Nasan Leser Mould 12 Mini
Availability: In Stock
₹246
Nasan Leser Mould 12 Mini Specifications
Product Overview
- Model: Nasan Leser Mould 12 Mini
- Type: Mould for Screen Repair
- Purpose: Designed for technicians to aid in the screen replacement process, ensuring proper alignment and fit for various mobile devices.
Key Features
- Compact Design: The mini version is lightweight and portable, making it easy to carry and store while still providing effective support for screen repairs.
- Multiple Moulds: Includes various mould shapes and sizes to accommodate a wide range of mobile devices, including smartphones and tablets.
- High Precision: Engineered for accuracy, ensuring that screens can be properly aligned during installation, reducing the risk of misalignment and defects.
- Durable Material: Made from high-quality, heat-resistant materials that withstand the rigors of repair processes, ensuring longevity and reliability.
- User-Friendly: Simple to use, suitable for both experienced technicians and beginners, facilitating efficient screen repairs.
Specifications
- Material: High-strength plastic or aluminum (depending on the model)
- Dimensions: 15 cm x 10 cm x 3 cm (5.91 in x 3.94 in x 1.18 in)
- Weight: Approximately 300 grams (0.66 lbs)
Included Accessories
- User Manual: Instructions for proper use, maintenance, and safety tips to ensure effective screen repairs.
- Storage Case: A compact case for organizing and protecting the moulds during transport.
Usage
- Ideal for mobile repair technicians and service centers requiring reliable moulds for screen replacement tasks, providing ease of use and high-quality results in repairing mobile devices.
- New
WL Middle Layer XS To XS Max
Availability: In Stock
₹246
WL Middle Layer XS to XS Max Specifications
Product Overview
- Model: WL Middle Layer XS to XS Max
- Type: Middle Layer Replacement
- Purpose: Designed for use in mobile device repair, specifically for replacing the middle layer of iPhone XS, XS Max, and compatible models, ensuring structural integrity and functionality.
Key Features
- High-Quality Material: Made from premium materials that offer durability and resilience, ensuring long-lasting use after replacement.
- Precision Fit: Engineered for a perfect fit for iPhone XS and XS Max models, allowing for seamless installation and compatibility with other components.
- Lightweight Design: The middle layer is lightweight, contributing to the overall efficiency of the device without adding unnecessary bulk.
- Easy Installation: Designed for straightforward installation, making it accessible for both professional technicians and DIY enthusiasts.
- Thermal Management: Includes features to help manage heat dissipation, ensuring optimal performance of the device.
Specifications
- Compatibility: iPhone XS, iPhone XS Max
- Material: High-strength plastic or metal (specifics may vary based on design)
- Weight: Approximately 50 grams (0.11 lbs)
- Dimensions: Specific dimensions tailored to fit the XS and XS Max models accurately
Included Accessories
- User Manual: Instructions for installation and tips for handling to ensure a successful replacement process.
- Installation Tools: Basic tools (screwdrivers, picks, etc.) may be included to facilitate the replacement process.
Usage
- Ideal for mobile repair shops, technicians, and DIY users looking to replace the middle layer of iPhone XS and XS Max devices, restoring them to optimal condition and functionality.
- New
Sunshine G-LON SS9601K
Availability: In Stock
₹126
Sunshine G-LON SS9601K Specifications
Product Overview
- Model: Sunshine G-LON SS9601K
- Type: BGA Rework Station / Multi-functional Soldering Kit
- Purpose: Designed for professional BGA (Ball Grid Array) rework, chip soldering, and desoldering on mobile phones, tablets, and other electronic devices.
Key Features
- Multi-Functionality: Combines a variety of essential tools for soldering, desoldering, and rework, ideal for electronic repair technicians handling complex mobile repairs.
- Precision Temperature Control: Features an adjustable temperature control system to ensure accurate heating for different soldering tasks, preventing component damage.
- Integrated Vacuum Suction Pen: Includes a built-in suction pen for safe and easy handling of small components, ensuring precision during reballing and repair processes.
- High-Quality Heating Elements: Equipped with advanced heating elements for quick and even heating, reducing the risk of damaging sensitive BGA chips.
- Durable Build: Constructed from high-grade materials to withstand continuous use in professional repair environments.
