Key Features
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- Precision stencil designed for efficient reballing of Qualcomm Snapdragon IC chips.
- Compatible with a variety of QSD chip models for versatile applications.
- Made from high-quality, durable materials for long-lasting performance.
- Ensures accurate soldering alignment for professional and efficient repairs.
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The AMAOE Stencil U-QSD6 is expertly designed for professionals in the electronics repair and PCB assembly industries, providing unparalleled accuracy and reliability. This high-quality stencil is essential for ensuring precise applications in intricate microelectronic tasks, making it a vital tool for technicians and engineers alike.
Key Features:
Robust Stainless Steel Construction
Made from premium stainless steel, the U-QSD6 stencil is built to last, resisting wear and tear from frequent use. Its durable construction ensures that it can handle the demands of professional environments, providing a long-lasting tool for all your repair needs.Laser-Cut Precision Openings
The U-QSD6 features finely laser-cut openings that allow for the precise application of solder paste, adhesives, and flux. This high level of precision is crucial for achieving optimal alignment and quality in PCB assembly and microelectronics repair.Versatile Applications
Ideal for a wide range of tasks, including smartphone repairs, PCB rework, and other detailed electronic work, the U-QSD6 stencil is highly versatile. Its adaptability makes it a valuable tool for professionals across various technical disciplines.User-Friendly Ergonomic Design
Designed with user comfort in mind, the U-QSD6 stencil features an ergonomic shape that facilitates easy handling and precise alignment. Its intuitive design allows technicians of all skill levels to perform complex tasks with confidence and minimal errors.Lightweight and Portable
The U-QSD6 is lightweight and compact, making it easy to transport and store. This portability is perfect for technicians who need a reliable tool that can be used in different locations, ensuring that precision work is always within reach.Compatible with Various Materials
This stencil is compatible with a range of materials, including solder paste, flux, and adhesives, making it suitable for various repair and assembly processes. This flexibility enhances its usability for multiple applications in electronics repair.
Elevate your repair precision with the AMAOE Stencil U-QSD6. Combining durability, precision, and user-friendly design, this stencil is the ideal solution for professionals seeking exceptional results in advanced microelectronics and PCB assembly.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | U-QSD6 |
| Seller SKU: | Nikita-815 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 12, 2024 |
AMAOE Stencil U-QSD6 Specifications
Product Overview
- Model: AMAOE U-QSD6
- Type: Precision BGA Reballing Stencil
- Purpose: The AMAOE Stencil U-QSD6 is meticulously crafted for BGA (Ball Grid Array) reballing applications. This stencil is an essential tool for electronics repair technicians, ensuring precise alignment and accurate placement of solder balls on a variety of chips, facilitating reliable repairs for smartphones, tablets, and other electronic devices.
- Material: High-quality stainless steel for durability and thermal stability.
- Thickness: 0.15MM, facilitating precision in solder ball placement and effective reballing processes.
- Dimensions: Compact design for ease of handling and use in confined electronic spaces.
- Heat Resistance: Up to 500°C, suitable for various high-temperature soldering tasks.
- Compatibility: Designed to work with a diverse range of BGA chip sizes, making it versatile for multiple electronic repair applications.
Included Accessories
- Optional Alignment Frame: Some packages may include a support frame to assist with precise alignment during the reballing process.
- User Manual: Provides essential guidelines for proper handling, usage, and maintenance of the stencil to ensure optimal performance.
Usage
- Ideal for: Electronics repair professionals specializing in BGA chip reballing. The AMAOE U-QSD6 stencil is critical for achieving precise and reliable solder ball placement, ensuring high-quality repairs in mobile device servicing and other electronic applications.
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