Key Features
- Get an Extra 5% Discount on UPI Prepaid Payments
- Wholesaler Earn Money more with Cammission Category Grade-J
- 24 Hours return window policy
- Precision stencil for reballing Mi4-series IC chips.
- Ensures precise alignment for flawless soldering results.
- Built with durable, high-quality materials for extended use.
- Suitable for a variety of Mi4 chip models, enhancing versatility.
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The AMAOE Stencil Mi4 is a high-quality stencil meticulously crafted for professionals in the electronics repair and PCB assembly industries. Specifically designed for Mi series components, this essential tool enhances accuracy and efficiency in intricate microelectronic tasks, making it a must-have for technicians and engineers.
Key Features:
Premium Stainless Steel Construction
The Mi4 stencil is constructed from high-grade stainless steel, ensuring exceptional durability and resistance to wear. This robust design is tailored for regular use in demanding environments, offering long-lasting reliability and performance.Precision Laser-Cut Openings
Equipped with accurately laser-cut openings, the Mi4 stencil allows for precise application of solder paste, ensuring optimal alignment for Mi series components. This level of precision is vital for achieving high-quality results in microelectronics repair and assembly.Wide Range of Applications
The Mi4 stencil is versatile enough for various tasks, including component installations, PCB rework, and electronic assembly. Its adaptability makes it an essential tool for professionals across multiple technical fields.Ergonomic and User-Friendly Design
Designed with user comfort in mind, the Mi4 stencil features an ergonomic shape that facilitates easy handling and alignment. Its intuitive layout allows technicians of all skill levels to perform complex tasks efficiently and accurately.Lightweight and Portable
The Mi4 stencil is both lightweight and compact, making it easy to transport and store. This portability is ideal for technicians who require a reliable tool that can be used in various locations, ensuring that precision work is always within reach.Compatible with Various Materials
The Mi4 stencil is compatible with a wide array of materials, including solder paste and adhesives, enhancing its usability for diverse repair and assembly processes. This flexibility ensures it meets the needs of numerous applications in electronics repair.
Elevate your repair capabilities with the AMAOE Stencil Mi4. Combining durability, precision, and user-friendly design, this stencil is the ultimate solution for professionals seeking exceptional results in Mi series applications and microelectronics assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | Mi4 |
| Seller SKU: | Nikita-850 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil Mi4 Specifications
Product Overview
- Model: AMAOE Stencil Mi4
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for precise reballing of BGA components in electronics repair, ensuring accurate and efficient solder ball placement.
- Material: Premium stainless steel, designed for durability and precision.
- Thickness: 0.12MM for optimal reballing performance and solder ball placement accuracy.
- Dimensions: Compact size for easy handling and transportation in professional repair environments.
- Heat Resistance: Designed to resist high temperatures during soldering operations.
- Compatibility: Suitable for reballing BGA components in smartphones, tablets, and other electronic devices.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for more precise solder ball positioning during reballing.
- Instruction Manual: Includes a guide to assist users in setting up and using the stencil effectively.
Usage
- Target Audience: Aimed at professional electronics repair technicians, especially those involved in BGA component reballing for chip-level repairs.
- Ideal Applications: Suitable for reballing BGA chips used in mobile devices, tablets, and other small electronics requiring high precision.
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