AMAOE Stencil QU4
Availability: In Stock
₹159
AMAOE Stencil QU4 Specifications
Product Overview
- Model: AMAOE Stencil QU4
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU4 is designed for reballing BGA (Ball Grid Array) components, ensuring accurate solder ball placement essential for high-quality electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, promoting accuracy in solder ball application.
- Dimensions: Compact design for easy handling and usability in different repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, suitable for demanding soldering conditions.
- Compatibility: Designed for various BGA components, meeting the needs of electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to improve accuracy during solder ball placement.
- User Manual: Comes with a user manual providing guidelines for proper usage and maintenance, ensuring optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair professionals focusing on BGA reballing. The AMAOE Stencil QU4 is an essential tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil QU5
Availability: In Stock
₹159
AMAOE Stencil QU5 Specifications
Product Overview
- Model: AMAOE Stencil QU5
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil QU5 is specifically designed for reballing BGA (Ball Grid Array) components, ensuring precise solder ball placement essential for high-quality electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, promoting accuracy in solder ball application.
- Dimensions: Compact design for easy handling and usability in different repair scenarios.
- Heat Resistance: Capable of withstanding temperatures up to 500°C, suitable for demanding soldering conditions.
- Compatibility: Designed for various BGA components, meeting the needs of electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to improve accuracy during solder ball placement.
- User Manual: Comes with a user manual providing guidelines for proper usage and maintenance, ensuring optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair professionals focusing on BGA reballing. The AMAOE Stencil QU5 is an essential tool for achieving high-quality repairs efficiently.
- New
AMAOE Stencil QU6
Availability: In Stock
₹159
AMAOE Stencil QU6 Specifications
Product Overview
- Model: AMAOE Stencil QU6
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for reballing BGA (Ball Grid Array) components, ensuring precise placement of solder balls for optimal electrical connectivity and reliability in electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, allowing for precise solder ball placement.
- Dimensions: Compact design to facilitate easy handling and usability across various repair environments.
- Heat Resistance: Capable of enduring temperatures up to 500°C, suitable for high-temperature soldering processes.
- Compatibility: Designed for various BGA components, making it ideal for electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to aid in accurate solder ball placement during repairs.
- User Manual: Comes with a user manual detailing usage instructions and maintenance tips to ensure optimal performance and longevity.
Usage
- Target Audience: Perfect for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil QU6 is essential for achieving high-quality, efficient repairs in the electronics sector.
- New
AMAOE Stencil QU8
Availability: In Stock
₹159
AMAOE Stencil QU8 Specifications
Product Overview
- Model: AMAOE Stencil QU8
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the accurate reballing of BGA (Ball Grid Array) components, ensuring precise solder ball placement for improved electrical connections in electronic repairs.
- Material: High-grade stainless steel for enhanced durability and precision.
- Thickness: 0.15MM, ensuring accurate solder ball placement for effective repairs.
- Dimensions: Compact and ergonomic design for ease of handling in different repair environments.
- Heat Resistance: Capable of enduring temperatures up to 500°C, suitable for high-temperature soldering processes.
- Compatibility: Specifically engineered for a variety of BGA components, making it essential for electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist in achieving accurate solder ball placement during reballing.
- User Manual: Comes with a detailed user manual providing usage instructions and maintenance tips for optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil QU8 is essential for achieving high-quality, efficient repairs in the electronics industry.
- New
AMAOE Stencil RF1
Availability: In Stock
₹159
AMAOE Stencil RF1 Specifications
Product Overview
- Model: AMAOE Stencil RF1
- Type: Precision BGA Reballing Stencil
- Purpose: Specifically designed for the precise reballing of BGA (Ball Grid Array) components, ensuring accurate solder ball placement for reliable electrical connections in electronic repairs.
- Material: High-quality stainless steel for superior durability and precision.
- Thickness: 0.15MM, ensuring accurate solder ball placement for effective repairs.
- Dimensions: Compact design for easy handling and use in different repair environments.
- Heat Resistance: Capable of withstanding high temperatures suitable for reballing applications.
- Compatibility: Engineered for various BGA components, making it an essential tool for electronics repair professionals.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist in achieving accurate solder ball placement during the reballing process.
