Mobile Doctor Tool HuB
AMAOE Stencil SU2
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₹180
Availability:
In Stock
Condition:
New
| Min Quantity | Wholesale Prices | |
|---|---|---|
| 20 | ₹140 | |
| 15 | ₹145 | |
| 10 | ₹150 | |
| 5 | ₹160 |
Affiliate Commission : ₹9.00 (5.00%)
Key Features
- Optimal Soldering Quality: The stencil's finely crafted apertures result in better solder paste distribution, preventing issues such as bridging and cold solder joints.
- Reusability: Designed for multiple uses, this stencil maintains its performance over time, offering an economical solution for repair professionals.
- Efficient Workflow: Reduces rework time by delivering consistent and high-quality soldering results, ensuring a more efficient repair process for technicians.
- High-precision stencil for SU2-series IC chip reballing.
- Ensures accurate alignment for perfect soldering.
- Made from durable, long-lasting materials.
- Compatible with a range of SU2 chip models.
Frequently Bought Together
The AMAOE Stencil SU2 is a high-precision tool designed to meet the rigorous demands of professionals in the electronics repair and assembly fields. Built for accuracy, this stencil ensures seamless solder paste application on intricate electronic components, making it an indispensable tool for technicians working on sophisticated circuit boards and small-scale electronics.
Key Features:
Premium Stainless Steel Construction
The SU2 stencil is made from high-quality stainless steel, providing excellent durability and corrosion resistance. Its robust design ensures long-lasting performance and reliable precision, making it a go-to tool for frequent use in electronics repair.Laser-Cut Accuracy
With laser-cut openings, the SU2 stencil delivers flawless precision in applying solder paste to even the smallest and most intricate components. This high degree of accuracy is crucial for creating solid, dependable solder joints in complex electronics projects.Versatile Use for Multiple Applications
Whether you're working on mobile devices, computer motherboards, or other high-density electronics, the SU2 stencil is versatile enough to handle a wide variety of tasks. It's suitable for use with a range of components, ensuring that every repair is handled with precision and care.Ergonomic and Easy to Use
Designed with ease of use in mind, the SU2 stencil is lightweight and features an intuitive design, making it suitable for technicians of all skill levels. Its user-friendly nature simplifies the process of aligning components and applying solder paste, reducing the margin for error in delicate repair tasks.Compact and Portable
Compact and easy to carry, the SU2 stencil is perfect for on-the-go repairs as well as in-shop use. Its lightweight construction makes it convenient to transport without compromising on the precision needed for high-quality repairs.Broad Compatibility
The SU2 stencil is compatible with a wide variety of solder pastes and adhesives, making it suitable for use in different repair and assembly tasks. Its flexibility ensures that technicians can achieve high precision no matter the materials used.
Experience unparalleled precision with the AMAOE Stencil SU2. Engineered for durability and accuracy, this stencil is the perfect tool for professionals seeking flawless results in advanced electronics repair and assembly tasks.
Technical Details
| Brand: | AMAOE |
|---|---|
| Model number: | SU2 |
| Seller SKU: | Nikita-857 |
| Condition: | New |
| Origin: | India |
| Availability: | In Stock |
| Minimum order quantity: | 1 |
| Shipping weight: | 500.00 g |
| Date first listed on DP MART : | Oct 13, 2024 |
AMAOE Stencil SU2 Specifications
Product Overview
- Model: AMAOE Stencil SU2
- Type: High-Precision BGA Reballing Stencil
- Application: Designed for reballing specific BGA (Ball Grid Array) chips, especially for high-performance processors and SoCs (System on Chip) used in smartphones and electronic devices.
- Material: Stainless steel for longevity and reliability in high-temperature environments.
- Thickness: 0.12MM, optimized for professional reballing tasks requiring precision and durability.
- Dimensions: Compact and easy-to-handle size, fitting standard reballing stations.
- Heat Resistance: Withstands high-temperature exposure during rework, ensuring consistent results.
- Compatibility: Compatible with specific System on Chips (SoCs) and BGA chips found in modern smartphones, tablets, and similar electronic devices.
Included Components
- Optional Alignment Holder: An alignment holder may be included for easier and more accurate positioning of the stencil during the reballing process.
- Instruction Manual: A guide is provided for easy setup and usage, suitable for professional repair technicians and those new to reballing.
Usage
- Target Audience: Professional repair technicians and electronics engineers focusing on smartphone and tablet repair.
- Applications: Specifically designed for reballing operations on BGA chips, SoCs, and other key components in modern electronics, improving repair quality and efficiency.
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