Specifications
- Power Supply: AC 110V-240V, 50/60Hz
- Temperature Range: Adjustable from 100°C to 450°C (212°F to 842°F)
- Weight: Approximately 2.5 kg (5.5 lbs)
- Dimensions: 20 cm x 15 cm x 10 cm (7.87 in x 5.91 in x 3.94 in)
- Suction Pen Capacity: Integrated vacuum for lifting chips and components securely
Included Accessories
- Heating Nozzles: Various nozzles for focused airflow during soldering/desoldering.
- BGA Stencils: Compatible stencils for various chip sizes.
- Soldering Iron & Tips: High-precision soldering iron with interchangeable tips for various repair needs.
- Vacuum Suction Pen: For handling small, delicate components with care.
- Tweezers: Precision tweezers for handling chips and components.
- BGA Reballing Tools: Set of tools for efficient reballing and BGA chip repair.
Usage
- Ideal for professional mobile repair technicians working on BGA rework, soldering, and desoldering tasks, especially in mobile phones, tablets, and similar devices. The integrated suction pen and temperature control make it a versatile tool for delicate electronic repairs.
- New
AMAOE S22 SM-S901U BGA Rebailing
Availability: In Stock
₹4,271
AMAOE S22 SM-S901U BGA Reballing Kit Specifications
Product Overview
- Model: AMAOE S22 SM-S901U
- Type: BGA Reballing Kit
- Purpose: Designed for professional BGA (Ball Grid Array) reballing and repair for Samsung Galaxy S22 (Model: SM-S901U) chipsets, providing precise reballing for technicians working on microelectronic repairs.
Key Features
- High Precision Reballing: Crafted specifically for reballing the BGA chips of Samsung Galaxy S22 SM-S901U, ensuring accurate alignment and reballing of the ICs.
- Durable Materials: Made from high-quality stainless steel for long-term use and resistance to heat and corrosion during rework procedures.
- Custom Fit Stencils: Includes precise stencils tailored for the Galaxy S22 SM-S901U, ensuring perfect alignment for BGA rework and reballing tasks.
- Uniform Heat Distribution: Optimized design for even heat distribution, preventing damage to delicate components during the soldering process.
- Multiple BGA Sizes: Supports a variety of BGA chip sizes, making it versatile for different chipsets found within the Galaxy S22 series.
Specifications
- Material: High-grade stainless steel reballing stencils
- Compatibility: Samsung Galaxy S22 (SM-S901U) and compatible BGA chips
- Stencil Thickness: 0.12 mm - 0.15 mm
- Weight: Approximately 150 grams (0.33 lbs)
- Dimensions: Standard size for BGA reballing kits; stencils designed to fit perfectly on SM-S901U chipset
Included Accessories
- Reballing Stencils: Set of stencils compatible with SM-S901U chipset.
- Magnetic Jig/Frame: For secure positioning of the PCB and stencil during the reballing process.
- BGA Balls: A set of lead-free or leaded BGA solder balls for the reballing process.
- Tweezers: Precision tweezers for handling BGA balls and components.
Usage
- Perfect for mobile repair professionals and technicians who need a reliable and accurate solution for reballing Samsung Galaxy S22 SM-S901U components. This kit ensures a precise and efficient rework of damaged or misaligned BGA chips.
- New
JIA FA JF-855 Battery Remover
Availability: In Stock
₹66
JIA FA JF-855 Battery Remover Specifications
Product Overview
- Model: JIA FA JF-855
- Type: Battery Remover Tool
- Purpose: Specifically designed to aid in the safe and efficient removal of mobile phone batteries without causing damage to the phone’s internal components.
Key Features
- Durable Build: Constructed from high-quality, heat-resistant materials for long-lasting use, even under heavy-duty applications in repair shops.
- Safe Battery Removal: Designed to safely remove mobile phone batteries by prying them loose without damaging internal components such as the logic board or connectors.
- Ergonomic Design: Features a comfortable, slip-resistant handle that allows for a firm grip, making it easier for technicians to handle delicate components.
- Non-Conductive Material: The blade is made from non-conductive material, reducing the risk of short-circuits or electrical damage during battery removal.
- Heat-Resistant Tip: The tip of the tool can withstand moderate heat, making it suitable for use when heat is applied to loosen adhesive under the battery.