- User Manual: Comes with a detailed user manual providing usage instructions and maintenance tips for optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil RF1 is essential for achieving high-quality, efficient repairs in the electronics industry.
- New
AMAOE Stencil QU7
Availability: In Stock
₹159
AMAOE Stencil QU7 Specifications
Product Overview
- Model: AMAOE Stencil QU7
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the precise reballing of BGA (Ball Grid Array) components, ensuring optimal solder ball placement for enhanced electrical connectivity and reliability in electronic repairs.
- Material: High-grade stainless steel for enhanced longevity and precision.
- Thickness: 0.15MM, ensuring accurate solder ball placement during repairs.
- Dimensions: Compact and user-friendly design for easy handling in various repair settings.
- Heat Resistance: Capable of enduring temperatures up to 500°C, suitable for high-temperature soldering processes.
- Compatibility: Specifically designed for numerous BGA components, making it ideal for professional electronics repair technicians.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist in achieving accurate solder ball placement during the reballing process.
- User Manual: Comes with a comprehensive user manual providing usage instructions and maintenance tips to ensure optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil QU7 is essential for achieving high-quality and efficient repairs in the electronics industry.
- New
AMAOE Stencil U-QSU5
Availability: In Stock
₹159
AMAOE Stencil U-QSU5 Specifications
Product Overview
- Model: AMAOE Stencil U-QSU5
- Type: Precision BGA Reballing Stencil
- Purpose: Designed specifically for the reballing of various BGA (Ball Grid Array) components, ensuring accurate solder ball placement to facilitate reliable electrical connections in electronic devices.
- Material: High-grade stainless steel for superior durability and performance.
- Thickness: 0.15MM, providing accurate solder ball placement for effective reballing.
- Dimensions: Compact design that facilitates easy handling and usability in diverse repair environments.
- Heat Resistance: Capable of enduring high temperatures suitable for reballing applications.
- Compatibility: Engineered for various BGA components, making it an essential tool for technicians in the electronics repair field.
Included Accessories
- Optional Alignment Frame: May include an optional alignment frame to assist with achieving precise solder ball placement during the reballing process.
- User Manual: Comes with a detailed user manual that provides instructions for use and maintenance tips to ensure optimal performance.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil U-QSU5 is essential for achieving high-quality and efficient repairs in the electronics industry.
- New
AMAOE Stencil Mi2
Availability: In Stock
₹159
AMAOE Stencil Mi2 Specifications
Product Overview
- Model: AMAOE Stencil Mi2
- Type: Precision BGA Reballing Stencil
- Purpose: Specifically designed for reballing various BGA (Ball Grid Array) components in electronic devices, ensuring accurate solder ball placement for reliable connections.
- Material: High-grade stainless steel for exceptional durability and performance.
- Thickness: 0.15MM, providing precise solder ball placement and effective reballing.
- Dimensions: Compact and lightweight design for easy handling and usability in various repair settings.
- Heat Resistance: Able to endure high temperatures typically encountered during soldering processes.
- Compatibility: Engineered for a range of BGA components, essential for technicians working in the electronics repair field.
Included Accessories
- Optional Alignment Frame: May come with an optional alignment frame to assist in achieving accurate solder ball placement during the reballing process.
- User Manual: Includes a detailed user manual with usage instructions and maintenance tips to ensure optimal performance and longevity.
Usage
- Target Audience: Ideal for electronics repair technicians specializing in BGA reballing. The AMAOE Stencil Mi2 is crucial for delivering high-quality repairs in the electronics industry.
- New
AMAOE Stencil Mi3
Availability: In Stock
₹159
AMAOE Stencil Mi3 Specifications
Product Overview
- Model: AMAOE Stencil Mi3
- Type: Precision BGA Reballing Stencil
- Purpose: Tailored for accurate reballing of BGA (Ball Grid Array) components, offering precise alignment and reliable results in soldering applications.
- Material: High-quality stainless steel for superior durability and precision.
- Thickness: 0.12MM for accurate and reliable solder ball application.
- Dimensions: Compact design, easy to handle, and transport for use in professional repair settings.
- Heat Resistance: Engineered to withstand high temperatures required during soldering operations.
- Compatibility: Suitable for a variety of BGA chips used in electronics, providing flexibility for repair technicians.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for precise positioning during reballing processes.
