballing operations.
- Compatibility: Tailored for various BGA chipsets found in mobile electronics, catering to the diverse needs of repair technicians.
Included Accessories
- Optional Alignment Frame: Some models may include an alignment frame to assist with precise solder ball placement.
- User Manual: Comes with a detailed instruction manual to ensure proper usage and maintenance, maximizing performance.
Usage
- Target Audience: Ideal for professional electronics repair technicians specializing in BGA reballing for mobile devices and tablets. This stencil is essential for achieving accuracy and efficiency in high-quality repairs.
- New