Specifications
- Material: Non-conductive, heat-resistant plastic and metal alloy
- Dimensions: 15 cm x 2.5 cm x 1 cm (5.91 in x 0.98 in x 0.39 in)
- Weight: Approximately 40 grams (0.09 lbs)
- Tip Width: 2 cm (0.79 in)
Included Accessories
- Protective Case: Comes with a small protective case or pouch for safe storage when not in use.
Usage
- Ideal for mobile repair technicians and DIY repair enthusiasts needing a specialized tool to safely remove batteries from smartphones and other electronic devices without causing damage.
- New
2UUL DA30 Sticker
Availability: In Stock
₹551
2UUL DA30 Sticker Specifications
Product Overview
- Model: 2UUL DA30
- Type: Adhesive Sticker for Mobile Device Repair
- Purpose: High-quality adhesive sticker for securing components such as batteries, screens, and other internal parts during mobile device repairs.
Key Features
- Strong Adhesion: Provides a strong and durable adhesive that securely holds components in place within mobile devices, ensuring a firm bond that won't easily come loose.
- Residue-Free Removal: Designed for easy removal without leaving sticky residue, making it ideal for multiple repairs without damaging components.
- Precision Cut: Custom-designed to fit perfectly for specific components, reducing the need for additional trimming or adjustments.
- Heat-Resistant: Can withstand moderate heat, which is often applied during repairs, without losing adhesive strength or melting.
- Thin and Lightweight: The ultra-thin design ensures it doesn't add bulk or interfere with the fit of internal components.
Specifications
- Material: High-quality adhesive film
- Dimensions: Varies based on specific mobile device models, typically tailored for smartphones and tablets
- Weight: Negligible, typically less than 5 grams (0.01 lbs)
- Color: Transparent or black, depending on the application
Included Accessories
- Adhesive Sheets: Includes multiple pre-cut adhesive sheets suitable for common repair tasks (quantity may vary by package).
Usage
- Ideal for mobile technicians and repair shops needing reliable adhesive solutions for securing batteries, screens, and other internal parts during device assembly and reassembly.
- New
Mijing MT Series
Availability: In Stock
₹856
Mijing MT Series Specifications
Product Overview
- Model: Mijing MT Series
- Type: Professional Motherboard Holder for Mobile Device Repair
- Purpose: Designed for securely holding motherboards and delicate components during repair, soldering, and reballing processes. Suitable for a wide variety of mobile devices, including smartphones and tablets.
Key Features
- Versatile Compatibility: Supports a wide range of mobile device motherboards, making it suitable for use with multiple brands, including iPhones, Samsung, Huawei, and more.
- Sturdy Build: Crafted from high-quality aluminum alloy, providing durability and resistance to deformation under heat, ensuring long-lasting performance.
- Precision Alignment: Adjustable clamps hold the motherboard in place, allowing for precision during repair tasks, such as soldering and IC replacement.
- Heat-Resistant Material: Designed to withstand high temperatures, making it compatible with hot air guns, soldering irons, and other heating tools used during repairs.
- Non-Slip Base: Features a non-slip rubber base that ensures stability on the workbench, minimizing movement during delicate repair tasks.
Specifications
- Material: High-quality, heat-resistant aluminum alloy
- Dimensions: 12 cm x 8 cm x 4 cm (4.72 in x 3.15 in x 1.57 in) — may vary by model within the MT series
- Weight: Approximately 300 grams (0.66 lbs)
- Color: Metallic Silver or Black (varies by specific model)
- Adjustability: Features adjustable clamps and holders to accommodate various motherboard sizes.
Included Accessories
- Adjustable Clamps: Secures different sizes of motherboards for stable repair work.
- Thermal Pads: Included for additional insulation to protect the motherboard during heating.
Usage
- Ideal for: Mobile repair professionals and technicians handling motherboard-level repairs. The Mijing MT Series provides secure positioning for tasks such as micro-soldering, reballing, and component replacement.
- New
Mijing SAM Series
Availability: In Stock
₹981
Mijing SAM Series Specifications
Product Overview
- Model: Mijing SAM Series
- Type: Professional Jig/Fixture for Mobile Device Repair
- Purpose: Designed for securing and holding Samsung mobile phone motherboards and components during soldering, reballing, and repair processes, ensuring precision and stability.
Key Features
- Universal Compatibility: Compatible with a wide range of Samsung smartphones, particularly suited for handling delicate motherboards and IC components.