- Instruction Manual: Comes with an instructional guide to assist users with setup and optimal usage techniques.
Usage
- Target Audience: Designed for professional electronics repair technicians focused on reballing BGA components in smartphones, tablets, and other electronic devices.
- Ideal Applications: Useful in chip-level repairs requiring high precision, such as fixing motherboards and processors in mobile devices.
- New
AMAOE Stencil Mi5
Availability: In Stock
₹159
AMAOE Stencil Mi5 Specifications
Product Overview
- Model: AMAOE Stencil Mi5
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for high-accuracy reballing of BGA (Ball Grid Array) components in electronics repair, perfect for smartphones and small electronics.
- Material: High-quality stainless steel for long-lasting use and precision.
- Thickness: 0.12MM for optimal reballing performance and accuracy.
- Dimensions: Compact and lightweight, designed for easy handling in professional repair settings.
- Heat Resistance: Capable of withstanding high temperatures required during reballing and soldering.
- Compatibility: Best suited for BGA reballing of chips found in smartphones, tablets, and other small electronics, especially Mi series devices.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for more precise solder ball positioning during use.
- Instruction Manual: Comes with a guide to help users with stencil setup and use.
Usage
- Target Audience: Ideal for professional repair technicians and DIY electronics enthusiasts working on chip-level repairs in smartphones, tablets, and other portable electronics.
- Ideal Applications: Especially suited for reballing BGA chips found in Mi series devices, ensuring precise and efficient repairs.
- New
AMAOE Stencil Mi4
Availability: In Stock
₹159
AMAOE Stencil Mi4 Specifications
Product Overview
- Model: AMAOE Stencil Mi4
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for precise reballing of BGA components in electronics repair, ensuring accurate and efficient solder ball placement.
- Material: Premium stainless steel, designed for durability and precision.
- Thickness: 0.12MM for optimal reballing performance and solder ball placement accuracy.
- Dimensions: Compact size for easy handling and transportation in professional repair environments.
- Heat Resistance: Designed to resist high temperatures during soldering operations.
- Compatibility: Suitable for reballing BGA components in smartphones, tablets, and other electronic devices.
Included Components
- Optional Frame Holder: Available with an optional alignment frame for more precise solder ball positioning during reballing.
- Instruction Manual: Includes a guide to assist users in setting up and using the stencil effectively.
Usage
- Target Audience: Aimed at professional electronics repair technicians, especially those involved in BGA component reballing for chip-level repairs.
- Ideal Applications: Suitable for reballing BGA chips used in mobile devices, tablets, and other small electronics requiring high precision.
- New
AMAOE Stencil Mi6
Availability: In Stock
₹159
AMAOE Stencil Mi6 Specifications
Product Overview
- Model: AMAOE Stencil Mi6
- Type: Precision BGA Reballing Stencil
- Purpose: Specially designed for reballing BGA (Ball Grid Array) chips in electronics repair, particularly suited for Mi6 devices and similar components.
- Material: High-quality stainless steel for longevity and resistance to high temperatures.
- Thickness: 0.12MM, providing the right balance between rigidity and flexibility for effective reballing.
- Dimensions: Compact and lightweight for ease of use in repair setups.
- Heat Resistance: Capable of handling high heat required for reballing and soldering processes.
- Compatibility: Perfect for BGA reballing of chips used in Mi6 series devices and similar electronics.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to aid in precise solder ball placement.
- User Guide: Comes with an instruction manual to guide users through the setup and operation of the stencil.
Usage
- Target Audience: Suitable for professional repair technicians and DIY enthusiasts who work on small electronic components, especially those involved in chip-level repairs.
- Application Focus: Best for reballing BGA chips in Mi6 devices, with a high degree of precision and ease of use.
- New
AMAOE Stencil Mi7
Availability: In Stock
₹159
AMAOE Stencil Mi7 Specifications
Product Overview
- Model: AMAOE Stencil Mi7
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the precise reballing of BGA (Ball Grid Array) chips, specifically tailored for Mi7 devices and compatible electronics.
- Material: High-grade stainless steel for exceptional durability and thermal resistance.
- Thickness: 0.12MM, ideal for precision applications.
- Dimensions: Compact and lightweight, making it easy to handle and integrate into various repair setups.