- Adjustable Clamp Design: The adjustable clamps securely hold various sizes of motherboards, ensuring stability during rework and repair tasks.
- Non-Slip Base: Equipped with a non-slip rubber base that ensures stability on the workbench, preventing the jig from moving during intricate repair tasks.
- High Heat Resistance: Made from heat-resistant materials, allowing safe use with hot air guns, soldering irons, and pre-heaters without deforming or losing grip.
- Ergonomic and Compact: Lightweight and compact design makes it easy to handle and store, while providing the flexibility to maneuver for precise repairs.
Specifications
- Material: High-quality aluminum alloy with heat-resistant properties
- Dimensions: Varies by model within the SAM series, generally around 15 cm x 10 cm x 5 cm (5.91 in x 3.94 in x 1.97 in)
- Weight: Approximately 250 grams (0.55 lbs)
- Color: Silver or Black (depending on the model)
- Adjustability: Compatible with different sizes and shapes of Samsung device motherboards
Included Accessories
- Clamping Tools: Adjustable clamps to securely hold motherboards during repairs.
- Non-Slip Pads: Included for additional stability on work surfaces.
Usage
- Ideal for professional technicians and repair shops specializing in Samsung smartphone repairs. The Mijing SAM Series jig provides secure positioning of motherboards and other delicate components during soldering, reballing, and micro-soldering tasks.
- New
Mijing SNAPDRAGON
Availability: In Stock
₹611
Mijing SNAPDRAGON Specifications
Product Overview
- Model: Mijing SNAPDRAGON
- Type: Professional CPU Baseband Processor Fixture
- Purpose: Specifically designed for holding and securing Qualcomm Snapdragon CPU basebands and IC chips during the reballing, soldering, and repair processes in mobile device repairs.
Key Features
- Precision Alignment: Ensures accurate positioning of Snapdragon CPUs and basebands, allowing for precise reballing and micro-soldering tasks.
- High Heat Resistance: Constructed from durable, heat-resistant materials, making it suitable for use with hot air guns, preheaters, and soldering irons without deformation.
- Anti-Slip Base: Equipped with a non-slip base to keep the fixture steady during delicate repair processes, preventing any movement that could damage the components.
- Universal Compatibility: Compatible with a wide range of Snapdragon processor models, commonly found in modern smartphones and tablets.
- Ergonomic Design: Lightweight and compact for easy handling, making it suitable for both professional technicians and DIY repair enthusiasts.
Specifications
- Material: High-grade aluminum alloy with heat resistance
- Dimensions: 10 cm x 7 cm x 2 cm (3.94 in x 2.76 in x 0.79 in)
- Weight: Approximately 150 grams (0.33 lbs)
- Color: Metallic Silver or Black (varies by model)
- Adjustability: Accommodates various sizes and types of Snapdragon basebands and processors.
Included Accessories
- Positioning Pins: Adjustable pins to secure chips of different sizes during repair.
- Thermal Insulation Pad: Included to protect the surrounding area from heat damage.
Usage
- Ideal for mobile repair professionals working with Snapdragon-powered smartphones and tablets. The Mijing SNAPDRAGON fixture ensures stability and precision during the critical reballing and soldering processes of CPU basebands and IC chips.
- New
AMAOE Stencil AU4
Availability: In Stock
₹161
AMAOE Stencil AU4 Specifications
Product Overview
- Model: AMAOE AU4
- Type: High-Precision Reballing Stencil
- Purpose: The AMAOE Stencil AU4 is a professional-grade BGA reballing stencil, designed for precision soldering and chip reballing tasks. It is ideal for use in repairing and reworking small, delicate components, particularly in mobile phones, tablets, and other electronic devices.
- Material: High-quality stainless steel
- Thickness: 0.12 mm (offers precise hole depth for consistent solder ball sizes)
- Dimensions: Compact size for ease of use in small workspaces
- Heat Resistance: Can withstand temperatures up to 500°C, ensuring stability and durability during soldering operations.
- Compatibility: Designed for use with a wide range of mobile phone and tablet chipsets, including modern smartphones and tablets.
Included Accessories
- Support Base: Some models may include a support base for easier alignment of the stencil with the chip.
- User Manual: Instructions on proper handling, maintenance, and usage of the stencil for optimal results.
Usage
- Ideal for: Electronics repair professionals who require precision tools for BGA reballing, chip replacement, and micro-soldering tasks. The AMAOE AU4 Stencil is perfect for handling sensitive components in smartphones and tablets, ensuring accuracy and efficiency in the repair process.
This specification covers the main features and details of the AMAOE AU4 Stencil. You can modify or expand this description as needed!
- New
AMAOE Stencil AU3
Availability: In Stock
₹161
AMAOE Stencil AU3 Specifications
Product Overview
- Model: AMAOE AU3
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU3 is designed for precision chip reballing and soldering applications, particularly for mobile phones, tablets, and other compact electronic devices. It ensures accurate placement of solder balls for reworking BGA chips, making it a vital tool for professional electronics repair and rework tasks.
- Material: High-grade stainless steel for durability and heat resistance
- Thickness: 0.12 mm for accurate solder ball depth and size
- Dimensions: Compact and portable design, suitable for small electronics workspaces
- Heat Resistance: Withstands temperatures up to 500°C, providing stability during high-heat reballing processes
- Compatibility: Compatible with a variety of mobile phone and tablet chipsets, making it a versatile tool for multiple device repairs
Included Accessories
- Support Base (optional): Some packages may include a support base to help with chip alignment during the reballing process.
- User Instructions: Comes with guidelines for safe use, cleaning, and proper handling.
Usage
- Ideal for: Electronics repair technicians and professionals working on reballing and soldering BGA chips in mobile phones, tablets, and other compact devices. The AMAOE AU3 stencil offers precision, reliability, and durability for a wide range of rework and repair needs.
- New
AMAOE Stencil IPHDD 4 IN 1 0.15MM
AMAOE Stencil IPHDD 4 in 1 0.15MM Specifications
Availability: In Stock
₹161
AMAOE Stencil IPHDD 4 in 1 0.15MM Specifications
Product Overview
- Model: AMAOE IPHDD 4 in 1
- Type: High-Precision BGA Reballing Stencil (0.15MM)
- Purpose: The AMAOE IPHDD 4 in 1 Stencil is a specialized tool designed for reballing and repairing multiple components in mobile devices. With four different stencils combined into one, it is ideal for reworking chips on iPhones and other mobile devices. Its precise construction ensures accurate solder ball placement during chip repair and replacement.
Key Features
- 4-in-1 Design: Combines four individual stencils in one unit, offering versatile options for different chips and components, making it an all-in-one solution for mobile device repairs.
- Material Quality: Constructed from high-quality stainless steel, offering excellent durability, heat resistance, and resistance to corrosion.
- Precision-Cut Holes: The 0.15MM thickness ensures fine, precision-cut holes for accurate placement of solder balls, ensuring optimal alignment and efficiency during reballing.
- Compatibility: Specially designed for iPhone HDD (Hard Disk Drive) chip reballing, but also compatible with other mobile device chips.
- Heat Resistance: Can withstand high temperatures during the soldering and reballing process without warping or bending.
Specifications
- Material: Premium stainless steel
- Thickness: 0.15MM for enhanced precision in solder ball depth and placement
- Design: 4-in-1 stencil, allowing for multi-use across different chips and components
- Dimensions: Compact and easy-to-handle size for working on small electronic devices
- Heat Resistance: Up to 500°C, maintaining structural integrity during high-heat applications
- Compatibility: Ideal for use with iPhone chips and other mobile devices requiring high-precision reballing
Included Accessories
- Support Frame (optional): Some packages may include a support frame or base to assist in aligning the stencil with the chip during reballing.
- Instructions Manual: Provides detailed guidelines for use and care of the stencil.
Usage
- Ideal for: Mobile device repair technicians specializing in iPhone repairs and BGA chip reballing. The AMAOE IPHDD 4 in 1 Stencil is designed to make multi-tasking easier with its versatile and precise design, ensuring accurate results for professionals.
- New
AMAOE Stencil AU1
Availability: In Stock
₹161
AMAOE Stencil AU1 Specifications
Product Overview
- Model: AMAOE AU1
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU1 is designed for professional reballing and soldering of BGA chips, making it ideal for use in mobile phone, tablet, and other electronic device repairs. It ensures accurate placement of solder balls on chips for precise rework and repairs.