- Heat Resistance: Engineered to withstand high temperatures commonly encountered during the reballing process.
- Compatibility: Specifically designed for BGA reballing of chips used in Mi7 devices and other similar electronic components.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to aid in precise solder ball placement and alignment.
- User Manual: Comes with an instructional guide for setup and operation, ensuring ease of use for both beginners and experienced technicians.
Usage
- Target Audience: Ideal for professional repair technicians and hobbyists engaged in electronics repair, focusing on chip-level work.
- Application Focus: Best suited for reballing BGA chips in Mi7 devices, ensuring high precision and reliability.
- New
AMAOE Stencil Mi8
Availability: In Stock
₹159
AMAOE Stencil Mi8 Specifications
Product Overview
- Model: AMAOE Stencil Mi8
- Type: Precision BGA Reballing Stencil
- Purpose: Designed specifically for the reballing of BGA (Ball Grid Array) chips in Mi8 devices and compatible electronics.
- Material: High-grade stainless steel, chosen for its durability and thermal resistance.
- Thickness: 0.12MM, ideal for precision work.
- Dimensions: Lightweight and compact, easy to handle and integrate into various repair setups.
- Heat Resistance: Engineered to handle the high temperatures typical of reflow soldering.
- Compatibility: Specifically designed for BGA reballing of chips in Mi8 devices and other similar electronics.
Included Components
- Optional Frame Holder: Available with an optional alignment frame to assist in precise solder ball placement and alignment.
- User Manual: Comes with an instructional guide to facilitate setup and operation, catering to both beginners and experienced technicians.
Usage
- Target Audience: Perfect for professional repair technicians and electronics enthusiasts focusing on chip-level repairs.
- Application Focus: Best suited for the reballing of BGA chips in Mi8 devices, ensuring high accuracy and reliability.
- New
AMAOE Stencil RF2
Availability: In Stock
₹159
AMAOE Stencil RF2 Specifications
Product Overview
- Model: AMAOE Stencil RF2
- Type: Precision BGA Reballing Stencil
- Purpose: Specially designed for the reballing of BGA (Ball Grid Array) chips in RF (Radio Frequency) modules and components.
- Material: High-grade stainless steel to ensure long-lasting use and resistance to corrosion.
- Thickness: 0.12MM, ideal for precision reballing operations.
- Dimensions: Compact and easy to handle, designed to fit perfectly within standard reballing setups.
- Heat Resistance: Specifically engineered to tolerate the high temperatures typical of soldering and reflow processes.
- Compatibility: Designed for RF chip reballing and works with various RF modules and communication components.
Included Components
- Optional Alignment Holder: Includes an optional holder frame for easy alignment and placement of the stencil during reballing.
- User Guide: Comes with a detailed instruction manual for quick setup and efficient operation, ideal for both beginners and experienced technicians.
Usage
- Target Audience: Professional repair technicians and electronics engineers working with RF modules.
- Application Focus: Suitable for the reballing and repair of RF chips and related communication components, ensuring precise reballing with minimal errors.
- New
AMAOE Stencil SU1
Availability: In Stock
₹159
AMAOE Stencil SU1 Specifications
Product Overview
- Model: AMAOE Stencil SU1
- Type: Precision BGA Reballing Stencil
- Purpose: Designed for the reballing of BGA (Ball Grid Array) chips, specifically for certain SoC (System on Chip) and high-performance chips used in smartphones and other electronics.
- Material: Premium stainless steel for long-lasting performance and corrosion resistance.
- Thickness: 0.12MM, perfect for reballing applications requiring precision.
- Dimensions: Compact design for easy handling, suitable for most standard reballing setups.
- Heat Resistance: Engineered to withstand the elevated temperatures involved in the soldering and reflow process.
- Compatibility: Compatible with a variety of System on Chips (SoC) used in modern mobile devices, making it ideal for smartphone repair.
Included Components
- Optional Holder: An alignment holder can be included to assist with proper placement during the reballing process.
- Instruction Manual: Comes with a user guide for easy setup and use, catering to both professionals and those newer to reballing.
Usage
- Target Audience: Repair professionals, technicians, and engineers dealing with smartphone and tablet repairs.
- Applications: Suitable for reballing BGA chips, particularly SoC components in mobile devices, enhancing the efficiency and accuracy of rework.
- New