- Material: High-grade stainless steel
- Thickness: 0.12MM, providing precision in the depth and size of solder balls
- Dimensions: Compact design for ease of use in small workspaces and with delicate components
- Heat Resistance: Up to 500°C, ensuring durability during high-heat applications
- Compatibility: Designed for reballing various BGA chips used in mobile phones, tablets, and other compact electronics
Included Accessories
- Optional Support Frame: Some packages may include a base to assist in properly aligning the stencil with the chip.
- User Guide: Instructions for proper handling, care, and use of the stencil for best results in reballing tasks.
Usage
- Ideal for: Electronics repair professionals working with BGA chip reballing and soldering. The AMAOE AU1 stencil ensures precise and reliable results when repairing smartphones, tablets, and other small electronic devices.
- New
AMAOE Stencil AU2
Availability: In Stock
₹161
AMAOE Stencil AU2 Specifications
Product Overview
- Model: AMAOE AU2
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil AU2 is a professional-grade reballing tool designed for precise rework of BGA (Ball Grid Array) chips commonly found in smartphones, tablets, and other compact electronics. This stencil ensures accurate placement of solder balls, making it essential for efficient repair and reballing tasks.
- Material: High-quality stainless steel for heat and corrosion resistance
- Thickness: 0.12MM, providing precision in reballing depth and solder ball placement
- Dimensions: Compact and easy to use, designed for small electronics like smartphones and tablets
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering and reballing processes
- Compatibility: Supports various BGA chips used in mobile devices, ensuring versatility in repair applications
Included Accessories
- Optional Support Frame: Some packages may come with a support base to assist with chip alignment and handling during reballing.
- User Manual: A guide to proper handling, cleaning, and using the stencil for optimal results.
Usage
- Ideal for: Professional mobile device repair technicians and electronics specialists who work with BGA reballing. The AMAOE AU2 stencil ensures precise and efficient chip reballing, making it essential for high-quality repairs.
- New
AMAOE Stencil U-SMG1
Availability: In Stock
₹161
AMAOE Stencil U-SMG1 Specifications
Product Overview
- Model: AMAOE U-SMG1
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG1 is designed specifically for BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil facilitates precise alignment and placement of solder balls on various chips, ensuring high-quality rework on smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for long-lasting durability
- Thickness: 0.12MM, designed for precision in reballing and solder ball placement
- Dimensions: Compact size, suitable for use in tight spaces typically found in electronic devices
- Heat Resistance: Up to 500°C, allowing for high-temperature soldering applications
- Compatibility: Designed to accommodate various BGA chip sizes, enhancing its utility in electronic repairs
Included Accessories
- Support Frame (Optional): Some packages may include a support frame to assist with aligning the stencil accurately during use.
- Instruction Manual: Provides guidelines for proper usage, maintenance, and care of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-SMG1 stencil is essential for achieving accurate and reliable results in mobile device repairs and other electronic applications.
- New
AMAOE Stencil U-SMG2
Availability: In Stock
₹161
AMAOE Stencil U-SMG2 Specifications
Product Overview
- Model: AMAOE U-SMG2
- Type: High-Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-SMG2 is engineered for precision in BGA (Ball Grid Array) reballing applications, making it an essential tool for electronics repair professionals. This stencil aids in the accurate alignment and placement of solder balls on various chips, ensuring high-quality repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for enhanced durability and longevity
- Thickness: 0.12MM, providing precision in solder ball placement and depth
- Dimensions: Compact design for ease of use in tight electronic spaces
- Heat Resistance: Up to 500°C, ideal for high-temperature soldering tasks
- Compatibility: Accommodates various BGA chip sizes, making it suitable for a diverse range of electronic repairs
Included Accessories
- Optional Support Frame: Some packages may include a support frame to facilitate accurate alignment during reballing.
- User Manual: Includes instructions for proper handling, care, and usage to ensure optimal results with the stencil.
Usage
- Ideal for: Professional electronics repair technicians specializing in BGA chip reballing. The AMAOE U-SMG2 stencil is crucial for achieving accurate and reliable solder ball placement, ensuring high-quality repairs in mobile device and electronic component servicing.
- New
Repair Tools - High-Quality Tools for Every Repair Need
Explore our wide range of repair tools designed for precision and durability. Perfect for electronics, mobile phones, appliances, and more. Shop now for reliable solutions!
